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NB3N108KMNR4G

Onsemi

NB3N108KMNR4G by Onsemi

NB3N108KMNR4G clock driver by Onsemi features 1.1 ns propagation delay, 32 terminals, and operates at a supply voltage of 3.3 V. Ideal for applications requiring differential input conditioning, such as industrial temperature-grade systems with tight timing constraints.

Median Price

$9.420

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,373 parts In-Stock

1+ parts

$9.420

100+ parts

$9.230

1k+ parts

$9.040

10k+ parts

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1,373

$9.420

$9.230

$9.040

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Flip Electronics (Authorized)

USA . 16,667 parts In-Stock

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16,667

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Digiode

USA . 1,150 parts In-Stock

1+ parts

$8.569

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1,150

$8.569

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Nova Conductors

Japan . 50 parts In-Stock

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$8.601

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-

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50

$8.601

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Flip Electronics

USA . 16,667 parts In-Stock

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16,667

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Vyrian

USA . 4,655 parts In-Stock

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4,655

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Distributors (Availability)

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Ampacity Inc.

Singapore . 8,082 parts In-Stock

1+ parts

$6.230

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-

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8,082

$6.230

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Corohmni

South Africa . 443 parts In-Stock

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$7.330

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443

$7.330

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Corphita

USA . 1,562 parts In-Stock

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$8.118

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1,562

$8.118

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Aranea Global

USA . 2,000 parts In-Stock

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$8.429

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$8.092

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2,000

$8.429

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$8.092

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Microchip USA

USA . 2,121 parts In-Stock

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$25.624

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2,121

$25.624

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Problanco Electronics

Mexico . 6,693 parts In-Stock

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Kulean Microsystems

USA . 4,272 parts In-Stock

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Continental Prestige Electronics

USA . 1,671 parts In-Stock

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TANS Electronics

Latvia . 479 parts In-Stock

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SupplyDigital Components

Austria . 408 parts In-Stock

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UHIMA Technologies

Türkiye . 241 parts In-Stock

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RC Electronics

USA . 200 parts In-Stock

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Overview

Enhance your electronic designs with the NB3N108KMNR4G clock driver from Onsemi, a trusted manufacturer known for top-quality components. This versatile chip carrier with a very thin profile offers differential input conditioning and a blazing fast propagation delay of just 1.1 ns at a nominal supply voltage of 3.3V. Ideal for a wide range of applications, this clock driver provides precision timing solutions with minimal power consumption and maximum reliability. Elevate your projects with the exceptional performance and value that only Onsemi products can deliver.

Feature Benefit Bullets

Propagation Delay at Nominal Supply: 1.1 ns

Low propagation delay ensures high-speed performance, making this product suitable for time-critical applications.

Surface Mount: YES

Surface mount packaging allows for easy and compact integration onto PCBs, saving space and simplifying assembly.

Input Conditioning: DIFFERENTIAL

Differential input conditioning ensures better noise immunity and signal integrity, leading to more reliable operation.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a commonly used supply voltage of 3.3V makes it compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in industrial environments with elevated temperatures.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for long-term reliability.

Maximum Seated Height: 1 mm

Low profile design with a maximum seated height of 1mm enables space-saving installations in compact applications.

Width: 5 mm

Compact width dimension allows for efficient use of board space and facilitates PCB layout.

Technical Specifications

Clock Drivers & Buffers NB3N108KMNR4G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3N

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

1.1 ns

Propagation Delay (tpd):

1.1 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NB3N108KMNR4G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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