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DS90LV110TMTC/NOPB

Texas Instruments

DS90LV110TMTC/NOPB by Texas Instruments

DS90LV110TMTC/NOPB by Texas Instruments is a clock driver with 3.6 ns propagation delay at 3.3V, suitable for industrial applications. It features differential input conditioning, 28 terminals in a small outline package, and operates b/w -40 to 85°C.

Median Price

$6.504

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 27,376 parts In-Stock

1+ parts

$6.504

100+ parts

$5.303

1k+ parts

$3.535

10k+ parts

-

27,376

$6.504

$5.303

$3.535

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Newark

USA . 96 parts In-Stock

1+ parts

$8.410

100+ parts

$6.300

1k+ parts

$5.480

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-

96

$8.410

$6.300

$5.480

-

Mouser Electronics

USA . 210 parts In-Stock

1+ parts

$9.420

100+ parts

$6.120

1k+ parts

$5.780

10k+ parts

$5.660

210

$9.420

$6.120

$5.780

$5.660

Element14

Singapore . 96 parts In-Stock

1+ parts

$12.120

100+ parts

$9.080

1k+ parts

$8.620

10k+ parts

-

96

$12.120

$9.080

$8.620

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Rochester

USA . 1,440 parts In-Stock

1+ parts

-

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$5.170

1k+ parts

$4.620

10k+ parts

$4.350

1,440

-

$5.170

$4.620

$4.350

Verical

USA . 713 parts In-Stock

1+ parts

-

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$6.463

1k+ parts

$5.775

10k+ parts

$5.438

713

-

$6.463

$5.775

$5.438

Arrow

USA . 192 parts In-Stock

1+ parts

-

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$4.902

1k+ parts

$4.712

10k+ parts

$4.534

192

-

$4.902

$4.712

$4.534

DigiKey

USA . 7 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$4.626

100+ parts

-

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650

$4.626

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-

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Digiode

USA . 959 parts In-Stock

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$4.731

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959

$4.731

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Chip Stock

USA . 7,519 parts In-Stock

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7,519

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Vyrian

USA . 4,568 parts In-Stock

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Anansix

USA . 540 parts In-Stock

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540

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ComSIT Distribution GmbH

Germany . 91 parts In-Stock

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91

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Bristol Electronics

USA . 24 parts In-Stock

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24

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Semtec, LLC

USA . 2 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 1,952 parts In-Stock

1+ parts

$3.236

100+ parts

-

1k+ parts

$3.107

10k+ parts

$3.107

1,952

$3.236

-

$3.107

$3.107

Ampacity Inc.

Singapore . 4,586 parts In-Stock

1+ parts

$4.170

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-

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4,586

$4.170

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Corphita

USA . 4,635 parts In-Stock

1+ parts

$4.482

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4,635

$4.482

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$4.533

100+ parts

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1k+ parts

$4.352

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100

$4.533

-

$4.352

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Microchip USA

USA . 2,512 parts In-Stock

1+ parts

$24.280

100+ parts

$23.930

1k+ parts

$23.760

10k+ parts

$23.580

2,512

$24.280

$23.930

$23.760

$23.580

Parana Technologies

USA . 69 parts In-Stock

1+ parts

$24.882

100+ parts

-

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$25.572

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69

$24.882

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$25.572

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DigiPath Technology Company

USA . 2,010 parts In-Stock

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$27.398

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2,010

$27.398

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ChromeModa Solutions

Germany . 5,216 parts In-Stock

1+ parts

$27.957

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$22.925

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5,216

$27.957

$22.925

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IDEA Electronic Components Group

UK . 259 parts In-Stock

1+ parts

$27.957

100+ parts

$26.559

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$25.161

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259

$27.957

$26.559

$25.161

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QUARKTWIN TECHNOLOGY LTD

USA . 29,232 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 1,819 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Speed Components Ltd (Excess)

Israel . 39 parts In-Stock

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39

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Overview

Enhance your electronic designs with the DS90LV110TMTC/NOPB clock driver & buffer from Texas Instruments. Known for their high-quality components, Texas Instruments delivers reliable products that excel in performance and efficiency. Ideal for applications requiring precise signal synchronization, this differential input conditioning device offers a fast propagation delay of 3.6 ns at a nominal supply voltage of 3.3V. With a compact design and industrial-grade temperature range, this product is perfect for demanding environments. Trust Texas Instruments to provide you with the tools you need for success in your projects.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is durable and ensures the product's longevity.

Propagation Delay At Nominal Supply:

3.6 ns - This fast propagation delay ensures accurate timing in clock signals.

Surface Mount:

YES - Allows for easy installation on circuit boards.

Input Conditioning:

DIFFERENTIAL - Provides reliable data transmission and noise immunity.

Package Shape:

RECTANGULAR - Makes the product easy to handle and integrate into designs.

Nominal Supply Voltage:

3.3V - Works well within standard voltage requirements for various applications.

Load Capacitance:

5 pF - Suitable for driving low capacitance loads.

Power Supplies:

3.3V - Matches with common power supply voltages in electronic devices.

No. of Terminals:

28 - Offers flexibility in connecting the device within a circuit.

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH - Helps save space on the PCB.

Maximum Operating Temperature:

85 °C - Allows for reliable operation in various environmental conditions.

Output Characteristics:

3-STATE - Provides flexibility in controlling the output signal.

Minimum Operating Temperature:

40 °C - Ensures reliable performance even in low temperature environments.

Terminal Finish:

MATTE TIN - Provides good solderability and electrical conductivity.

Terminal Position:

DUAL - Facilitates easy connection and reduces the risk of errors.

Maximum Seated Height:

1.2 mm - Helps in designing compact devices.

Width:

4.4 mm - Compact size enables space-saving designs.

Minimum Supply Voltage:

3V - Supports operation in low voltage applications.

Maximum Time At Peak Reflow Temperature:

30s - Ensures robustness during manufacturing processes.

Peak Reflow Temperature:

260C - Withstands high-temperature manufacturing processes.

Length:

9.7 mm - Ideal for fitting into compact spaces.

Temperature Grade:

INDUSTRIAL - Suitable for use in industrial environments.

Technology:

CMOS - Offers low power consumption and high noise immunity.

Terminal Form:

GULL WING - Facilitates easy PCB mounting and soldering.

Packing Method:

TUBE - Provides convenient storage and transportation.

Terminal Pitch:

0.65 mm - Enables easy connectivity and reduces signal interference.

Maximum Same Edge Skew:

0.091 ns - Ensures accurate signal timing.

No. of True Outputs:

10 - Provides multiple output options for versatility in circuit design.

Moisture Sensitivity Level (MSL):

3 - Resistant to moisture damage during storage or operation.

Maximum Supply Voltage:

3.6V - Works within a safe voltage range to prevent damage.

Maximum Power Supply Current (ICC):

195 mA - Supports power requirements for driving multiple outputs.

Technical Specifications

Clock Drivers & Buffers DS90LV110TMTC/NOPB attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

90LV

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

9.7 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

195 mA

Propagation Delay At Nominal Supply:

3.6 ns

Propagation Delay (tpd):

3.6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.091 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

DS90LV110TMTC/NOPB Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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