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NB6L14MMNG

Onsemi

NB6L14MMNG by Onsemi

NB6L14MMNG clock driver by Onsemi features a propagation delay of 0.48 ns, differential input conditioning, and operates at a nominal voltage of 2.5V. This chip carrier with very thin profile is ideal for industrial applications requiring precise timing synchronization in temperature-sensitive environments.

Median Price

$10.815

Lifecycle Status

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16

In-Stock Inventory

1k+

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Chip1Stop

Japan . 1 parts In-Stock

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$8.660

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$8.660

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Arrow

USA . 11 parts In-Stock

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$10.343

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$8.423

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$10.343

$8.423

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Mouser Electronics

USA . 228 parts In-Stock

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$15.660

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$10.590

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228

$15.660

$10.590

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Rochester

USA . 16,233 parts In-Stock

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$9.030

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$8.080

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$7.600

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$9.030

$8.080

$7.600

DigiKey

USA . 16,233 parts In-Stock

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$11.880

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Verical

USA . 10,526 parts In-Stock

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$11.287

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$10.100

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$9.500

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$9.500

Distributors (In-Stock)

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Digiode

USA . 949 parts In-Stock

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$8.826

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$8.826

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Flip Electronics

USA . 3,936 parts In-Stock

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Vyrian

USA . 3,171 parts In-Stock

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Sensible Micro Corp

USA . 347 parts In-Stock

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Chip Stock

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Nova Conductors

Japan . 86 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 17 parts In-Stock

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Sea View Technologies

USA . 4 parts In-Stock

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Bristol Electronics

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Elcom Components

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Ampacity Inc.

Singapore . 2,997 parts In-Stock

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$7.360

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$7.360

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Semicontronic

India . 2,762 parts In-Stock

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$7.360

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$7.176

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$7.139

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$7.360

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Corphita

USA . 1,569 parts In-Stock

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$8.361

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$8.361

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Corohmni

South Africa . 125 parts In-Stock

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$9.410

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$9.410

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Aztec Data Supply Inc.

USA . 3,873 parts In-Stock

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$14.836

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$14.836

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$30.944

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$28.159

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$25.374

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$30.944

$28.159

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Microchip USA

USA . 5,880 parts In-Stock

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$44.996

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Lixinc

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SupplyDigital Components

Austria . 7,536 parts In-Stock

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Kulean Microsystems

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A-Z Elektronik GmbH

Germany . 6,267 parts In-Stock

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Perfect Parts

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Continental Prestige Electronics

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Problanco Electronics

Mexico . 2,694 parts In-Stock

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Argo Parts USA

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TANS Electronics

Latvia . 654 parts In-Stock

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Authorized Procurement Solutions

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Bastille Electronics

Australia . 450 parts In-Stock

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Kepictronics

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UHIMA Technologies

Türkiye . 169 parts In-Stock

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Emar International I/E

Canada . 107 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NB6L14MMNG clock driver and buffer by Onsemi. Known for their top-quality products, Onsemi delivers reliable solutions for a wide range of applications. With a propagation delay of just 0.48 ns, this chip carrier offers unparalleled precision and speed. Its differential input conditioning ensures optimal signal integrity, while the 16 terminals provide flexibility in connectivity. Trust Onsemi to provide cutting-edge technology that maximizes efficiency and accuracy in your designs. Elevate your projects with the NB6L14MMNG and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 0.48 ns

Low propagation delay ensures fast and efficient operation of the clock drivers and buffers.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5V ensures compatibility with a wide range of systems.

No. of Terminals: 16

Having 16 terminals allows for connectivity with multiple components in a circuit.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes the product suitable for use in various environments.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during installation.

Technical Specifications

Clock Drivers & Buffers NB6L14MMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES WITH 3.3V SUPPLY

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.48 ns

Propagation Delay (tpd):

.48 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.08 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB6L14MMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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