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KAI-08051-FXA-JD-BA

Onsemi

KAI-08051-FXA-JD-BA by Onsemi

KAI-08051-FXA-JD-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 3296 horizontal pixels, and 2472 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

$3,282.750

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 195 parts In-Stock

1+ parts

$3,282.750

100+ parts

$1,853.790

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195

$3,282.750

$1,853.790

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Verical

USA . 195 parts In-Stock

1+ parts

$3,282.750

100+ parts

$1,853.790

1k+ parts

-

10k+ parts

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195

$3,282.750

$1,853.790

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,281 parts In-Stock

1+ parts

$3,118.612

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-

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1,281

$3,118.612

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Vyrian

USA . 6,121 parts In-Stock

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6,121

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 924 parts In-Stock

1+ parts

$8.440

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-

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924

$8.440

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Corphita

USA . 268 parts In-Stock

1+ parts

$2,954.475

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-

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268

$2,954.475

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Corohmni

South Africa . 437 parts In-Stock

1+ parts

$3,282.750

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437

$3,282.750

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Kulean Microsystems

USA . 4,636 parts In-Stock

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4,636

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TANS Electronics

Latvia . 2,677 parts In-Stock

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2,677

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Problanco Electronics

Mexico . 1,586 parts In-Stock

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1,586

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SupplyDigital Components

Austria . 1,216 parts In-Stock

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1,216

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UHIMA Technologies

Türkiye . 520 parts In-Stock

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520

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Perfect Parts

USA . 78 parts In-Stock

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78

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Overview

Discover the cutting-edge KAI-08051-FXA-JD-BA image sensor by Onsemi, setting new standards in imaging technology. With a pixel size of 5.5X5.5 um and impressive dynamic range of 66 dB, this sensor delivers unparalleled clarity and precision in image capture. Perfect for applications in surveillance, medical imaging, and industrial automation, this sensor ensures crisp, detailed images in any environment. Trust in Onsemi's superior quality and innovation to enhance your imaging experience like never before. Elevate your projects with the unbeatable performance and reliability of the KAI-08051-FXA-JD-BA.

Feature Benefit Bullets

Pixel Size (um) 5.5X5.5

Small pixel size allows for high resolution images with sharp details.

Maximum Supply Voltage 15.5 V

Higher supply voltage allows for increased performance and functionality.

Body Width 29 inch

Compact body width makes it suitable for various applications where space is limited.

Sensors or Transducers Type IMAGE SENSOR,CCD

CCD sensors provide high-quality image capture with low noise levels.

Package Shape or Style RECTANGULAR

Rectangular package shape makes it easy to integrate into different devices and systems.

Minimum Supply Voltage 14.5 V

Low minimum supply voltage helps in conserving power and energy efficiency.

Maximum Operating Temperature 70 °C

Wide operating temperature range allows for use in various environmental conditions.

Horizontal Pixel 3296

High horizontal pixel count enables detailed and high-resolution images.

Minimum Operating Temperature -50 °C

Low minimum operating temperature ensures the sensor can function in cold environments.

Dynamic Range 66 dB

Wide dynamic range allows for capturing both bright and dark areas in the same scene.

Vertical Pixel 2472

High vertical pixel count helps in capturing detailed images with more information.

Body Length/Diameter 40 mm

Compact body length makes it suitable for integration into small devices and systems.

Optical Format (inch) 4/3

Standard optical format provides compatibility with various lenses and accessories.

Termination Type SOLDER

Solder termination type ensures secure and reliable connections during integration.

Array Type INTERLINE

Interline array type offers faster readout speeds and reduced image lag.

Mounting Feature THROUGH HOLE MOUNT

Through hole mounting feature provides a sturdy and secure attachment method for the sensor.

Technical Specifications

Image Sensors KAI-08051-FXA-JD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 39 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

29 inch

Body Length/Diameter:

40 mm

Dynamic Range:

66 dB

Horizontal Pixel:

3296

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

4/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2472

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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