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NB3V8312CMNR4G

Onsemi

NB3V8312CMNR4G by Onsemi

NB3V8312CMNR4G clock driver by Onsemi features 32 terminals, 12 true outputs, and a propagation delay of 4.2 ns. With a wide operating temperature range (-40 to 85 °C), it is ideal for industrial applications requiring high-speed performance up to 250 MHz. The chip carrier package with a very thin profile makes it suitable for space-constrained designs.

Median Price

$5.624

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 279 parts In-Stock

1+ parts

$5.963

100+ parts

$5.112

1k+ parts

$4.897

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279

$5.963

$5.112

$4.897

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Arrow

USA . 291 parts In-Stock

1+ parts

$6.193

100+ parts

$5.285

1k+ parts

$4.897

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291

$6.193

$5.285

$4.897

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Rochester

USA . 955 parts In-Stock

1+ parts

-

100+ parts

$4.630

1k+ parts

$4.140

10k+ parts

$3.900

955

-

$4.630

$4.140

$3.900

Verical

USA . 291 parts In-Stock

1+ parts

-

100+ parts

$5.285

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$4.897

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291

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$5.285

$4.897

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Distributors (In-Stock)

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Digiode

USA . 1,232 parts In-Stock

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$4.902

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$4.902

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Vyrian

USA . 2,000 parts In-Stock

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$5.160

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2,000

$5.160

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Sensible Micro Corp

USA . 1,000 parts In-Stock

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Semtec, LLC

USA . 22 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,206 parts In-Stock

1+ parts

$4.644

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2,206

$4.644

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Corohmni

South Africa . 315 parts In-Stock

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$5.160

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315

$5.160

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Microchip USA

USA . 3,626 parts In-Stock

1+ parts

$14.880

100+ parts

$14.670

1k+ parts

$14.560

10k+ parts

$14.450

3,626

$14.880

$14.670

$14.560

$14.450

Perfect Parts

USA . 10,267 parts In-Stock

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Problanco Electronics

Mexico . 4,192 parts In-Stock

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TANS Electronics

Latvia . 1,729 parts In-Stock

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1,729

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Kulean Microsystems

USA . 1,523 parts In-Stock

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1,523

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SupplyDigital Components

Austria . 1,267 parts In-Stock

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UHIMA Technologies

Türkiye . 978 parts In-Stock

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978

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Speed Components Ltd (Excess)

Israel . 52 parts In-Stock

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Overview

Enhance your electronic designs with the NB3V8312CMNR4G clock driver and buffer by Onsemi. With its high-quality manufacturing and reliable performance, this versatile chip carrier is ideal for a wide range of applications. From ensuring precise timing in communication systems to improving signal integrity in industrial equipment, this product offers value and benefits that will elevate your projects. Trust Onsemi for innovative solutions that deliver exceptional results.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and reducing assembly time.

Input Conditioning: STANDARD

Ensures reliable and consistent input signals for accurate clock distribution.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a common voltage level, making it compatible with a wide range of devices.

Propagation Delay (tpd): 4.2 ns

Provides fast signal processing, improving overall system performance.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

Enables the output to be tri-stated, allowing for bus sharing and reducing power consumption.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where high temperature resistance is required.

Technical Specifications

Clock Drivers & Buffers NB3V8312CMNR4G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 2.5V, 3.3V SUPPLY VOLTAGE

Family:

NB3V

Input Conditioning:

STANDARD

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

4.2 ns

Maximum Same Edge Skew (tskwd):

.15 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

250 MHz

Trade Compliance

NB3V8312CMNR4G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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