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NB6N239SMN

Onsemi

NB6N239SMN by Onsemi

NB6N239SMN clock driver by Onsemi features a low propagation delay of 0.78 ns, suitable for industrial applications. With 16 terminals and differential input conditioning, it operates at a nominal voltage of 3.3V. This surface-mount chip carrier supports peak reflow temperatures up to 235 °C.

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3

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1k+

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Vyrian

USA . 6,296 parts In-Stock

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Digiode

USA . 827 parts In-Stock

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Semtec, LLC

USA . 13 parts In-Stock

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AZTECH Wire

Italy . 1,040 parts In-Stock

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Component Stockers USA

USA . 662 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 8,548 parts In-Stock

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Problanco Electronics

Mexico . 6,225 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

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Kulean Microsystems

USA . 2,786 parts In-Stock

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Corphita

USA . 2,365 parts In-Stock

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Metaverse IC Inc.

Canada . 2,199 parts In-Stock

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SupplyDigital Components

Austria . 2,089 parts In-Stock

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TANS Electronics

Latvia . 503 parts In-Stock

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UHIMA Technologies

Türkiye . 454 parts In-Stock

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Corohmni

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Overview

Experience unmatched precision and reliability with the NB6N239SMN clock driver by Onsemi. As a leader in clock drivers & buffers, Onsemi delivers exceptional quality and performance. This innovative product provides ultra-fast propagation delay, making it ideal for high-speed applications. With differential input conditioning and a wide operating temperature range, the NB6N239SMN ensures seamless operation in any environment. Trust Onsemi to deliver cutting-edge solutions that exceed your expectations. Elevate your designs with the NB6N239SMN clock driver today.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.78 ns

Low propagation delay ensures accurate timing and synchronization in clock distribution, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mount packaging allows for easy and efficient PCB assembly, saving valuable space and reducing manufacturing costs.

Input Conditioning: DIFFERENTIAL

Differential input conditioning provides noise immunity and improved signal integrity, ensuring reliable clock signal transmission in noisy environments.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard 3.3V supply voltage, this product is compatible with a wide range of electronic systems and reduces the need for additional power conversion circuits.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and operate reliably in industrial applications.

Technical Specifications

Clock Drivers & Buffers NB6N239SMN attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

6N

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.78 ns

Propagation Delay (tpd):

.78 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

NB6N239SMN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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