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KAI-29050-FXA-JD-B1

Onsemi

KAI-29050-FXA-JD-B1 by Onsemi

KAI-29050-FXA-JD-B1 by Onsemi is an image sensor with 5.5X5.5 um pixel size, 15.5 V max supply voltage, and 6644 horizontal pixels. Ideal for applications requiring high-quality imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,886 parts In-Stock

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Digiode

USA . 143 parts In-Stock

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AZTECH Wire

Italy . 521 parts In-Stock

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$16.310

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521

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TANS Electronics

Latvia . 8,346 parts In-Stock

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SupplyDigital Components

Austria . 5,194 parts In-Stock

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Problanco Electronics

Mexico . 4,575 parts In-Stock

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Kulean Microsystems

USA . 1,887 parts In-Stock

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UHIMA Technologies

Türkiye . 937 parts In-Stock

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Corohmni

South Africa . 482 parts In-Stock

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Corphita

USA . 435 parts In-Stock

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Overview

Elevate your imaging experience with the KAI-29050-FXA-JD-B1 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality image sensors that exceed expectations. Ideal for a wide range of applications, this CCD sensor offers unparalleled clarity and precision. With a sleek design and advanced technology, this product provides unmatched value and performance to customers. Upgrade your imaging projects with the KAI-29050-FXA-JD-B1 and unlock a world of possibilities.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Provides high resolution and sharp image quality.

Maximum Supply Voltage: 15.5 V

Allows for efficient power usage and reliability.

Body Width: 45.34 inch

Compact size for easy integration into various devices.

Power Supplies (V): 15

Stable power input for consistent performance.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensor for high-quality image capture.

Body Height: 3.61 mm

Low profile design for versatile applications.

Package Shape or Style: RECTANGULAR

Sleek and modern design for aesthetic appeal.

Minimum Supply Voltage: 14.5 V

Provides a safe operating range for the sensor.

Maximum Operating Temperature: 70 °C

Suitable for use in a wide range of environmental conditions.

Horizontal Pixel: 6644

High pixel count for detailed images.

Minimum Operating Temperature: -50 °C

Can withstand extreme cold temperatures.

Maximum Operating Current: 11 mA

Efficient power consumption for longer battery life.

Dynamic Range: 64 dB

Provides clear images with a wide range of brightness levels.

Vertical Pixel: 4452

High resolution for sharp vertical detail.

Body Length/Diameter: 47.24 mm

Optimal size for easy installation and compatibility.

Optical Format (inch): 11/8

Standard format for easy compatibility with lenses.

Data Rate: 40 Mbps

High data transfer rate for fast image processing.

Termination Type: SOLDER

Secure connection for reliable data transmission.

Frame Rate: 4 fps

Suitable for capturing slow-motion or still images.

Array Type: INTERLINE

Optimal sensor array design for efficient light capture.

Mounting Feature: THROUGH HOLE MOUNT

Easy installation process for quick setup.

Technical Specifications

Image Sensors KAI-29050-FXA-JD-B1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

45.34 inch

Body Height:

3.61 mm

Body Length/Diameter:

47.24 mm

Data Rate:

40 Mbps

Dynamic Range:

64 dB

Frame Rate:

4 fps

Horizontal Pixel:

6644

Mounting Feature:

Maximum Operating Current:

11 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

11/8

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

4452

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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