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NB3V1102CMTTBG

Onsemi

NB3V1102CMTTBG by Onsemi

NB3V1102CMTTBG clock driver by Onsemi features a 3.5 ns propagation delay, 1.8V nominal voltage, and 250 MHz min fmax. Ideal for industrial applications requiring precise timing control in a compact form factor with surface mount capability.

Median Price

$5.450

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,002 parts In-Stock

1+ parts

$5.450

100+ parts

$3.490

1k+ parts

$3.140

10k+ parts

$3.100

2,002

$5.450

$3.490

$3.140

$3.100

DigiKey

USA . 869 parts In-Stock

1+ parts

$5.450

100+ parts

$3.489

1k+ parts

$3.136

10k+ parts

$3.033

869

$5.450

$3.489

$3.136

$3.033

Chip1Stop

Japan . 1,145 parts In-Stock

1+ parts

$17.400

100+ parts

$7.680

1k+ parts

$5.010

10k+ parts

-

1,145

$17.400

$7.680

$5.010

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,414 parts In-Stock

1+ parts

$5.728

100+ parts

-

1k+ parts

-

10k+ parts

-

2,414

$5.728

-

-

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Vyrian

USA . 2,102 parts In-Stock

1+ parts

$6.030

100+ parts

-

1k+ parts

-

10k+ parts

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2,102

$6.030

-

-

-

Flip Electronics

USA . 873 parts In-Stock

1+ parts

-

100+ parts

-

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873

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,578 parts In-Stock

1+ parts

$5.130

100+ parts

-

1k+ parts

-

10k+ parts

-

1,578

$5.130

-

-

-

Corphita

USA . 1,203 parts In-Stock

1+ parts

$5.427

100+ parts

-

1k+ parts

-

10k+ parts

-

1,203

$5.427

-

-

-

Corohmni

South Africa . 88 parts In-Stock

1+ parts

$6.030

100+ parts

-

1k+ parts

-

10k+ parts

-

88

$6.030

-

-

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Perfect Parts

USA . 18,495 parts In-Stock

1+ parts

-

100+ parts

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18,495

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QUARKTWIN TECHNOLOGY LTD

USA . 7,946 parts In-Stock

1+ parts

-

100+ parts

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7,946

-

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TANS Electronics

Latvia . 6,973 parts In-Stock

1+ parts

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6,973

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-

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SupplyDigital Components

Austria . 6,862 parts In-Stock

1+ parts

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6,862

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Microchip USA

USA . 5,465 parts In-Stock

1+ parts

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5,465

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Kulean Microsystems

USA . 2,601 parts In-Stock

1+ parts

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2,601

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GreenTree Electronics

Israel . 1,291 parts In-Stock

1+ parts

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1,291

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Authorized Procurement Solutions

USA . 1,191 parts In-Stock

1+ parts

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1,191

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Problanco Electronics

Mexico . 881 parts In-Stock

1+ parts

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881

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Speed Components Ltd (Excess)

Israel . 385 parts In-Stock

1+ parts

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385

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UHIMA Technologies

Türkiye . 31 parts In-Stock

1+ parts

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31

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Overview

Enhance your electronic designs with the NB3V1102CMTTBG clock driver from Onsemi. As a reputable manufacturer in the industry, Onsemi ensures top-notch quality and reliability. Clock Drivers & Buffers are essential components for various applications, and this product stands out with its high performance, low propagation delay, and wide temperature range. With a compact design and 3-state output characteristics, this clock driver offers value and benefits to customers looking for precision and efficiency in their projects. Trust Onsemi for cutting-edge solutions that elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making it a suitable choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low nominal supply voltage of 1.8V, reducing power consumption and heat generation.

Propagation Delay (tpd): 3.5 ns

Fast propagation delay of 3.5 ns ensures quick signal processing and minimal delay in clock distribution.

Maximum Operating Temperature: 105 °C

Wide operating temperature range of up to 105 °C makes it suitable for industrial applications where temperature variations are common.

Output Characteristics: 3-STATE

3-state output allows for high impedance when disabled, reducing signal interference and improving overall signal integrity.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures down to -40 °C, making it suitable for harsh environmental conditions.

Minimum Supply Voltage (Vsup): 1.71 V

Ability to operate at a minimum supply voltage of 1.71V ensures reliable performance even under low voltage conditions.

No. of True Outputs: 2

Provides 2 true outputs, allowing for multiple clock signals to be distributed simultaneously.

Minimum fmax: 250 MHz

High maximum operating frequency of 250 MHz enables fast clock signal distribution in high-speed applications.

Technical Specifications

Clock Drivers & Buffers NB3V1102CMTTBG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 2.5V AND 3.3V VCC NOMINAL SUPPLY

Family:

NB3V

Input Conditioning:

STANDARD

JESD-30 Code:

S-PDSO-N8

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

3.5 ns

Maximum Same Edge Skew (tskwd):

.075 ns

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Minimum fmax:

250 MHz

Trade Compliance

NB3V1102CMTTBG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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