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NB3N1200KMNTXG

Onsemi

NB3N1200KMNTXG by Onsemi

NB3N1200KMNTXG clock driver by Onsemi features 64 terminals, 4.5ns propagation delay, and 3-STATE output characteristics. Ideal for applications requiring differential mux input conditioning, with a package style of CHIP CARRIER and operating temperature range of 0 to 70 °C.

Median Price

$6.322

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 557 parts In-Stock

1+ parts

$7.580

100+ parts

$4.959

1k+ parts

$4.597

10k+ parts

-

557

$7.580

$4.959

$4.597

-

Chip1Stop

Japan . 880 parts In-Stock

1+ parts

$25.400

100+ parts

$10.600

1k+ parts

$7.970

10k+ parts

-

880

$25.400

$10.600

$7.970

-

Rochester

USA . 27,851 parts In-Stock

1+ parts

-

100+ parts

$4.070

1k+ parts

$3.640

10k+ parts

$3.420

27,851

-

$4.070

$3.640

$3.420

Verical

USA . 10,880 parts In-Stock

1+ parts

-

100+ parts

$5.063

1k+ parts

$4.525

10k+ parts

$4.263

10,880

-

$5.063

$4.525

$4.263

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,319 parts In-Stock

1+ parts

$4.284

100+ parts

-

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1,319

$4.284

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-

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Vyrian

USA . 7,216 parts In-Stock

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-

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7,216

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Component Sense

UK . 2,307 parts In-Stock

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2,307

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,308 parts In-Stock

1+ parts

$3.830

100+ parts

-

1k+ parts

-

10k+ parts

-

9,308

$3.830

-

-

-

Corphita

USA . 2,293 parts In-Stock

1+ parts

$4.059

100+ parts

-

1k+ parts

-

10k+ parts

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2,293

$4.059

-

-

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Corohmni

South Africa . 185 parts In-Stock

1+ parts

$4.510

100+ parts

-

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185

$4.510

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Continental Prestige Electronics

USA . 20,880 parts In-Stock

1+ parts

-

100+ parts

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20,880

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QUARKTWIN TECHNOLOGY LTD

USA . 17,490 parts In-Stock

1+ parts

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17,490

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A-Z Elektronik GmbH

Germany . 5,922 parts In-Stock

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5,922

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Perfect Parts

USA . 5,622 parts In-Stock

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5,622

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TANS Electronics

Latvia . 3,248 parts In-Stock

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3,248

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SupplyDigital Components

Austria . 2,647 parts In-Stock

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2,647

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Microchip USA

USA . 2,498 parts In-Stock

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2,498

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Problanco Electronics

Mexico . 2,453 parts In-Stock

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2,453

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Kulean Microsystems

USA . 1,507 parts In-Stock

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1,507

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Authorized Procurement Solutions

USA . 880 parts In-Stock

1+ parts

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880

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iodParts Technologies Inc.

India . 880 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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880

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GreenTree Electronics

Israel . 880 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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880

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UHIMA Technologies

Türkiye . 273 parts In-Stock

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273

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Overview

Enhance your electronic designs with the NB3N1200KMNTXG clock driver and buffer by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that meet the highest standards. The NB3N1200KMNTXG offers unmatched performance and reliability, making it ideal for a wide range of applications. With its advanced features and innovative design, this clock driver and buffer provides customers with exceptional value and benefits. Trust Onsemi to provide you with cutting-edge solutions for all your electronic needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient PCB mounting, saving space and making for a more compact design.

Input Conditioning: DIFFERENTIAL MUX

The use of a differential multiplexer for input conditioning ensures accurate and reliable signal processing, making this product suitable for high-performance applications.

Propagation Delay (tpd): 4.5 ns

With a low propagation delay of 4.5 ns, this clock driver/buffer ensures fast signal transmission and helps in minimizing latency in the system.

Output Characteristics: 3-STATE

The 3-state output characteristics provide flexibility in controlling the output signal, allowing for tristate operation which can be useful in bus architecture designs.

Minimum Operating Temperature: 0 °C

Being able to operate at temperatures as low as 0 °C makes this product suitable for a wide range of environmental conditions, enhancing its versatility.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this clock driver/buffer can reliably function in various temperature conditions without performance degradation.

Technical Specifications

Clock Drivers & Buffers NB3N1200KMNTXG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

NB3

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

64

No. of True Outputs:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

4.5 ns

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

NB3N1200KMNTXG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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