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NB3N121KMNG

Onsemi

NB3N121KMNG by Onsemi

NB3N121KMNG clock driver by Onsemi features a low propagation delay of 0.95 ns, suitable for differential input conditioning. With 52 terminals in a square package style, it operates at temperatures ranging from -40 to 85 °C, making it ideal for industrial applications. The chip carrier with a very thin profile supports a nominal voltage of 3.3 V and surface mount installation.

Median Price

$5.884

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2,191 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$5.170

10k+ parts

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2,191

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$5.170

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Rochester

USA . 2,139 parts In-Stock

1+ parts

-

100+ parts

$5.230

1k+ parts

$4.680

10k+ parts

$4.410

2,139

-

$5.230

$4.680

$4.410

DigiKey

USA . 2,139 parts In-Stock

1+ parts

-

100+ parts

$6.890

1k+ parts

-

10k+ parts

-

2,139

-

$6.890

-

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Verical

USA . 2,139 parts In-Stock

1+ parts

-

100+ parts

$6.537

1k+ parts

$5.850

10k+ parts

$5.513

2,139

-

$6.537

$5.850

$5.513

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 793 parts In-Stock

1+ parts

$5.170

100+ parts

-

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793

$5.170

-

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Digiode

USA . 1,144 parts In-Stock

1+ parts

$5.538

100+ parts

-

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1,144

$5.538

-

-

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DigiKey Marketplace

USA . 260 parts In-Stock

1+ parts

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260

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 147 parts In-Stock

1+ parts

$5.170

100+ parts

-

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147

$5.170

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Corphita

USA . 214 parts In-Stock

1+ parts

$5.247

100+ parts

-

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214

$5.247

-

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Component Stockers USA

USA . 754 parts In-Stock

1+ parts

$6.000

100+ parts

$5.640

1k+ parts

$5.100

10k+ parts

-

754

$6.000

$5.640

$5.100

-

QUARKTWIN TECHNOLOGY LTD

USA . 8,747 parts In-Stock

1+ parts

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8,747

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TANS Electronics

Latvia . 8,191 parts In-Stock

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8,191

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Kulean Microsystems

USA . 2,630 parts In-Stock

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2,630

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Problanco Electronics

Mexico . 2,225 parts In-Stock

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2,225

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Continental Prestige Electronics

USA . 2,191 parts In-Stock

1+ parts

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$5.170

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2,191

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$5.170

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Microchip USA

USA . 1,338 parts In-Stock

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1,338

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UHIMA Technologies

Türkiye . 617 parts In-Stock

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617

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SupplyDigital Components

Austria . 511 parts In-Stock

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511

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Perfect Parts

USA . 280 parts In-Stock

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280

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Overview

Experience seamless clock signal distribution with the NB3N121KMNG from Onsemi. As a leading manufacturer in clock drivers and buffers, Onsemi delivers top-notch quality and reliability in every product. This chip carrier package features differential input conditioning and a propagation delay of just 0.95 ns, making it ideal for industrial applications where timing precision is crucial. With 42 true outputs and a wide operating temperature range, the NB3N121KMNG provides exceptional value and performance, giving customers peace of mind knowing their systems will run smoothly and efficiently. Invest in the best with Onsemi's clock drivers and buffers.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.95 ns

Low propagation delay ensures fast and efficient operation of the clock driver.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs.

Input Conditioning: DIFFERENTIAL

Differential input conditioning ensures better noise immunity and signal integrity.

Package Shape: SQUARE

Square package shape provides better space utilization and easier mounting on the PCB.

Nominal Supply Voltage / Vsup (V): 3.3

Standard supply voltage ensures compatibility with a wide range of systems.

Power Supplies (V): 3.3

Matching power supply voltage for consistent and reliable performance.

No. of Terminals: 52

Sufficient terminals for connecting to various components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package style options for different mounting and heat dissipation requirements.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Good temperature tolerance for operation in diverse environments.

Terminal Finish: TIN

Tin finish for enhanced durability and conductivity.

Terminal Position: QUAD

Quad terminal position for stable and secure connection.

Maximum Seated Height: 1 mm

Low seated height for space-constrained designs.

Width: 8 mm

Compact width for easy integration into PCB layouts.

Minimum Supply Voltage (Vsup): 3 V

Reliable operation even at low supply voltages.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time for reflow process during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature endurance for robust manufacturing processes.

Length: 8 mm

Optimal length for space-saving PCB integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh conditions.

Terminal Form: NO LEAD

Lead-free terminal form for environmental compliance and improved reliability.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connection and compact design.

Maximum Same Edge Skew (tskwd): 0.15 ns

Low skew for accurate signal synchronization.

No. of True Outputs: 42

Multiple true outputs for versatile signal distribution.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage tolerance for added protection and compatibility.

Technical Specifications

Clock Drivers & Buffers NB3N121KMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3N

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N52

JESD-609 Code:

e3

Length:

8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC52,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

.95 ns

Propagation Delay (tpd):

.95 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.15 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

NB3N121KMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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