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NB3V1104CMTTBG

Onsemi

NB3V1104CMTTBG by Onsemi

LOW SKEW CLOCK DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: VSON; Package Shape: SQUARE;

Median Price

$3.319

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,471 parts In-Stock

1+ parts

$4.250

100+ parts

$2.677

1k+ parts

$2.394

10k+ parts

$2.311

1,471

$4.250

$2.677

$2.394

$2.311

Chip1Stop

Japan . 2,800 parts In-Stock

1+ parts

$14.600

100+ parts

$5.980

1k+ parts

$3.840

10k+ parts

-

2,800

$14.600

$5.980

$3.840

-

Rochester

USA . 3,726 parts In-Stock

1+ parts

-

100+ parts

$2.140

1k+ parts

$1.910

10k+ parts

$1.800

3,726

-

$2.140

$1.910

$1.800

Verical

USA . 3,726 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.388

10k+ parts

$2.250

3,726

-

-

$2.388

$2.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,079 parts In-Stock

1+ parts

$1.970

100+ parts

-

1k+ parts

-

10k+ parts

-

2,079

$1.970

-

-

-

Digiode

USA . 615 parts In-Stock

1+ parts

$2.252

100+ parts

-

1k+ parts

-

10k+ parts

-

615

$2.252

-

-

-

Flip Electronics

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

33,000

-

-

-

-

Contempo Components LLC

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 102 parts In-Stock

1+ parts

$1.970

100+ parts

-

1k+ parts

-

10k+ parts

-

102

$1.970

-

-

-

Corphita

USA . 305 parts In-Stock

1+ parts

$2.133

100+ parts

-

1k+ parts

-

10k+ parts

-

305

$2.133

-

-

-

Microchip USA

USA . 4,529 parts In-Stock

1+ parts

$15.644

100+ parts

-

1k+ parts

-

10k+ parts

-

4,529

$15.644

-

-

-

Advanced Electronics

New Zealand . 800 parts In-Stock

1+ parts

$20.327

100+ parts

$20.124

1k+ parts

$19.311

10k+ parts

-

800

$20.327

$20.124

$19.311

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

TANS Electronics

Latvia . 5,141 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,141

-

-

-

-

SupplyDigital Components

Austria . 4,768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,768

-

-

-

-

Continental Prestige Electronics

USA . 3,761 parts In-Stock

1+ parts

-

100+ parts

$2.850

1k+ parts

-

10k+ parts

-

3,761

-

$2.850

-

-

Infinite Electronics LLP (Excess)

. 2,419 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,419

-

-

-

-

Problanco Electronics

Mexico . 920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

920

-

-

-

-

UHIMA Technologies

Türkiye . 58 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

58

-

-

-

-

Kulean Microsystems

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6

-

-

-

-

Technical Specifications

Clock Drivers & Buffers NB3V1104CMTTBG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 2.5V AND 3.3V VCC NOMINAL SUPPLY

Family:

NB3V

Input Conditioning:

STANDARD

JESD-30 Code:

S-PDSO-N8

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

3.5 ns

Maximum Same Edge Skew (tskwd):

.075 ns

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Minimum fmax:

250 MHz

Trade Compliance

NB3V1104CMTTBG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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