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5962F9217402VXA

STMicroelectronics

5962F9217402VXA by STMicroelectronics

5962F9217402VXA by STMicroelectronics is a military-grade CMOS clock driver with a propagation delay of just 8.5 ns and operates b/w -55 °C to 125 °C. It features a ceramic, metal-sealed package and supports supply voltages from 2V to 5.5V. Ideal for high-reliability applications in aerospace and defense systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 1,883 parts In-Stock

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Digiode

USA . 671 parts In-Stock

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Anansix

USA . 539 parts In-Stock

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Prism Electronics

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Native Components

USA . 476 parts In-Stock

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Andel Nordic

Denmark . 497 parts In-Stock

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$7.887

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$7.571

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IDEA Electronic Components Group

UK . 111 parts In-Stock

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$14.991

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MKK Technologies

India . 872 parts In-Stock

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DigiPath Technology Company

USA . 872 parts In-Stock

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Corphita

USA . 3,951 parts In-Stock

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Parana Technologies

USA . 889 parts In-Stock

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Northwest PG Solutions

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Overview

Unlock unparalleled precision and reliability with the 5962F9217402VXA clock driver from STMicroelectronics, a leader in high-quality solutions for demanding applications. Designed for military-grade performance, this robust device thrives in extreme conditions while ensuring minimal delay and exceptional power efficiency. Perfect for aerospace, defense, and industrial systems, it empowers your designs with superior timing accuracy, ultimately enhancing system reliability and longevity. Trust in STMicroelectronics to deliver excellence that drives your success.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This robust body material provides enhanced durability and resistance to environmental factors, making the product suitable for harsh operating conditions.

Propagation Delay At Nominal Supply: 14 ns

A low propagation delay ensures fast signal processing, making this clock driver suitable for high-speed applications.

Surface Mount: YES

The surface mount technology enables efficient use of board space and facilitates automated assembly, contributing to reduced production costs.

Input Conditioning: STANDARD

Standard input conditioning simplifies circuit integration and ensures compatibility with a variety of input signal types.

Screening Level: MIL-PRF-38535 Class V

This screening level guarantees high reliability and performance in military and aerospace applications.

Package Shape: RECTANGULAR

The rectangular shape is well-suited for space-constrained designs, optimizing layout and component placement on PCBs.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V ensures lower power consumption, making the device ideal for battery-operated systems.

Power Supplies (V): 2/5.5

The wide range of acceptable power supply voltages allows for flexible design options across various applications.

No. of Terminals: 14

The 14-terminal configuration provides ample connectivity options, enhancing the versatility of the chip in different circuit designs.

Package Style (Meter): FLATPACK

The flatpack style aids in heat dissipation and further supports low-profile designs, fitting well into compact systems.

Maximum I (ol): 50 Amp

With a maximum output current of 50 Amps, this driver can handle demanding loads, making it suitable for high-performance applications.

Propagation Delay (tpd): 8.5 ns

An even lower propagation delay indicates superior performance in time-critical applications, enhancing overall system efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability under extreme conditions, essential for military and industrial applications.

Minimum Operating Temperature: -55 °C

The wide operating temperature range allows the device to function reliably in both very hot and very cold environments.

Terminal Position: DUAL

Dual terminal positioning facilitates flexible wiring options and simplified PCB design, accommodating various layouts.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V allows the driver to operate in low-power scenarios, enhancing battery life in portable devices.

Temperature Grade: MILITARY

Designed with military-grade specifications, this product meets stringent performance and reliability requirements for critical applications.

Total Dose (V): 300k Rad(Si)

The high total dose rating indicates excellent radiation resistance, making this clock driver suitable for space applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed performance, key advantages in modern electronics.

Terminal Form: FLAT

Flat terminal form enhances solderability and improves the mechanical stability of the connections, ensuring durable assembly.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easy integration with existing PCB designs and ensures a reliable electrical connection.

Maximum Same Edge Skew (tskwd): 0.7 ns

A low skew ensures synchronous operation of outputs, which is critical for maintaining signal integrity in complex circuits.

No. of True Outputs: 8

Having 8 true outputs provides significant flexibility and enables multiple signal distribution paths in a single device.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V accommodates higher signal levels, broadening the scope of applications for this clock driver.

Technical Specifications

Clock Drivers & Buffers 5962F9217402VXA attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

Family:

AC

Input Conditioning:

STANDARD

JESD-30 Code:

R-CDFP-F14

Logic IC Type:

Maximum I (ol):

50 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

14

No. of True Outputs:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL14,.25

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Qualified

Maximum Same Edge Skew (tskwd):

.7 ns

Screening Level:

MIL-PRF-38535 Class V

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Trade Compliance

5962F9217402VXA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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