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SY89221UHY-TR

Microchip Technology

SY89221UHY-TR by Microchip Technology

SY89221UHY-TR clock driver by Microchip features 1.4ns propagation delay, 15 true outputs, and 2.5V nominal voltage. Ideal for applications requiring differential mux input conditioning in industrial temperature range from -40 to 85°C.

Median Price

$17.450

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 654 parts In-Stock

1+ parts

$17.450

100+ parts

$13.210

1k+ parts

$13.210

10k+ parts

-

654

$17.450

$13.210

$13.210

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 61 parts In-Stock

1+ parts

$12.990

100+ parts

-

1k+ parts

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61

$12.990

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Vyrian

USA . 7,765 parts In-Stock

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-

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7,765

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,610 parts In-Stock

1+ parts

$1.593

100+ parts

-

1k+ parts

$1.529

10k+ parts

$1.529

5,610

$1.593

-

$1.529

$1.529

Continental Prestige Electronics

USA . 6,134 parts In-Stock

1+ parts

$12.990

100+ parts

-

1k+ parts

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10k+ parts

$12.730

6,134

$12.990

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-

$12.730

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$12.990

100+ parts

-

1k+ parts

$12.340

10k+ parts

$12.081

2,000

$12.990

-

$12.340

$12.081

AZTECH Wire

Italy . 420 parts In-Stock

1+ parts

$13.605

100+ parts

-

1k+ parts

-

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420

$13.605

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-

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Ampacity Inc.

Singapore . 420 parts In-Stock

1+ parts

$32.280

100+ parts

-

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420

$32.280

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Microchip USA

USA . 2,658 parts In-Stock

1+ parts

$36.988

100+ parts

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2,658

$36.988

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RGB Technical Solutions

Ukraine . 7,018 parts In-Stock

1+ parts

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7,018

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Argo Parts USA

USA . 3,032 parts In-Stock

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3,032

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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500

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Overview

Enhance your clock signal distribution with the SY89221UHY-TR from Microchip Technology, a leading manufacturer known for quality and reliability. This clock driver & buffer offers unmatched precision and performance in a compact package, making it ideal for a wide range of applications. With low propagation delay and high output frequency, this product ensures seamless operation in industrial settings. Trust Microchip Technology to deliver innovative solutions that elevate your designs to new heights. Upgrade your clock drivers today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and simplifying the manufacturing process.

Input Conditioning: DIFFERENTIAL MUX

The use of a differential multiplexer for input conditioning helps in reducing noise and improving signal integrity, ensuring accurate clock distribution.

Propagation Delay (tpd): 1.4 ns

With a low propagation delay of 1.4 ns, this clock driver ensures fast and precise signal distribution within the circuit.

Temperature Grade: INDUSTRIAL

The industrial temperature grade design makes this clock driver suitable for operation in harsh environmental conditions, providing reliability and stability.

Minimum fmax: 2000 MHz

The high minimum operating frequency of 2000 MHz enables this clock driver to support high-speed applications, making it a reliable choice for demanding circuit designs.

Technical Specifications

Clock Drivers & Buffers SY89221UHY-TR attributes and parameters. Explore more Clock Drivers & Buffers devices from Microchip Technology

Specs

Additional Features:

CAN ALSO OPERATE WITH 3.3V SUPPLY

Family:

89221

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

64

No. of True Outputs:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Packing Method:

TR

Propagation Delay (tpd):

1.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Minimum fmax:

2000 MHz

Trade Compliance

SY89221UHY-TR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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