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NB3F8L3010CMNTWG

Onsemi

NB3F8L3010CMNTWG by Onsemi

NB3F8L3010CMNTWG clock driver by Onsemi features 32 terminals, operates at -40 to 85 °C, with a supply voltage range of 2.375V to 2.625V. It offers differential mux input conditioning, 10 true outputs at max frequency of 10MHz, and output characteristics in a chip carrier package for industrial applications.

Median Price

$5.088

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 282 parts In-Stock

1+ parts

$7.580

100+ parts

$4.959

1k+ parts

$4.485

10k+ parts

$4.393

282

$7.580

$4.959

$4.485

$4.393

Rochester

USA . 23,220 parts In-Stock

1+ parts

-

100+ parts

$4.070

1k+ parts

$3.640

10k+ parts

$3.420

23,220

-

$4.070

$3.640

$3.420

Verical

USA . 13,000 parts In-Stock

1+ parts

-

100+ parts

$5.088

1k+ parts

$4.550

10k+ parts

$4.275

13,000

-

$5.088

$4.550

$4.275

Flip Electronics (Authorized)

USA . 798 parts In-Stock

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798

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 999 parts In-Stock

1+ parts

$4.284

100+ parts

-

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999

$4.284

-

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Vyrian

USA . 8,225 parts In-Stock

1+ parts

-

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8,225

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Flip Electronics

USA . 7,798 parts In-Stock

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7,798

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,294 parts In-Stock

1+ parts

$3.830

100+ parts

-

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8,294

$3.830

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Corphita

USA . 2,497 parts In-Stock

1+ parts

$4.059

100+ parts

-

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2,497

$4.059

-

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Corohmni

South Africa . 397 parts In-Stock

1+ parts

$4.510

100+ parts

-

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397

$4.510

-

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-

Microchip USA

USA . 2,869 parts In-Stock

1+ parts

$30.230

100+ parts

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2,869

$30.230

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Kulean Microsystems

USA . 7,819 parts In-Stock

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7,819

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TANS Electronics

Latvia . 6,882 parts In-Stock

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6,882

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SupplyDigital Components

Austria . 5,988 parts In-Stock

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5,988

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Problanco Electronics

Mexico . 3,068 parts In-Stock

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3,068

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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UHIMA Technologies

Türkiye . 634 parts In-Stock

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634

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Overview

Enhance your electronic designs with the NB3F8L3010CMNTWG by Onsemi, a top-quality clock driver & buffer that guarantees superior performance and reliability. Manufactured by industry leader Onsemi, this product is perfect for applications requiring precision timing and synchronization. With advanced features like differential MUX input conditioning and 3-STATE output characteristics, this chip carrier package offers unmatched value and benefits to customers. Elevate your projects with the NB3F8L3010CMNTWG and experience seamless operation and efficient functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and cost-effective housing for the clock driver, ensuring long-term reliability and affordability.

Surface Mount: YES

Allows for easy installation and efficient use of PCB space, making the product suitable for modern electronics design.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard supply voltage, compatible with a wide range of systems and power sources.

No. of Terminals: 32

Offers flexibility in connection options, enabling compatibility with various input and output configurations.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of environmental conditions, suitable for industrial applications.

Output Characteristics: 3-STATE

Allows for high impedance output state, providing design flexibility and minimizing interference in the system.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures, making it suitable for use in harsh operating environments.

Maximum Power Supply Current (ICC): 50 mA

Operates at low power consumption, reducing energy costs and heat dissipation in the system.

Technical Specifications

Clock Drivers & Buffers NB3F8L3010CMNTWG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3F

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

50 mA

Maximum Same Edge Skew (tskwd):

.055 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

10 MHz

Trade Compliance

NB3F8L3010CMNTWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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