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NB6N11SMNG

Onsemi

NB6N11SMNG by Onsemi

NB6N11SMNG clock driver by Onsemi features a low propagation delay of 0.47 ns at 3.3V, with differential input conditioning and surface mount capability. Ideal for industrial applications, this chip carrier package offers 4 true outputs, operates b/w -40 to 85°C, and has a compact size of 3x3mm.

Median Price

$10.550

Lifecycle Status

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20

In-Stock Inventory

1k+

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Newark

USA . 1 parts In-Stock

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Mouser Electronics

USA . 724 parts In-Stock

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$10.550

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$7.380

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$7.060

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$6.910

724

$10.550

$7.380

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$6.910

Chip1Stop

Japan . 35 parts In-Stock

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Arrow

USA . 171 parts In-Stock

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$10.823

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$8.102

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$7.033

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$6.478

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$8.102

$7.033

$6.478

DigiKey

USA . 2,558 parts In-Stock

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$11.530

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$8.417

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$7.157

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$7.026

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$8.417

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$7.026

Master Electronics

USA . 177 parts In-Stock

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$8.310

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$6.850

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Verical

USA . 175 parts In-Stock

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$8.823

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Distributors (In-Stock)

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Nova Conductors

Japan . 25 parts In-Stock

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$8.127

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Digiode

USA . 385 parts In-Stock

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$9.975

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Flip Electronics

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IBS Electronics

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ComSIT Distribution GmbH

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Goldney Electronics S.L.

Spain . 119 parts In-Stock

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Semi Source

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North Shore Components

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Prism Electronics

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Distributors (Availability)

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Ampacity Inc.

Singapore . 362 parts In-Stock

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$1.490

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$1.490

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Semicontronic

India . 177 parts In-Stock

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$1.490

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$1.453

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$1.445

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$1.490

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Aranea Global

USA . 100 parts In-Stock

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$7.964

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$7.646

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$7.964

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Continental Prestige Electronics

USA . 4,635 parts In-Stock

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$8.127

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$7.964

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Corohmni

South Africa . 159 parts In-Stock

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$8.780

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Corphita

USA . 2,419 parts In-Stock

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$9.450

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Aztec Data Supply Inc.

USA . 4,566 parts In-Stock

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$23.390

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Microchip USA

USA . 1,087 parts In-Stock

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$31.710

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$31.480

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Lixinc

USA . 9,773 parts In-Stock

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Problanco Electronics

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SupplyDigital Components

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Argo Parts USA

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Kulean Microsystems

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TANS Electronics

Latvia . 733 parts In-Stock

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Alle Elektronik GmbH

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UHIMA Technologies

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Speed Components Ltd (Excess)

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Eastek

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GreenTree Electronics

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Overview

Enhance the performance of your electronic devices with the NB6N11SMNG clock driver & buffer by Onsemi. Known for their high-quality products, Onsemi delivers reliable solutions for a wide range of applications. This surface-mount chip carrier offers a propagation delay of just 0.47 ns, ensuring precise signal timing and synchronization. With 4 true outputs and differential input conditioning, this clock driver is perfect for industrial-grade systems requiring fast and efficient data processing. Upgrade your circuits with the NB6N11SMNG and experience the benefits of superior performance and reliability.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.47 ns

Low propagation delay ensures fast and efficient operation.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard supply voltages for easy integration.

Package Shape: SQUARE

Square package shape for efficient use of PCB space.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial applications.

No. of Terminals: 16

Sufficient number of terminals for connectivity and functionality.

Technical Specifications

Clock Drivers & Buffers NB6N11SMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

6N

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

.47 ns

Propagation Delay (tpd):

.47 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB6N11SMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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