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CY2308SXI-3

Infineon Technologies

CY2308SXI-3 by Infineon Technologies

CY2308SXI-3 clock driver by Infineon operates at 3.3V, with 16 terminals and a max output current of 8A. It features a small outline package style, CMOS technology, and industrial temperature grade. Ideal for applications requiring precise timing control in electronic systems.

Median Price

$22.962

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 93 parts In-Stock

1+ parts

$6.140

100+ parts

-

1k+ parts

-

10k+ parts

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93

$6.140

-

-

-

Master Electronics

USA . 63 parts In-Stock

1+ parts

$25.270

100+ parts

$21.390

1k+ parts

-

10k+ parts

-

63

$25.270

$21.390

-

-

Rochester

USA . 3,299 parts In-Stock

1+ parts

-

100+ parts

$18.370

1k+ parts

$16.440

10k+ parts

$15.470

3,299

-

$18.370

$16.440

$15.470

Verical

USA . 2,728 parts In-Stock

1+ parts

-

100+ parts

$22.962

1k+ parts

$20.550

10k+ parts

$19.337

2,728

-

$22.962

$20.550

$19.337

Flip Electronics (Authorized)

USA . 1,441 parts In-Stock

1+ parts

-

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1k+ parts

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1,441

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Chip1Stop

Japan . 63 parts In-Stock

1+ parts

-

100+ parts

$25.700

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63

-

$25.700

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 710 parts In-Stock

1+ parts

$5.833

100+ parts

-

1k+ parts

-

10k+ parts

-

710

$5.833

-

-

-

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$16.580

100+ parts

-

1k+ parts

-

10k+ parts

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15

$16.580

-

-

-

Flip Electronics

USA . 1,441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,441

-

-

-

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Vyrian

USA . 627 parts In-Stock

1+ parts

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627

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IBS Electronics

USA . 63 parts In-Stock

1+ parts

-

100+ parts

$25.848

1k+ parts

-

10k+ parts

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63

-

$25.848

-

-

LIBRA Elektronik GmbH

Germany . 15 parts In-Stock

1+ parts

-

100+ parts

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15

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Prism Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 790 parts In-Stock

1+ parts

$5.220

100+ parts

-

1k+ parts

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790

$5.220

-

-

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Corphita

USA . 325 parts In-Stock

1+ parts

$5.526

100+ parts

-

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325

$5.526

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Andel Nordic

Denmark . 4,035 parts In-Stock

1+ parts

$11.400

100+ parts

-

1k+ parts

$10.944

10k+ parts

$10.944

4,035

$11.400

-

$10.944

$10.944

Modulus Dynamics

Lithuania . 1,168 parts In-Stock

1+ parts

$15.157

100+ parts

$14.551

1k+ parts

$13.944

10k+ parts

-

1,168

$15.157

$14.551

$13.944

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

$16.248

100+ parts

-

1k+ parts

$15.598

10k+ parts

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50

$16.248

-

$15.598

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Continental Prestige Electronics

USA . 6,310 parts In-Stock

1+ parts

$16.580

100+ parts

-

1k+ parts

-

10k+ parts

$16.248

6,310

$16.580

-

-

$16.248

Argo Parts USA

USA . 4,003 parts In-Stock

1+ parts

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4,003

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Glotronic Ltd.

UK . 3,700 parts In-Stock

1+ parts

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3,700

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Perfect Parts

USA . 132 parts In-Stock

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132

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Overview

Enhance the performance of your electronic devices with the CY2308SXI-3 clock driver by Infineon Technologies. Crafted from high-quality materials, this small outline package delivers precise and reliable clock distribution for a wide range of applications. From industrial automation to telecommunications, this versatile product ensures smooth operation and optimal efficiency. Trust in the expertise of Infineon Technologies to provide you with top-notch solutions that exceed expectations. Take your projects to the next level with the CY2308SXI-3 and experience unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to heat, making this product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and improving overall product reliability.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources, making integration into existing systems hassle-free.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance when disabled, reducing power consumption and improving signal integrity in complex circuit designs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this product can withstand harsh environmental conditions, making it suitable for a wide range of industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring reliable performance in digital circuits.

Technical Specifications

Clock Drivers & Buffers CY2308SXI-3 attributes and parameters. Explore more Clock Drivers & Buffers devices from Infineon Technologies

Specs

Family:

2308

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.893 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.727 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.8985 mm

Minimum fmax:

133.3 MHz

Trade Compliance

CY2308SXI-3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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