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NB3N3010BDG

Onsemi

NB3N3010BDG by Onsemi

NB3N3010BDG Clock Driver by Onsemi operates at 3.3V, with 2 true outputs and a min fmax of 12.3187 MHz. It is used in applications requiring clock drivers & buffers, featuring a small outline package style for surface mount assembly.

Median Price

$1.588

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,673 parts In-Stock

1+ parts

-

100+ parts

$1.500

1k+ parts

$1.340

10k+ parts

$1.260

12,673

-

$1.500

$1.340

$1.260

Verical

USA . 5,978 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.675

10k+ parts

-

5,978

-

-

$1.675

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,521 parts In-Stock

1+ parts

$1.586

100+ parts

-

1k+ parts

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1,521

$1.586

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Vyrian

USA . 6,228 parts In-Stock

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6,228

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 396 parts In-Stock

1+ parts

$1.503

100+ parts

-

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-

10k+ parts

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396

$1.503

-

-

-

Corohmni

South Africa . 321 parts In-Stock

1+ parts

$1.580

100+ parts

-

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321

$1.580

-

-

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AZTECH Wire

Italy . 931 parts In-Stock

1+ parts

$11.030

100+ parts

-

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931

$11.030

-

-

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Continental Prestige Electronics

USA . 12,673 parts In-Stock

1+ parts

-

100+ parts

$1.530

1k+ parts

-

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12,673

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$1.530

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Kulean Microsystems

USA . 7,175 parts In-Stock

1+ parts

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7,175

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TANS Electronics

Latvia . 5,798 parts In-Stock

1+ parts

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5,798

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SupplyDigital Components

Austria . 3,725 parts In-Stock

1+ parts

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3,725

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Problanco Electronics

Mexico . 2,940 parts In-Stock

1+ parts

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2,940

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UHIMA Technologies

Türkiye . 750 parts In-Stock

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750

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Perfect Parts

USA . 588 parts In-Stock

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588

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Microchip USA

USA . 298 parts In-Stock

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298

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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100

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GreenTree Electronics

Israel . 78 parts In-Stock

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78

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Overview

Elevate your clock driver and buffering needs with the NB3N3010BDG by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality products that are reliable and efficient. Clock Drivers & Buffers are essential components for various applications, ensuring precise timing and synchronization. With the NB3N3010BDG, customers can expect superior performance and seamless integration. Experience the value of Onsemi's advanced technology and unlock new possibilities for your projects. Trust Onsemi to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver & buffer.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

Suitable voltage level for various applications, ensuring compatibility with common power sources.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: 0 °C

Wide operating temperature range allows for use in both hot and cold conditions.

Width: 3.9 mm

Compact size enables the clock driver & buffer to be used in space-constrained designs.

Maximum Supply Voltage: 3.465 V

Provides a safe operating range without exceeding voltage limits.

Technical Specifications

Clock Drivers & Buffers NB3N3010BDG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3N

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.7 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

12.3187 MHz

Trade Compliance

NB3N3010BDG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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