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NB6L11DR2

Onsemi

NB6L11DR2 by Onsemi

NB6L11DR2 clock driver by Onsemi features a propagation delay of 0.22 ns, operates at a nominal voltage of 2.5V, and has differential input conditioning. This small outline package with gull wing terminals is ideal for industrial applications requiring precise signal synchronization in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,703 parts In-Stock

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Flip Electronics

USA . 2,666 parts In-Stock

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Digiode

USA . 1,640 parts In-Stock

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1,640

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Distributors (Availability)

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Ampacity Inc.

Singapore . 790 parts In-Stock

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$3.000

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790

$3.000

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AZTECH Wire

Italy . 1,039 parts In-Stock

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$14.950

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TANS Electronics

Latvia . 7,230 parts In-Stock

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Problanco Electronics

Mexico . 6,945 parts In-Stock

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Kulean Microsystems

USA . 5,048 parts In-Stock

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Corphita

USA . 876 parts In-Stock

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SupplyDigital Components

Austria . 419 parts In-Stock

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Microchip USA

USA . 126 parts In-Stock

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Corohmni

South Africa . 111 parts In-Stock

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UHIMA Technologies

Türkiye . 42 parts In-Stock

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Overview

Unlock the power of precision and reliability with the NB6L11DR2 clock driver by Onsemi. Designed with high-quality materials and advanced technology, this product offers unmatched performance in clock distribution applications. With minimal propagation delay and differential input conditioning, the NB6L11DR2 ensures seamless signal synchronization and accurate timing. Ideal for industrial settings, this compact device provides a wide range of supply voltage options, making it versatile and adaptable to various systems. Trust Onsemi for cutting-edge solutions that deliver value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions, making the product reliable and long-lasting.

Propagation Delay At Nominal Supply: 0.22 ns

Low propagation delay ensures fast signal transmission and accurate clocking, essential for time-sensitive applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL

Differential inputs ensure better noise immunity and signal integrity, making the product suitable for high-performance applications.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard voltage level, compatible with most electronic systems and devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in various environments, including industrial settings.

Technical Specifications

Clock Drivers & Buffers NB6L11DR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

+-2.5/+-3.3

Propagation Delay At Nominal Supply:

.22 ns

Propagation Delay (tpd):

.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

NB6L11DR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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