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5962-9676101Q2A

Texas Instruments

5962-9676101Q2A by Texas Instruments

Texas Instruments' 5962-9676101Q2A is a Clock Driver & Buffer with 7ns Propagation Delay, suitable for military applications. It operates at 5V with 20 terminals in a chip carrier package, featuring BICMOS technology and MIL-PRF-38535 Class Q screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,741 parts In-Stock

1+ parts

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7,741

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Digiode

USA . 4,291 parts In-Stock

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4,291

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 483 parts In-Stock

1+ parts

$2.769

100+ parts

-

1k+ parts

$2.658

10k+ parts

$2.658

483

$2.769

-

$2.658

$2.658

AZTECH Wire

Italy . 250 parts In-Stock

1+ parts

$19.162

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-

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250

$19.162

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Parana Technologies

USA . 1,794 parts In-Stock

1+ parts

$27.017

100+ parts

-

1k+ parts

$31.270

10k+ parts

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1,794

$27.017

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$31.270

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DigiPath Technology Company

USA . 182 parts In-Stock

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$29.749

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182

$29.749

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IDEA Electronic Components Group

UK . 2,248 parts In-Stock

1+ parts

$30.356

100+ parts

$28.838

1k+ parts

$27.320

10k+ parts

-

2,248

$30.356

$28.838

$27.320

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ChromeModa Solutions

Germany . 2,023 parts In-Stock

1+ parts

$30.356

100+ parts

$24.892

1k+ parts

-

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2,023

$30.356

$24.892

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One Stop Electronics

USA . 1,271 parts In-Stock

1+ parts

$45.000

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1,271

$45.000

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Corphita

USA . 4,585 parts In-Stock

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4,585

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Northwest PG Solutions

USA . 1,801 parts In-Stock

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1,801

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Native Components

USA . 621 parts In-Stock

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621

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Overview

Enhance the performance of your electronic systems with the 5962-9676101Q2A clock driver and buffer from Texas Instruments. Known for their superior quality and reliability, Texas Instruments products are trusted by industry professionals worldwide. This versatile chip carrier package is ideal for a variety of applications, offering a fast propagation delay of 7ns and standard input conditioning. With a wide temperature range and military-grade screening level, this clock driver provides unmatched precision and efficiency. Upgrade your designs with Texas Instruments today and experience the difference in performance and reliability.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability, ensuring the product can withstand harsh environments and temperature fluctuations.

Propagation Delay At Nominal Supply: 7 ns

Fast propagation delay ensures accurate timing and synchronization, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with most electronic systems and makes integration seamless.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is reliable in extreme conditions and can handle rigorous usage.

Technical Specifications

Clock Drivers & Buffers 5962-9676101Q2A attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

STANDARD

JESD-30 Code:

S-CQCC-N20

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.8 ns

Screening Level:

MIL-PRF-38535 Class Q

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-9676101Q2A Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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