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NB3N1900KMNTWG

Onsemi

NB3N1900KMNTWG by Onsemi

NB3N1900KMNTWG clock driver by Onsemi is a 72-terminal chip carrier with differential mux input conditioning and 3-state output characteristics. Operating at temperatures from -10 to 70°C, it has a supply voltage range of 3.135V to 3.465V. Ideal for applications requiring precise timing control in commercial-grade electronic systems.

Median Price

$6.334

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 755 parts In-Stock

1+ parts

$7.580

100+ parts

$4.959

1k+ parts

$4.485

10k+ parts

$4.393

755

$7.580

$4.959

$4.485

$4.393

Rochester

USA . 25,742 parts In-Stock

1+ parts

-

100+ parts

$4.070

1k+ parts

$3.640

10k+ parts

$3.420

25,742

-

$4.070

$3.640

$3.420

Verical

USA . 15,298 parts In-Stock

1+ parts

-

100+ parts

$5.088

1k+ parts

$4.550

10k+ parts

$4.275

15,298

-

$5.088

$4.550

$4.275

Avnet

USA . 635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$14.842

10k+ parts

$13.926

635

-

-

$14.842

$13.926

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,428 parts In-Stock

1+ parts

$4.284

100+ parts

-

1k+ parts

-

10k+ parts

-

2,428

$4.284

-

-

-

Vyrian

USA . 7,368 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,368

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 156 parts In-Stock

1+ parts

$0.975

100+ parts

-

1k+ parts

-

10k+ parts

-

156

$0.975

-

-

-

Corphita

USA . 1,198 parts In-Stock

1+ parts

$4.059

100+ parts

-

1k+ parts

-

10k+ parts

-

1,198

$4.059

-

-

-

Microchip USA

USA . 3,277 parts In-Stock

1+ parts

$30.230

100+ parts

$30.040

1k+ parts

$29.950

10k+ parts

$29.860

3,277

$30.230

$30.040

$29.950

$29.860

Authorized Procurement Solutions

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50,000

-

-

-

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Kepictronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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9,000

-

-

-

-

TANS Electronics

Latvia . 6,729 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,729

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,283

-

-

-

-

Problanco Electronics

Mexico . 4,056 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,056

-

-

-

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

-

-

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Assy Fe

Spain . 1,748 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,748

-

-

-

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SupplyDigital Components

Austria . 1,237 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,237

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Kulean Microsystems

USA . 962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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962

-

-

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UHIMA Technologies

Türkiye . 324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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324

-

-

-

-

Overview

Enhance the performance of your electronic devices with the NB3N1900KMNTWG clock driver and buffer by Onsemi. Trusted for its quality and reliability, this product offers differential mux input conditioning and 3-state output characteristics. Perfect for a wide range of applications, this chip carrier with a very thin profile is designed to meet your commercial needs. With a nominal supply voltage of 3.3V and a maximum operating temperature of 70°C, the NB3N1900KMNTWG provides outstanding value, benefits, and advantages to customers looking to optimize their electronic systems. Elevate your technology with Onsemi today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on a printed circuit board, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL MUX

Enables the device to efficiently handle multiple input signals and switch between them, ensuring accurate and reliable clock distribution.

Package Shape: SQUARE

The square shape of the package provides stability and ease of handling during the manufacturing and installation process.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making it compatible with a wide range of systems and applications.

No. of Terminals: 72

Offers a high number of terminals for connecting to various components, allowing for versatile and flexible integration within a circuit design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles enhances thermal management and facilitates space-saving designs.

Maximum Operating Temperature: 70 °C

Withstands high operating temperatures, ensuring reliable performance in demanding operational environments.

Output Characteristics: 3-STATE

The 3-state output feature allows for high impedance when disabled, enabling efficient bus sharing and reducing system complexity.

Minimum Operating Temperature: -10 °C

Maintains functionality at low temperatures, providing operation in a wide range of ambient conditions.

Terminal Finish: MATTE TIN

Matte tin finish offers solderability and corrosion resistance, enhancing the durability and reliability of the product.

Terminal Position: QUAD

Quad terminal position layout ensures secure connections and facilitates efficient signal transmission within the circuit.

Maximum Seated Height: 1 mm

Low seated height contributes to a compact and slim profile, optimizing space utilization within the system design.

Width: 10 mm

The narrow width dimension enables easy integration into tight spaces or densely populated PCB layouts, enhancing overall design flexibility.

Minimum Supply Voltage (Vsup): 3.135 V

Supports a minimum supply voltage level, ensuring stable operation even under varying power conditions.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for up to 30 seconds during the soldering process, promoting reliable and efficient assembly.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during the soldering process, ensuring robust solder connections and long-term reliability.

Length: 10 mm

Compact length profile facilitates easy integration and placement within the PCB layout, optimizing space utilization.

Temperature Grade: COMMERCIAL

Designed and validated for commercial temperature ranges, ensuring reliable operation in typical environmental conditions.

Terminal Form: NO LEAD

No-lead terminal form enhances mechanical strength and reliability of the connections, minimizing signal loss and improving overall performance.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for high-density mounting, enabling compact and space-efficient PCB designs.

Maximum Same Edge Skew (tskwd): 0.065 ns

Low same-edge skew ensures accurate signal propagation timing, supporting precise clock synchronization and reducing signal distortion.

No. of True Outputs: 38

Offers a high number of true outputs for distributing clock signals to multiple components, ensuring efficient and synchronized operation within the system.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the device's ability to withstand moderate exposure to moisture during storage and handling, maintaining its performance and reliability.

Maximum Supply Voltage (Vsup): 3.465 V

Supports a maximum supply voltage level, providing a safety margin against voltage spikes and ensuring stable operation under varying supply conditions.

Technical Specifications

Clock Drivers & Buffers NB3N1900KMNTWG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

NB3

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e3

Length:

10 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

72

No. of True Outputs:

38

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Same Edge Skew (tskwd):

.065 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

NB3N1900KMNTWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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