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5962-9676101Q2X

Texas Instruments

5962-9676101Q2X by Texas Instruments

Texas Instruments' 5962-9676101Q2X is a Clock Driver & Buffer with 20 terminals, BICMOS technology, and 7ns propagation delay. Ideal for military applications, it operates b/w -55 to 125°C with a supply voltage range of 4.5V to 5.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,913 parts In-Stock

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7,913

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Digiode

USA . 3,725 parts In-Stock

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3,725

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 428 parts In-Stock

1+ parts

$0.664

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428

$0.664

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Northwest PG Solutions

USA . 1,397 parts In-Stock

1+ parts

$0.730

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1,397

$0.730

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AZTECH Wire

Italy . 514 parts In-Stock

1+ parts

$10.960

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514

$10.960

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Parana Technologies

USA . 1,757 parts In-Stock

1+ parts

$17.605

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$17.796

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1,757

$17.605

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$17.796

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DigiPath Technology Company

USA . 558 parts In-Stock

1+ parts

$19.385

100+ parts

$17.835

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558

$19.385

$17.835

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IDEA Electronic Components Group

UK . 912 parts In-Stock

1+ parts

$19.781

100+ parts

$18.792

1k+ parts

$17.803

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912

$19.781

$18.792

$17.803

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ChromeModa Solutions

Germany . 423 parts In-Stock

1+ parts

$19.781

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$16.220

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423

$19.781

$16.220

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One Stop Electronics

USA . 423 parts In-Stock

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$62.000

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423

$62.000

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Corphita

USA . 779 parts In-Stock

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779

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Overview

Unlock the power of precision and reliability with the 5962-9676101Q2X clock driver & buffer by Texas Instruments. Designed with quality in mind, this military-grade chip carrier offers unmatched performance in a range of applications. With fast propagation delay of 7ns and 8 true outputs, this square-shaped device ensures seamless operation in extreme temperatures from -55°C to 125°C. Trust Texas Instruments for cutting-edge technology and elevate your projects with the value and benefits this clock driver brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material provides durability and reliability for the product, ensuring it can withstand harsh operating conditions.

Surface Mount: YES

Being surface mountable allows for ease of installation and saves space on the circuit board, making it a convenient choice for compact designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes it compatible with a wide range of systems, offering versatility in application.

Propagation Delay (tpd): 7 ns

With a low propagation delay of only 7ns, this product ensures efficient and rapid signal processing, making it ideal for time-sensitive applications.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, this product is built to withstand extreme temperatures and harsh environments, ensuring reliability in critical applications.

No. of True Outputs: 8

Having 8 true outputs allows for versatile signal routing and distribution, making it suitable for complex clocking and buffering requirements.

Technical Specifications

Clock Drivers & Buffers 5962-9676101Q2X attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

STANDARD

JESD-30 Code:

S-CQCC-N20

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.8 ns

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

5962-9676101Q2X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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