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NB3V1106CDTR2G

Onsemi

NB3V1106CDTR2G by Onsemi

NB3V1106CDTR2G Clock Driver by Onsemi features 14 terminals, 3.5 ns propagation delay, and 250 MHz min fmax. Ideal for industrial applications requiring a clock driver with a small outline package style and standard input conditioning. Operating temperature ranges from -40 to 105°C.

Median Price

$5.509

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,824 parts In-Stock

1+ parts

$6.630

100+ parts

$4.298

1k+ parts

$3.878

10k+ parts

$3.773

1,824

$6.630

$4.298

$3.878

$3.773

Mouser Electronics

USA . 961 parts In-Stock

1+ parts

$6.630

100+ parts

$4.300

1k+ parts

$3.880

10k+ parts

$3.750

961

$6.630

$4.300

$3.880

$3.750

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$4.388

1k+ parts

$3.925

10k+ parts

$3.688

10,000

-

$4.388

$3.925

$3.688

Rochester

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$3.510

1k+ parts

$3.140

10k+ parts

$2.950

10,000

-

$3.510

$3.140

$2.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 787 parts In-Stock

1+ parts

$6.384

100+ parts

-

1k+ parts

-

10k+ parts

-

787

$6.384

-

-

-

Vyrian

USA . 521 parts In-Stock

1+ parts

$6.720

100+ parts

-

1k+ parts

-

10k+ parts

-

521

$6.720

-

-

-

Flip Electronics

USA . 22,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,773 parts In-Stock

1+ parts

$5.710

100+ parts

-

1k+ parts

-

10k+ parts

-

1,773

$5.710

-

-

-

Corphita

USA . 1,332 parts In-Stock

1+ parts

$6.048

100+ parts

-

1k+ parts

-

10k+ parts

-

1,332

$6.048

-

-

-

Component Stockers USA

USA . 3,655 parts In-Stock

1+ parts

$6.600

100+ parts

$4.720

1k+ parts

$3.490

10k+ parts

-

3,655

$6.600

$4.720

$3.490

-

Corohmni

South Africa . 227 parts In-Stock

1+ parts

$6.720

100+ parts

-

1k+ parts

-

10k+ parts

-

227

$6.720

-

-

-

Microchip USA

USA . 4,633 parts In-Stock

1+ parts

$25.080

100+ parts

$24.930

1k+ parts

$24.850

10k+ parts

$24.770

4,633

$25.080

$24.930

$24.850

$24.770

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,000

-

-

-

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Problanco Electronics

Mexico . 7,784 parts In-Stock

1+ parts

-

100+ parts

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7,784

-

-

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TANS Electronics

Latvia . 7,137 parts In-Stock

1+ parts

-

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7,137

-

-

-

-

Kulean Microsystems

USA . 6,555 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,555

-

-

-

-

SupplyDigital Components

Austria . 1,658 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,658

-

-

-

-

UHIMA Technologies

Türkiye . 83 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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83

-

-

-

-

Overview

Enhance the performance of your electronic devices with the NB3V1106CDTR2G clock driver and buffer by Onsemi. Designed with high-quality materials and precision engineering, this product ensures reliable operation in a variety of applications. From improving signal integrity to reducing power consumption, this clock driver offers unmatched value and benefits to customers looking to optimize their systems. Trust Onsemi for superior technology solutions that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to damage, ensuring the longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy installation on a PCB, saving space and making the product suitable for compact electronic designs.

Nominal Supply Voltage (Vsup): 1.8V

The low supply voltage requirement of 1.8V makes this product energy-efficient and suitable for battery-powered devices.

Propagation Delay (tpd): 3.5 ns

The low propagation delay of 3.5 ns ensures quick signal transmission, making this product ideal for high-speed applications.

Output Characteristics: 3-STATE

The 3-STATE output feature allows the device to drive the output to a high-impedance state, providing flexibility in controlling the output signal.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can operate reliably in a wide range of temperature conditions, making it suitable for industrial applications.

Minimum fmax: 250 MHz

With a high minimum fmax of 250 MHz, this product can support high-frequency operations, making it suitable for demanding applications that require fast signal processing.

Technical Specifications

Clock Drivers & Buffers NB3V1106CDTR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 2.5V AND 3.3V VCC NOMINAL SUPPLY

Family:

NB3V

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

14

No. of True Outputs:

6

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

3.5 ns

Maximum Same Edge Skew (tskwd):

.075 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

250 MHz

Trade Compliance

NB3V1106CDTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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