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5962-9754001QXA

Texas Instruments

5962-9754001QXA by Texas Instruments

The Texas Instruments clock driver 5962-9754001QXA features a propagation delay of 0.9 ns, 3.3V nominal voltage, and 12 true outputs. Ideal for military applications requiring high-speed signal processing with a temperature range from -55 to 125°C. This BICMOS technology device is MIL-PRF-38535 Class Q screened and offers a compact flatpack package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,576 parts In-Stock

1+ parts

-

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7,576

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Digiode

USA . 1,385 parts In-Stock

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-

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1,385

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 323 parts In-Stock

1+ parts

$7.747

100+ parts

-

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323

$7.747

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Parana Technologies

USA . 1,304 parts In-Stock

1+ parts

$11.441

100+ parts

-

1k+ parts

$11.861

10k+ parts

-

1,304

$11.441

-

$11.861

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DigiPath Technology Company

USA . 1,981 parts In-Stock

1+ parts

$12.598

100+ parts

-

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1,981

$12.598

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IDEA Electronic Components Group

UK . 1,157 parts In-Stock

1+ parts

$12.855

100+ parts

$12.212

1k+ parts

$11.570

10k+ parts

-

1,157

$12.855

$12.212

$11.570

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ChromeModa Solutions

Germany . 533 parts In-Stock

1+ parts

$12.855

100+ parts

$10.541

1k+ parts

-

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533

$12.855

$10.541

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Native Components

USA . 264 parts In-Stock

1+ parts

$14.587

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264

$14.587

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Northwest PG Solutions

USA . 1,865 parts In-Stock

1+ parts

$16.046

100+ parts

$14.442

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1,865

$16.046

$14.442

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One Stop Electronics

USA . 744 parts In-Stock

1+ parts

$48.000

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744

$48.000

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Corphita

USA . 2,620 parts In-Stock

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2,620

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Overview

Enhance your electronic projects with the Texas Instruments 5962-9754001QXA Clock Drivers & Buffers. Crafted with precision and expertise by Texas Instruments, this ceramic, glass-sealed package offers top-notch quality and reliability. Ideal for military-grade applications, this product boasts a fast propagation delay of 0.9 ns and a wide operating temperature range. With 12 true outputs and a maximum operating temperature of 125°C, this clock driver ensures optimal performance and efficiency for your designs. Upgrade your projects today with Texas Instruments' trusted technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides excellent protection for the internal components, ensuring durability and reliability in various operating conditions.

Propagation Delay At Nominal Supply: 0.9 ns

Ensures fast and efficient signal processing, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Facilitates easy installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard power supplies, making integration into existing systems straightforward.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for applications where heat dissipation is a concern.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Minimum fmax: 100 MHz

Capable of handling high-frequency signals, making it suitable for demanding applications that require rapid data processing.

Technical Specifications

Clock Drivers & Buffers 5962-9754001QXA attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDFP-F56

Length:

18.415 mm

Logic IC Type:

Maximum I (ol):

32 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

56

No. of True Outputs:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL56,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.75 ns

Screening Level:

MIL-PRF-38535 Class Q

Maximum Seated Height:

3.05 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9.655 mm

Minimum fmax:

100 MHz

Trade Compliance

5962-9754001QXA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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