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NB6L11SMNR2G

Onsemi

NB6L11SMNR2G by Onsemi

NB6L11SMNR2G clock driver by Onsemi features a low propagation delay of 0.45 ns, suitable for high-speed applications. With differential input conditioning and 2.5V nominal voltage, it is ideal for industrial temperature grade environments. This surface-mount chip carrier with quad terminals offers precise timing control in compact designs.

Median Price

$11.390

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,169 parts In-Stock

1+ parts

$11.170

100+ parts

$7.480

1k+ parts

$6.810

10k+ parts

$6.470

2,169

$11.170

$7.480

$6.810

$6.470

DigiKey

USA . 1,950 parts In-Stock

1+ parts

$11.610

100+ parts

$7.772

1k+ parts

$7.620

10k+ parts

$6.613

1,950

$11.610

$7.772

$7.620

$6.613

Flip Electronics (Authorized)

USA . 12,000 parts In-Stock

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Digiode

USA . 2,382 parts In-Stock

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$11.951

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2,382

$11.951

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Vyrian

USA . 259 parts In-Stock

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$12.580

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259

$12.580

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Flip Electronics

USA . 12,000 parts In-Stock

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Bristol Electronics

USA . 3,000 parts In-Stock

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Prism Electronics

USA . 97 parts In-Stock

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97

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Semtec, LLC

USA . 52 parts In-Stock

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52

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Distributors (Availability)

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Corphita

USA . 1,164 parts In-Stock

1+ parts

$11.322

100+ parts

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1,164

$11.322

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Component Stockers USA

USA . 2,633 parts In-Stock

1+ parts

$11.740

100+ parts

$8.780

1k+ parts

$6.660

10k+ parts

-

2,633

$11.740

$8.780

$6.660

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Corohmni

South Africa . 59 parts In-Stock

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$12.580

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59

$12.580

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Microchip USA

USA . 3,017 parts In-Stock

1+ parts

$19.216

100+ parts

$18.941

1k+ parts

$18.941

10k+ parts

$18.941

3,017

$19.216

$18.941

$18.941

$18.941

QUARKTWIN TECHNOLOGY LTD

USA . 13,621 parts In-Stock

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Perfect Parts

USA . 7,914 parts In-Stock

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SupplyDigital Components

Austria . 7,653 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,362 parts In-Stock

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Kulean Microsystems

USA . 5,674 parts In-Stock

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TANS Electronics

Latvia . 4,640 parts In-Stock

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4,640

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Metaverse IC Inc.

Canada . 2,742 parts In-Stock

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UHIMA Technologies

Türkiye . 787 parts In-Stock

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Problanco Electronics

Mexico . 295 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality NB6L11SMNR2G clock driver & buffer from Onsemi. With a propagation delay of just 0.45 ns, this surface-mount component offers precise signal conditioning and differential input for optimal performance. The compact square package shape and industrial-grade temperature range make it ideal for a wide range of applications. Trust Onsemi's expertise in clock drivers & buffers to deliver reliable solutions that enhance your projects, providing value, efficiency, and reliability every step of the way. Elevate your designs with the NB6L11SMNR2G today.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.45 ns

Low propagation delay ensures fast and efficient operation of the clock driver

Input Conditioning: Differential

Differential input conditioning provides better noise immunity and signal integrity

Minimum Operating Temperature: -40 °C

Can function reliably in harsh environments and extreme temperatures

Terminal Finish: Nickel Gold Palladium

High-quality terminal finish for durability and reliable connections

Peak Reflow Temperature: 260 C

Can withstand high reflow temperatures during assembly process

Temperature Grade: Industrial

Suitable for industrial applications where reliability and stability are crucial

Technical Specifications

Clock Drivers & Buffers NB6L11SMNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Propagation Delay At Nominal Supply:

.45 ns

Propagation Delay (tpd):

.45 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB6L11SMNR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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