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NB2304AC1D

Onsemi

NB2304AC1D by Onsemi

NB2304AC1D Clock Driver by Onsemi operates at 3.3V, with 4 true outputs and a max frequency of 133.3MHz. It is ideal for applications requiring precise clock signal distribution in commercial temperature environments.

Median Price

$0.647

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 461 parts In-Stock

1+ parts

-

100+ parts

$0.647

1k+ parts

$0.537

10k+ parts

$0.479

461

-

$0.647

$0.537

$0.479

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 558 parts In-Stock

1+ parts

$0.504

100+ parts

-

1k+ parts

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558

$0.504

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Vyrian

USA . 5,938 parts In-Stock

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5,938

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Distributors (Availability)

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Corphita

USA . 169 parts In-Stock

1+ parts

$0.478

100+ parts

-

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169

$0.478

-

-

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Corohmni

South Africa . 228 parts In-Stock

1+ parts

$0.531

100+ parts

-

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228

$0.531

-

-

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$9.760

100+ parts

$8.882

1k+ parts

$8.003

10k+ parts

-

500

$9.760

$8.882

$8.003

-

AZTECH Wire

Italy . 874 parts In-Stock

1+ parts

$19.190

100+ parts

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874

$19.190

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Problanco Electronics

Mexico . 8,231 parts In-Stock

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8,231

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TANS Electronics

Latvia . 3,052 parts In-Stock

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3,052

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Kulean Microsystems

USA . 1,624 parts In-Stock

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1,624

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UHIMA Technologies

Türkiye . 388 parts In-Stock

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388

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Microchip USA

USA . 296 parts In-Stock

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296

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SupplyDigital Components

Austria . 250 parts In-Stock

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250

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Overview

Boost your system's performance with the NB2304AC1D clock driver and buffer by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that guarantee reliability and efficiency. Ideal for a wide range of applications, this small outline package offers customers a cost-effective solution to their clocking needs. With a nominal supply voltage of 3.3V and 4 true outputs, the NB2304AC1D ensures seamless operation and precision timing. Upgrade your system today with this innovative product and experience the benefits of superior performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making it compatible with a wide range of applications.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, ensuring reliable performance under various conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Clock Drivers & Buffers NB2304AC1D attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2304

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Minimum fmax:

133.3 MHz

Trade Compliance

NB2304AC1D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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