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NB3N3010BDR2G

Onsemi

NB3N3010BDR2G by Onsemi

NB3N3010BDR2G Clock Driver by Onsemi operates at 3.3V with 8 terminals in a small outline package. It has dual terminal position, Gull Wing form, and supports up to 12.3187 MHz frequency for applications requiring precise clock synchronization in electronic devices.

Median Price

$1.675

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,063 parts In-Stock

1+ parts

$10.200

100+ parts

$4.420

1k+ parts

$2.710

10k+ parts

-

2,063

$10.200

$4.420

$2.710

-

Rochester

USA . 24,874 parts In-Stock

1+ parts

-

100+ parts

$1.500

1k+ parts

$1.340

10k+ parts

$1.260

24,874

-

$1.500

$1.340

$1.260

Verical

USA . 17,572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.675

10k+ parts

$1.575

17,572

-

-

$1.675

$1.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 86 parts In-Stock

1+ parts

$1.586

100+ parts

-

1k+ parts

-

10k+ parts

-

86

$1.586

-

-

-

Vyrian

USA . 2,572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,572

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,205 parts In-Stock

1+ parts

$1.503

100+ parts

-

1k+ parts

-

10k+ parts

-

2,205

$1.503

-

-

-

Corohmni

South Africa . 488 parts In-Stock

1+ parts

$1.670

100+ parts

-

1k+ parts

-

10k+ parts

-

488

$1.670

-

-

-

Component Stockers USA

USA . 19,698 parts In-Stock

1+ parts

$1.710

100+ parts

$1.610

1k+ parts

$1.460

10k+ parts

$1.460

19,698

$1.710

$1.610

$1.460

$1.460

Microchip USA

USA . 5,432 parts In-Stock

1+ parts

$11.000

100+ parts

$10.930

1k+ parts

$10.890

10k+ parts

$10.860

5,432

$11.000

$10.930

$10.890

$10.860

AZTECH Wire

Italy . 71 parts In-Stock

1+ parts

$14.020

100+ parts

-

1k+ parts

-

10k+ parts

-

71

$14.020

-

-

-

Continental Prestige Electronics

USA . 27,472 parts In-Stock

1+ parts

-

100+ parts

$2.000

1k+ parts

-

10k+ parts

-

27,472

-

$2.000

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 16,328 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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16,328

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-

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Perfect Parts

USA . 12,644 parts In-Stock

1+ parts

-

100+ parts

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12,644

-

-

-

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Problanco Electronics

Mexico . 7,597 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,597

-

-

-

-

Metaverse IC Inc.

Canada . 6,011 parts In-Stock

1+ parts

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6,011

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-

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Assy Fe

Spain . 6,011 parts In-Stock

1+ parts

-

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6,011

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-

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TANS Electronics

Latvia . 2,808 parts In-Stock

1+ parts

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2,808

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A-Z Elektronik GmbH

Germany . 2,448 parts In-Stock

1+ parts

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2,448

-

-

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GreenTree Electronics

Israel . 2,063 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,063

-

-

-

-

Authorized Procurement Solutions

USA . 2,063 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,063

-

-

-

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Kulean Microsystems

USA . 1,762 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,762

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-

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SupplyDigital Components

Austria . 1,342 parts In-Stock

1+ parts

-

100+ parts

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1,342

-

-

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UHIMA Technologies

Türkiye . 85 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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85

-

-

-

-

Overview

Elevate your clock system with the NB3N3010BDR2G by Onsemi. Crafted with precision and expertise, this clock driver offers unparalleled quality and reliability. Ideal for a range of applications in the Clock Drivers & Buffers category, this product delivers superior performance and efficiency. With Onsemi's reputation for excellence in manufacturing, you can trust that this clock driver will enhance your system's functionality. Experience seamless operation and precise timing with the NB3N3010BDR2G - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, making it compatible with a wide range of electronic devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures without compromising performance, suitable for various environmental conditions.

Minimum Operating Temperature: 0 °C

Can function in colder temperatures, ensuring reliable operation in different climate settings.

Terminal Finish: MATTE TIN

Provides a reliable connection and reduces the risk of corrosion, maintaining signal integrity.

Width: 3.9 mm

Compact size allows for space-efficient placement on circuit boards, ideal for devices with limited space.

Minimum Supply Voltage (Vsup): 3.135 V

Can operate at a lower voltage, helping to conserve power and improve energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high temperatures during manufacturing processes, ensuring reliability during assembly.

No. of True Outputs: 2

Provides multiple output signals, offering flexibility in connecting to other components or devices.

Technical Specifications

Clock Drivers & Buffers NB3N3010BDR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3N

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.7 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

12.3187 MHz

Trade Compliance

NB3N3010BDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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