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LMK1D1204PRHDR

Texas Instruments

LMK1D1204PRHDR by Texas Instruments

LMK1D1204PRHDR by Texas Instruments is a Clock Driver & Buffer with 0.575 ns Propagation Delay, 1.8V Nominal Voltage, and 2000 MHz Min fmax. It is used for applications requiring precise timing control in electronic systems, offering differential input conditioning and 3-STATE output characteristics.

Median Price

$10.680

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 38,280 parts In-Stock

1+ parts

$7.268

100+ parts

$5.925

1k+ parts

$3.950

10k+ parts

-

38,280

$7.268

$5.925

$3.950

-

Mouser Electronics

USA . 1,729 parts In-Stock

1+ parts

$10.680

100+ parts

$7.120

1k+ parts

$6.500

10k+ parts

$6.290

1,729

$10.680

$7.120

$6.500

$6.290

DigiKey

USA . 786 parts In-Stock

1+ parts

$10.680

100+ parts

$7.126

1k+ parts

$6.486

10k+ parts

$6.299

786

$10.680

$7.126

$6.486

$6.299

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,119 parts In-Stock

1+ parts

$6.905

100+ parts

-

1k+ parts

-

10k+ parts

-

4,119

$6.905

-

-

-

Vyrian

USA . 2,947 parts In-Stock

1+ parts

$7.268

100+ parts

-

1k+ parts

-

10k+ parts

-

2,947

$7.268

-

-

-

Chip Stock

USA . 325 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

325

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,547 parts In-Stock

1+ parts

$2.259

100+ parts

-

1k+ parts

$2.168

10k+ parts

$2.168

3,547

$2.259

-

$2.168

$2.168

Corphita

USA . 2,320 parts In-Stock

1+ parts

$6.541

100+ parts

-

1k+ parts

-

10k+ parts

-

2,320

$6.541

-

-

-

Parana Technologies

USA . 465 parts In-Stock

1+ parts

$16.000

100+ parts

-

1k+ parts

$16.344

10k+ parts

-

465

$16.000

-

$16.344

-

DigiPath Technology Company

USA . 1,864 parts In-Stock

1+ parts

$17.618

100+ parts

$16.209

1k+ parts

-

10k+ parts

-

1,864

$17.618

$16.209

-

-

ChromeModa Solutions

Germany . 5,476 parts In-Stock

1+ parts

$17.978

100+ parts

$14.742

1k+ parts

-

10k+ parts

-

5,476

$17.978

$14.742

-

-

IDEA Electronic Components Group

UK . 2,327 parts In-Stock

1+ parts

$17.978

100+ parts

$17.079

1k+ parts

$16.180

10k+ parts

-

2,327

$17.978

$17.079

$16.180

-

Overview

Unlock precision timing and synchronization with the LMK1D1204PRHDR by Texas Instruments. Crafted with expertise and quality materials, this clock driver offers impeccable performance in a compact chip carrier package. Ideal for applications requiring differential multiplexing and 3-state output characteristics, this device guarantees reliable operation even in extreme temperature conditions. Elevate your designs with fast propagation delay, low power consumption, and versatile terminal configurations. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 0.575 ns

Provides fast signal propagation, making the clock driver suitable for high-speed applications.

Surface Mount: YES

Allows for easy and secure mounting on the PCB, saving space and simplifying the manufacturing process.

Input Conditioning: DIFFERENTIAL MUX

Enables efficient and reliable signal processing, ensuring accurate clock distribution within the circuit.

Nominal Supply Voltage / Vsup (V): 1.8

Matches the standard supply voltage of most digital circuits, ensuring compatibility and easy integration.

No. of Terminals: 28

Offers sufficient connectivity options for interfacing with other components in the system.

Output Characteristics: 3-STATE

Provides flexibility in controlling the output signal, allowing for efficient power management.

Maximum Operating Temperature: 105 °C

Ensures reliable operation even in high-temperature environments, making the clock driver suitable for various applications.

Minimum Operating Temperature: -40 °C

Allows for operation in cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring signal integrity and longevity.

Technical Specifications

Clock Drivers & Buffers LMK1D1204PRHDR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 2.5 V AND 3.3 V POWER SUPPLY

Family:

LMK

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR, 13 INCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

72 mA

Propagation Delay At Nominal Supply:

.575 ns

Propagation Delay (tpd):

.575 ns

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Minimum fmax:

2000 MHz

Trade Compliance

LMK1D1204PRHDR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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