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KAI-08051-AXA-JP-BA

Onsemi

KAI-08051-AXA-JP-BA by Onsemi

Onsemi's KAI-08051-AXA-JP-BA is a 5.5x5.5 um pixel size CCD image sensor with 3296H x 2472V resolution, offering a dynamic range of 66 dB. It operates b/w -50 to 70 °C and has a supply voltage range of 14.5V to 15.5V, making it suitable for high-quality imaging applications in various industries.

Median Price

$1,105.590

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 9 parts In-Stock

1+ parts

$755.000

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9

$755.000

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Arrow

USA . 142 parts In-Stock

1+ parts

$1,105.590

100+ parts

$1,076.870

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142

$1,105.590

$1,076.870

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Verical

USA . 142 parts In-Stock

1+ parts

$1,105.590

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$1,076.870

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-

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142

$1,105.590

$1,076.870

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Distributors (In-Stock)

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Digiode

USA . 1,480 parts In-Stock

1+ parts

$717.250

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1,480

$717.250

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Nova Conductors

Japan . 500 parts In-Stock

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$756.710

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500

$756.710

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Vyrian

USA . 7,144 parts In-Stock

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7,144

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Distributors (Availability)

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AZTECH Wire

Italy . 181 parts In-Stock

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$16.990

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181

$16.990

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Corphita

USA . 2,336 parts In-Stock

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$679.500

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2,336

$679.500

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Corohmni

South Africa . 213 parts In-Stock

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$755.000

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213

$755.000

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Kulean Microsystems

USA . 7,349 parts In-Stock

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7,349

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SupplyDigital Components

Austria . 6,557 parts In-Stock

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6,557

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TANS Electronics

Latvia . 3,329 parts In-Stock

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3,329

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Problanco Electronics

Mexico . 2,367 parts In-Stock

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2,367

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UHIMA Technologies

Türkiye . 479 parts In-Stock

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479

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Overview

Capture stunning images with the KAI-08051-AXA-JP-BA Image Sensor from Onsemi, known for their top-notch quality and innovation in the industry. This sensor boasts a pixel size of 5.5X5.5 um, offering unparalleled clarity and sharpness in every shot. Whether you're in the field of surveillance, medical imaging, or industrial inspection, this sensor delivers exceptional performance and reliability. Elevate your products and projects with the superior technology of the KAI-08051-AXA-JP-BA, providing value, efficiency, and results that exceed expectations.

Feature Benefit Bullets

Pixel Size (um) 5.5X5.5

The small pixel size allows for high resolution images to be captured with great detail.

Maximum Supply Voltage 15.5 V

Allows for flexibility in power supply options and can handle higher voltage inputs.

Body Width 29 inch

Compact size makes it easy to integrate into various devices without taking up much space.

Sensors or Transducers Type IMAGE SENSOR,CCD

CCD sensors are known for their high-quality image capture capabilities, making this a reliable choice for imaging purposes.

Package Shape or Style RECTANGULAR

The rectangular shape allows for easy installation and alignment within devices.

Minimum Supply Voltage 14.5 V

Even with a slightly lower minimum supply voltage, this sensor can still function efficiently.

Maximum Operating Temperature 70 °C

Can operate in relatively high temperatures, making it suitable for various environments.

Horizontal Pixel 3296

High horizontal pixel count results in detailed and high-resolution images being captured.

Minimum Operating Temperature -50 °C

Can handle extremely cold temperatures, suitable for use in various climates.

Dynamic Range 66 dB

The high dynamic range allows for capturing a wide range of light intensities in a single image.

Vertical Pixel 2472

High vertical pixel count complements the high horizontal pixel count for detailed images.

Body Length/Diameter 40 mm

Compact body size makes it easy to fit into devices without compromising on performance.

Optical Format (inch) 4/3

The 4/3 optical format provides a good balance between image quality and sensor size.

Termination Type SOLDER

Solder termination ensures a secure and durable connection for long-lasting performance.

Array Type INTERLINE

The interline array type allows for faster readout speeds and reduced image lag.

Mounting Feature THROUGH HOLE MOUNT

Through hole mounting provides a stable and secure attachment method for the sensor.

Technical Specifications

Image Sensors KAI-08051-AXA-JP-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 39 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

29 inch

Body Length/Diameter:

40 mm

Dynamic Range:

66 dB

Horizontal Pixel:

3296

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

4/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2472

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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