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NB6N11SMNR2G

Onsemi

NB6N11SMNR2G by Onsemi

NB6N11SMNR2G clock driver by Onsemi features a propagation delay of 0.47 ns, operates at 3.3V, and has differential input conditioning. It is suitable for industrial applications requiring precise timing synchronization in compact spaces due to its small square package design and low propagation delay.

Median Price

$10.858

Lifecycle Status

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22

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1k+

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Arrow

USA . 1 parts In-Stock

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$6.687

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$6.687

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$6.687

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$6.687

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$6.687

Mouser Electronics

USA . 992 parts In-Stock

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$10.570

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$7.480

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$7.110

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992

$10.570

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Chip1Stop

Japan . 3,001 parts In-Stock

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$11.146

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$7.199

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$11.146

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DigiKey

USA . 1,139 parts In-Stock

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$11.170

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$7.476

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$6.810

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$6.615

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$7.476

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$6.615

Newark

USA . 3,004 parts In-Stock

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$11.510

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$7.700

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$11.510

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Verical

USA . 3,703 parts In-Stock

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$8.576

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Master Electronics

USA . 3,703 parts In-Stock

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$6.630

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Element14

Singapore . 117 parts In-Stock

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$12.050

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$11.480

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$9.740

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Digiode

USA . 2,120 parts In-Stock

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$6.353

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Nova Conductors

Japan . 15 parts In-Stock

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$8.120

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IBS Electronics

USA . 3,863 parts In-Stock

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$9.665

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Bristol Electronics

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Chip Stock

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Vyrian

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ComSIT Distribution GmbH

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Sensible Micro Corp

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Prism Electronics

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Rotakorn

Sweden . 83 parts In-Stock

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Classic Components Corporation

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Connector Distribution Corp

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Right Parts Inc.

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,207 parts In-Stock

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$5.680

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Semicontronic

India . 1,155 parts In-Stock

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$5.680

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$5.538

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$5.510

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Corphita

USA . 310 parts In-Stock

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$6.018

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Corohmni

South Africa . 351 parts In-Stock

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Advanced Electronics

New Zealand . 20 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Continental Prestige Electronics

USA . 823 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,924 parts In-Stock

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Lixinc

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Kulean Microsystems

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Problanco Electronics

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SupplyDigital Components

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TANS Electronics

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Speed Components Ltd (Excess)

Israel . 282 parts In-Stock

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Argo Parts USA

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UHIMA Technologies

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GreenTree Electronics

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Overview

Experience the superior performance of the NB6N11SMNR2G clock driver by Onsemi, a leading manufacturer in the industry. Designed for precision and reliability, this product offers ultra-low propagation delay and is ideal for differential input conditioning applications. With a compact square package style and industrial temperature grade, this clock driver ensures seamless integration and optimal functionality. Trust Onsemi to deliver high-quality solutions that meet your needs with unmatched value and efficiency. Elevate your designs with the NB6N11SMNR2G and experience the difference today.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.47 ns

Low propagation delay ensures fast and efficient signal transmission.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs.

Input Conditioning: DIFFERENTIAL

Differential input conditioning provides better noise immunity and signal integrity.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common voltage level, making it compatible with standard power supplies.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in very low temperatures, ideal for a wide range of applications.

Terminal Pitch: 0.5 mm

Compact terminal pitch allows for high-density PCB designs.

Width: 3 mm

Compact size saves space on the PCB.

Technical Specifications

Clock Drivers & Buffers NB6N11SMNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

6N

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

.47 ns

Propagation Delay (tpd):

.47 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB6N11SMNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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