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NB2304AC1HDTG

Onsemi

NB2304AC1HDTG by Onsemi

NB2304AC1HDTG clock driver by Onsemi is a CMOS technology device with 8 terminals and 4 true outputs. It operates at a max frequency of 133.3 MHz, suitable for commercial temperature grade applications. With a small outline package style and dual terminal position, it is ideal for surface mount designs requiring standard input conditioning.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,130 parts In-Stock

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2,130

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Digiode

USA . 75 parts In-Stock

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75

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,401 parts In-Stock

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7,401

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SupplyDigital Components

Austria . 6,215 parts In-Stock

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6,215

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Kulean Microsystems

USA . 6,167 parts In-Stock

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6,167

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TANS Electronics

Latvia . 2,783 parts In-Stock

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2,783

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Corphita

USA . 808 parts In-Stock

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808

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UHIMA Technologies

Türkiye . 629 parts In-Stock

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629

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Corohmni

South Africa . 155 parts In-Stock

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Overview

Enhance your electronic designs with the NB2304AC1HDTG clock driver and buffer by Onsemi. Crafted with precision and expertise, this innovative product offers unparalleled quality and reliability. Ideal for a variety of applications in industries such as telecommunications, automotive, and industrial automation, this compact device delivers exceptional performance and efficiency. Elevate your projects with the advanced technology and superior functionality of the NB2304AC1HDTG, providing you with the value and advantage you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and reliability for long-term use.

Surface Mount: Yes

Surface mount capability allows for easy and efficient installation on PCBs.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, suitable for many applications.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures without compromising performance.

Minimum Operating Temperature: 0 °C

Capable of functioning in a wide range of temperatures, making it versatile.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Minimum fmax: 133.3 MHz

High maximum frequency allows for fast and efficient clock signal processing.

Technical Specifications

Clock Drivers & Buffers NB2304AC1HDTG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2304

Input Conditioning:

STANDARD

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Minimum fmax:

133.3 MHz

Trade Compliance

NB2304AC1HDTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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