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CY2305SXC-1

Infineon Technologies

CY2305SXC-1 by Infineon Technologies

Infineon's CY2305SXC-1 clock driver is a CMOS technology device with 8 true outputs, 3.3V supply voltage, and 8A max I (ol). It operates in commercial temperature grade range of 0 to 70°C, ideal for applications requiring precise timing control like networking equipment and communication systems.

Median Price

$3.320

Lifecycle Status

Suppliers In-Stock

56

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 345 parts In-Stock

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$3.320

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Arrow

USA . 2 parts In-Stock

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$3.334

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$2.515

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$2.386

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$3.334

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DigiKey

USA . 896 parts In-Stock

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$4.950

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$3.155

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$2.883

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$4.950

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Mouser Electronics

USA . 554 parts In-Stock

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$4.960

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$3.050

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$2.820

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Flip Electronics (Authorized)

USA . 96,780 parts In-Stock

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Verical

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Rochester

USA . 4,226 parts In-Stock

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Future Electronics

Canada . 582 parts In-Stock

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Distributors (In-Stock)

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DF Sales Co.

USA . 65 parts In-Stock

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DF Sales Co.

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Component Electronics Inc.

Canada . 996 parts In-Stock

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Freelance Electronics

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Nova Conductors

Japan . 1,000 parts In-Stock

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Digiode

USA . 86 parts In-Stock

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$2.670

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Forefront Electronics and Design

USA . 25 parts In-Stock

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$4.900

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TEDSS.com

USA . 100 parts In-Stock

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Cyclops Electronics Ltd

UK . 17,648 parts In-Stock

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Vyrian

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Chip Stock

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Flip Electronics

USA . 7,713 parts In-Stock

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Inventory MP

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Component Sense

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Classic Components Corporation

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LIBRA Elektronik GmbH

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Prism Electronics

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ACDS - Activité Composants Distribution Service

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MRC Electronics

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Mentor Electronics Marketing, LLC

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Electronics Depot

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Speed Components Ltd

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Infinite Electronics LLP

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PC Components Company LLC

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Sogenti Electronics

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Atlantic Semiconductor

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Sunrise Surplus Inc.

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Florida Circuit

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Connect4Technologies Inc.

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First Choice Components Inc.

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ECAB

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A2Z Electronics, Inc.

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Semtec, LLC

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Connector Distribution Corp

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Netroflash

USA . 500 parts In-Stock

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$2.070

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$1.966

10k+ parts

$1.925

500

$2.070

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$1.966

$1.925

Modulus Dynamics

Lithuania . 3,042 parts In-Stock

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$2.296

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$2.204

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$2.112

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3,042

$2.296

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$2.112

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Corohmni

South Africa . 550 parts In-Stock

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$2.296

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$2.296

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Semicontronic

India . 13,391 parts In-Stock

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$2.340

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$2.282

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$2.270

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13,391

$2.340

$2.282

$2.270

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Ampacity Inc.

Singapore . 13,338 parts In-Stock

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$2.340

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Corphita

USA . 215 parts In-Stock

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$2.529

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CoreStaff

Japan . 950 parts In-Stock

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$2.562

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$2.268

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$2.562

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Andel Nordic

Denmark . 3,415 parts In-Stock

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$2.637

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$2.531

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$2.531

3,415

$2.637

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$2.531

$2.531

Aztec Data Supply Inc.

USA . 4,431 parts In-Stock

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$23.146

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Component Stockers USA

USA . 294 parts In-Stock

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$99.990

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$99.990

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RC Electronics

USA . 39,577 parts In-Stock

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$2.090

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$1.910

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$1.850

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$1.910

$1.850

Perfect Parts

USA . 8,511 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,061 parts In-Stock

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Continental Prestige Electronics

USA . 5,340 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,707 parts In-Stock

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Lixinc

USA . 3,992 parts In-Stock

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Glotronic Ltd.

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Infinite Electronics LLP (Excess)

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USA . 783 parts In-Stock

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S.R.D Solutions

India . 539 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 517 parts In-Stock

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ChipTracer

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Overview

Elevate your electronic projects with the CY2305SXC-1 Clock Driver & Buffer from Infineon Technologies. This small outline package boasts high-quality construction and standard input conditioning, making it a reliable choice for a variety of applications. With 8 true outputs and a fast propagation delay of 8.7ns, this CMOS technology-driven product ensures precision timing and optimal performance. Trust in Infineon's expertise and experience to deliver top-notch products that add value to your designs. Choose the CY2305SXC-1 for seamless integration and superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Surface Mount: YES

Enables easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with a common supply voltage used in many electronic devices, making it versatile for various applications.

Propagation Delay (tpd): 8.7 ns

Provides fast signal processing speed, essential for accurate clock synchronization in high-performance systems.

Output Characteristics: 3-STATE

Allows the outputs to be in a high-impedance state when not actively transmitting signals, reducing power consumption and signal interference.

Peak Reflow Temperature °C: 260

Withstands high temperature reflow soldering processes, ensuring robust solder joints during assembly.

Technology: CMOS

Utilizes low power consumption CMOS technology, making the clock driver energy efficient and suitable for battery-powered devices.

Technical Specifications

Clock Drivers & Buffers CY2305SXC-1 attributes and parameters. Explore more Clock Drivers & Buffers devices from Infineon Technologies

Specs

Family:

2305

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.889 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

8.7 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.727 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

3.8985 mm

Minimum fmax:

133.33 MHz

Trade Compliance

CY2305SXC-1 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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