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NB3V1103CDTR2G

Onsemi

NB3V1103CDTR2G by Onsemi

NB3V1103CDTR2G clock driver by Onsemi features 3.5ns propagation delay, 1.8V nominal voltage, and 250MHz min fmax. Ideal for industrial applications requiring precise timing control in a compact package with surface mount capability.

Median Price

$6.275

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,329 parts In-Stock

1+ parts

$9.180

100+ parts

$6.070

1k+ parts

$5.510

10k+ parts

$5.370

2,329

$9.180

$6.070

$5.510

$5.370

Rochester

USA . 30,823 parts In-Stock

1+ parts

-

100+ parts

$5.020

1k+ parts

$4.490

10k+ parts

$4.220

30,823

-

$5.020

$4.490

$4.220

Verical

USA . 30,230 parts In-Stock

1+ parts

-

100+ parts

$6.275

1k+ parts

$5.612

10k+ parts

$5.275

30,230

-

$6.275

$5.612

$5.275

Flip Electronics (Authorized)

USA . 2,500 parts In-Stock

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2,500

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Distributors (In-Stock)

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Digiode

USA . 1,913 parts In-Stock

1+ parts

$5.292

100+ parts

-

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1,913

$5.292

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Vyrian

USA . 1,321 parts In-Stock

1+ parts

$5.570

100+ parts

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1,321

$5.570

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Flip Electronics

USA . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 778 parts In-Stock

1+ parts

$5.013

100+ parts

-

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778

$5.013

-

-

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Corohmni

South Africa . 162 parts In-Stock

1+ parts

$5.570

100+ parts

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162

$5.570

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Component Stockers USA

USA . 517 parts In-Stock

1+ parts

$5.640

100+ parts

$5.300

1k+ parts

-

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517

$5.640

$5.300

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-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$37.806

100+ parts

$34.403

1k+ parts

$31.001

10k+ parts

-

2,000

$37.806

$34.403

$31.001

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iodParts Technologies Inc.

India . 47,891 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 29,869 parts In-Stock

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29,869

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Kulean Microsystems

USA . 7,541 parts In-Stock

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Microchip USA

USA . 4,502 parts In-Stock

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TANS Electronics

Latvia . 3,538 parts In-Stock

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Problanco Electronics

Mexico . 2,388 parts In-Stock

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SupplyDigital Components

Austria . 2,239 parts In-Stock

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2,239

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UHIMA Technologies

Türkiye . 598 parts In-Stock

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598

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Overview

Experience the unmatched quality and reliability of Onsemi with the NB3V1103CDTR2G Clock Drivers & Buffers. This small outline, thin profile package offers a wide range of applications in industrial settings, providing customers with precise output characteristics and fast propagation delay. With a nominal supply voltage of 1.8V and a temperature range of -40 to 105 °C, this product ensures optimal performance in any environment. Trust Onsemi for top-tier products that deliver value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures long-term reliability and ease of handling.

Surface Mount: YES

Enables easy and efficient installation on circuit boards.

Propagation Delay (tpd): 3.5 ns

Fast signal propagation allows for precise timing in clock applications.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with high temperature requirements.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliability in various conditions.

Technical Specifications

Clock Drivers & Buffers NB3V1103CDTR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 2.5V AND 3.3V VCC NOMINAL SUPPLY

Family:

NB3V

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

3.5 ns

Maximum Same Edge Skew (tskwd):

.075 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Minimum fmax:

250 MHz

Trade Compliance

NB3V1103CDTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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