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ZL40225LDG1

Microchip Technology

ZL40225LDG1 by Microchip Technology

ZL40225LDG1 by Microchip offers 2ns propagation delay, operates at -40 to 85°C. With 32 terminals and differential mux input conditioning, it's ideal for clock distribution in various applications. This chip carrier with a very thin profile is surface mountable and supports a supply voltage range of 2.375V to 2.625V.

Median Price

$6.180

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$6.180

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Vyrian

USA . 6,039 parts In-Stock

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Continental Prestige Electronics

USA . 6,313 parts In-Stock

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$6.180

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$6.056

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Netroflash

USA . 500 parts In-Stock

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$6.180

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$6.056

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Ampacity Inc.

Singapore . 5,940 parts In-Stock

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$6.390

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$6.390

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Andel Nordic

Denmark . 1,068 parts In-Stock

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$9.173

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$8.806

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$8.806

1,068

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$8.806

QUARKTWIN TECHNOLOGY LTD

USA . 10,541 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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RGB Technical Solutions

Ukraine . 3,436 parts In-Stock

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Argo Parts USA

USA . 3,155 parts In-Stock

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Perfect Parts

USA . 2,738 parts In-Stock

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GreenTree Electronics

Israel . 187 parts In-Stock

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Overview

Upgrade your clock system with the ZL40225LDG1 by Microchip Technology, a high-quality clock driver and buffer that offers unmatched performance and reliability. With a propagation delay of just 2 ns and a differential mux input conditioning, this chip carrier package ensures seamless integration into your design. Whether you're working on networking equipment, telecommunications systems, or industrial applications, this clock driver provides the precision timing you need. Trust in Microchip Technology to deliver cutting-edge solutions that enhance the functionality of your products. Experience the difference with the ZL40225LDG1.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 2 ns

Low propagation delay ensures quick response time, making this product suitable for time-sensitive applications.

Surface Mount: YES

Surface mount design allows for easy installation and compact placement on circuit boards.

Input Conditioning: DIFFERENTIAL MUX

Differential MUX input conditioning enables efficient signal processing and data transmission.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard supply voltage, ensuring compatibility with common power sources.

No. of Terminals: 32

Sufficient terminals for connecting various components and interfaces within a circuit.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package styles offer different mounting options and thermal management solutions.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality even in extreme cold conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Maximum Same Edge Skew (tskwd): 0.1 ns

Low skew helps in maintaining signal integrity and synchronization in multi-output systems.

Technical Specifications

Clock Drivers & Buffers ZL40225LDG1 attributes and parameters. Explore more Clock Drivers & Buffers devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 3.3 V SUPPLY

Family:

4000/14000/40000

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TRAY

Propagation Delay At Nominal Supply:

2 ns

Propagation Delay (tpd):

2 ns

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

ZL40225LDG1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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