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NB3V1108CDTR2G

Onsemi

NB3V1108CDTR2G by Onsemi

NB3V1108CDTR2G clock driver by Onsemi features 16 terminals, 3.5 ns propagation delay, and 250 MHz min fmax. Ideal for industrial applications requiring a clock driver with a small outline, thin profile package style and standard input conditioning.

Median Price

$4.010

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,446 parts In-Stock

1+ parts

$4.010

100+ parts

$2.520

1k+ parts

$2.270

10k+ parts

$2.110

1,446

$4.010

$2.520

$2.270

$2.110

DigiKey

USA . 802 parts In-Stock

1+ parts

$4.010

100+ parts

$2.516

1k+ parts

$2.247

10k+ parts

$2.180

802

$4.010

$2.516

$2.247

$2.180

Rochester

USA . 3,129 parts In-Stock

1+ parts

-

100+ parts

$2.000

1k+ parts

$1.790

10k+ parts

$1.680

3,129

-

$2.000

$1.790

$1.680

Flip Electronics (Authorized)

USA . 2,500 parts In-Stock

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2,500

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Distributors (In-Stock)

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Digiode

USA . 534 parts In-Stock

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$2.109

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534

$2.109

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Vyrian

USA . 1,117 parts In-Stock

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$2.220

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$2.220

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Sensible Micro Corp

USA . 10,000 parts In-Stock

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Flip Electronics

USA . 2,500 parts In-Stock

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LWI Electronics Inc

India . 235 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,053 parts In-Stock

1+ parts

$1.998

100+ parts

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1,053

$1.998

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Corohmni

South Africa . 91 parts In-Stock

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$2.220

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91

$2.220

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Microchip USA

USA . 4,816 parts In-Stock

1+ parts

$14.660

100+ parts

$14.570

1k+ parts

$14.530

10k+ parts

$14.480

4,816

$14.660

$14.570

$14.530

$14.480

Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Perfect Parts

USA . 8,070 parts In-Stock

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TANS Electronics

Latvia . 7,018 parts In-Stock

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Kulean Microsystems

USA . 4,849 parts In-Stock

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Problanco Electronics

Mexico . 4,063 parts In-Stock

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SupplyDigital Components

Austria . 2,332 parts In-Stock

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UHIMA Technologies

Türkiye . 553 parts In-Stock

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553

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Enhance your clock driving and buffering needs with the NB3V1108CDTR2G by Onsemi. Designed with precision and reliability in mind, Onsemi is renowned for producing high-quality components that exceed industry standards. This clock driver offers seamless integration into various applications, providing customers with superior performance and efficiency. Elevate your projects with the unmatched value and benefits of the NB3V1108CDTR2G, delivering optimal results every time. Trust Onsemi to deliver cutting-edge solutions for your clock driving requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers a good balance of durability and cost-effectiveness.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort.

Propagation Delay (tpd): 3.5 ns

The low propagation delay ensures fast signal processing, ideal for clock drivers.

Maximum Operating Temperature: 105 °C

Can operate in high temperature environments, suitable for industrial use.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, ensuring reliability in various conditions.

No. of True Outputs: 8

Provides multiple outputs for driving clocks efficiently.

Technical Specifications

Clock Drivers & Buffers NB3V1108CDTR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 2.5V AND 3.3V VCC NOMINAL SUPPLY

Family:

NB3V

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

3.5 ns

Maximum Same Edge Skew (tskwd):

.075 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

250 MHz

Trade Compliance

NB3V1108CDTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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