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CY2302SXI-1T

Infineon Technologies

CY2302SXI-1T by Infineon Technologies

Infineon Technologies' CY2302SXI-1T is a clock driver with a propagation delay of 0.35 ns and operates at a nominal voltage of 3.3V. It is commonly used in industrial applications that require precise timing and synchronization.

Median Price

$6.537

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,566 parts In-Stock

1+ parts

$9.550

100+ parts

$6.333

1k+ parts

$5.752

10k+ parts

$5.608

1,566

$9.550

$6.333

$5.752

$5.608

Flip Electronics (Authorized)

USA . 37,500 parts In-Stock

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37,500

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Rochester

USA . 1,661 parts In-Stock

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$5.230

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$4.680

10k+ parts

$4.410

1,661

-

$5.230

$4.680

$4.410

Verical

USA . 961 parts In-Stock

1+ parts

-

100+ parts

$6.537

1k+ parts

$5.850

10k+ parts

$5.513

961

-

$6.537

$5.850

$5.513

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 339 parts In-Stock

1+ parts

$5.026

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339

$5.026

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Flip Electronics

USA . 22,500 parts In-Stock

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22,500

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Vyrian

USA . 8,605 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,874 parts In-Stock

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Nova Conductors

Japan . 65 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 4,621 parts In-Stock

1+ parts

$1.888

100+ parts

-

1k+ parts

$1.812

10k+ parts

$1.812

4,621

$1.888

-

$1.812

$1.812

Ampacity Inc.

Singapore . 8,622 parts In-Stock

1+ parts

$4.500

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8,622

$4.500

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Corphita

USA . 350 parts In-Stock

1+ parts

$4.761

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350

$4.761

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Modulus Dynamics

Lithuania . 3,447 parts In-Stock

1+ parts

$12.711

100+ parts

$12.203

1k+ parts

$11.694

10k+ parts

-

3,447

$12.711

$12.203

$11.694

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Corohmni

South Africa . 456 parts In-Stock

1+ parts

$20.019

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456

$20.019

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$21.206

100+ parts

$19.297

1k+ parts

$17.389

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500

$21.206

$19.297

$17.389

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Aztec Data Supply Inc.

USA . 259 parts In-Stock

1+ parts

$28.893

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259

$28.893

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Microchip USA

USA . 2,547 parts In-Stock

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$30.158

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2,547

$30.158

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Futuretech Components

Singapore . 9,012 parts In-Stock

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9,012

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A-Z Elektronik GmbH

Germany . 4,862 parts In-Stock

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4,862

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Infinite Electronics LLP (Excess)

. 4,666 parts In-Stock

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Argo Parts USA

USA . 4,451 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,241 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Kepictronics

USA . 1,779 parts In-Stock

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Continental Prestige Electronics

USA . 107 parts In-Stock

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Perfect Parts

USA . 11 parts In-Stock

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Overview

Discover the CY2302SXI-1T, a high-quality Clock Driver & Buffer brought to you by Infineon Technologies. With its advanced design and durable plastic/epoxy construction, this product guarantees exceptional performance and reliability. Ideal for a wide range of applications, this small outline package offers a nominal supply voltage of 3.3V, making it versatile and adaptable to various power supplies. Experience seamless connectivity and precision with its standard input conditioning and dual terminal position. Say goodbye to delays with a propagation delay of just 0.35ns. Don't miss out on the value and benefits this product brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Its plastic/epoxy body material ensures durability and protection, making it suitable for various environments.

Propagation Delay At Nominal Supply: 0.35 ns

With a low propagation delay, it provides fast signal transmission and helps improve overall system performance.

Surface Mount: YES

Its surface mount capability allows for easy and efficient installation, making it ideal for compact designs.

Input Conditioning: STANDARD

The standard input conditioning ensures compatibility with a wide range of signal sources, offering flexibility in different applications.

Package Shape: RECTANGULAR

Its rectangular package shape allows for space-saving integration, making it suitable for designs with limited board space.

Nominal Supply Voltage / Vsup (V): 3.3

With a nominal supply voltage of 3.3V, it operates efficiently and is compatible with various systems and power sources.

Power Supplies (V): 3.3/5

The capability to accept power supplies of both 3.3V and 5V provides versatility and compatibility with different voltage requirements.

No. of Terminals: 8

The 8 terminals offer ample connectivity options, enabling integration into complex systems and facilitating signal routing.

Package Style (Meter): SMALL OUTLINE

Its small outline package style ensures space efficiency and ease of integration, making it suitable for compact designs.

Maximum I (ol): 12 Amp

With a maximum output current of 12 Amp, it can drive high-power loads, making it suitable for demanding applications.

Propagation Delay (tpd): 0.35 ns

Its low propagation delay of 0.35 ns ensures fast signal transmission, minimizing signal degradation and improving system performance.

Maximum Operating Temperature: 85 °C

Being able to operate at temperatures up to 85°C enhances its reliability and suitability for industrial environments.

Minimum Operating Temperature: -40 °C

Its ability to function at temperatures as low as -40°C enables usage in various climates and environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish ensures good electrical conductivity and solderability, enhancing long-term reliability.

Terminal Position: DUAL

With dual terminal position, it offers flexibility in terms of system connectivity and signal routing.

Maximum Seated Height: 1.727 mm

Its low seated height allows for efficient space utilization and integration, facilitating compact designs.

Width: 3.8985 mm

Its narrow width enables easy placement and integration, being suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 3.135 V

With a minimum supply voltage of 3.135V, it ensures proper operation even under low voltage conditions.

Maximum Time At Peak Reflow Temperature (s): 20

Its capability to withstand a peak reflow temperature of 260°C for up to 20 seconds ensures reliable assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C enables compatibility with lead-free soldering processes, ensuring compliance with industry standards.

Length: 4.889 mm

Its compact length facilitates easy placement and integration, making it suitable for miniaturized designs.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, it can operate reliably in harsh temperature and environmental conditions.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and simplifies soldering processes, ensuring secure and reliable connections.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, it offers compatibility with standard PCB designs, simplifying integration into existing systems.

Maximum Same Edge Skew (tskwd): 0.25 ns

The low maximum same edge skew of 0.25 ns ensures accurate signal timing and synchronization in multi-channel applications.

No. of True Outputs: 2

With 2 true outputs, it offers multiple output options and flexibility in signal distribution.

Minimum fmax: 133 MHz

Its minimum fmax of 133 MHz allows for high-speed operation, making it suitable for demanding clock and buffering applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, it can withstand moderate exposure to moisture during manufacturing and storage processes.

Maximum Supply Voltage (Vsup): 3.465 V

With a maximum supply voltage of 3.465V, it ensures safe operation and protection against voltage spikes and fluctuations.

Technical Specifications

Clock Drivers & Buffers CY2302SXI-1T attributes and parameters. Explore more Clock Drivers & Buffers devices from Infineon Technologies

Specs

Additional Features:

IT ALSO OPERATES WITH 5V SUPPLY

Family:

23S

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.889 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

.35 ns

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.727 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

3.8985 mm

Minimum fmax:

133 MHz

Trade Compliance

CY2302SXI-1T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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