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KAI-2020-FBA-CP-BA

Onsemi

KAI-2020-FBA-CP-BA by Onsemi

KAI-2020-FBA-CP-BA by Onsemi is an Image Sensor with 7.4x7.4 um pixel size, offering a max supply voltage of 15.5 V and a dynamic range of 68 dB. Ideal for applications requiring high-resolution imaging in industrial and scientific fields.

Median Price

$1,006.785

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

$894.920

100+ parts

$841.220

1k+ parts

$787.530

10k+ parts

-

2

$894.920

$841.220

$787.530

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Verical

USA . 2 parts In-Stock

1+ parts

$1,118.650

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2

$1,118.650

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Distributors (In-Stock)

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Digiode

USA . 1,939 parts In-Stock

1+ parts

$989.624

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1,939

$989.624

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Vyrian

USA . 4,041 parts In-Stock

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4,041

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Distributors (Availability)

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AZTECH Wire

Italy . 270 parts In-Stock

1+ parts

$8.340

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270

$8.340

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Continental Prestige Electronics

USA . 2 parts In-Stock

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$884.250

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2

$884.250

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Corphita

USA . 376 parts In-Stock

1+ parts

$937.539

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376

$937.539

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Corohmni

South Africa . 229 parts In-Stock

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$1,041.710

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229

$1,041.710

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Kulean Microsystems

USA . 8,311 parts In-Stock

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8,311

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TANS Electronics

Latvia . 8,299 parts In-Stock

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8,299

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SupplyDigital Components

Austria . 5,088 parts In-Stock

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5,088

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Problanco Electronics

Mexico . 3,051 parts In-Stock

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3,051

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UHIMA Technologies

Türkiye . 792 parts In-Stock

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792

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Overview

Capture the essence of every moment with the KAI-2020-FBA-CP-BA image sensor by Onsemi. Designed with precision and expertise, this sensor offers unparalleled quality and reliability for a wide range of applications. From capturing stunning images to enhancing security systems, this sensor delivers exceptional performance and clarity. Experience the value and benefits of cutting-edge technology with Onsemi's KAI-2020-FBA-CP-BA, where innovation meets excellence.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Provides high resolution images with clear details.

Maximum Supply Voltage: 15.5 V

Allows for efficient power usage and reliable performance.

Body Width: 20.32 inch

Compact size makes it suitable for various applications.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD sensors offer high quality image capture with low noise levels.

Body Height: 4.44 mm

Slim design for easy integration into systems.

Package Shape or Style: RECTANGULAR

Standard shape for easy handling and mounting.

Minimum Supply Voltage: 14.5 V

Allows for a wide range of power supply options.

Maximum Operating Temperature: 70 °C

Can operate in high temperature environments without risk of damage.

Horizontal Pixel: 1600

High resolution for detailed image capture.

Minimum Operating Temperature: -50 °C

Can operate in extremely cold conditions without performance issues.

Housing: CERAMIC

Durable and reliable housing material for long-term use.

Dynamic Range: 68 dB

Provides a wide range of light sensitivity for versatile image capture.

Vertical Pixel: 1200

Offers a good balance between resolution and processing speed.

Body Length/Diameter: 33.02 mm

Optimal size for fitting into various devices or systems.

Termination Type: SOLDER

Secure and reliable connection method for stable performance.

Array Type: INTERLINE

Efficient design for capturing images with high sensitivity and low noise.

Mounting Feature: THROUGH HOLE MOUNT

Allows for easy and secure installation in different setups.

Technical Specifications

Image Sensors KAI-2020-FBA-CP-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 30 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 DB

Array Type:

INTERLINE

Body Width:

20.32 inch

Body Height:

4.44 mm

Body Length/Diameter:

33.02 mm

Dynamic Range:

68 dB

Horizontal Pixel:

1600

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1200

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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