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AR0134CSSC00SUEA0-DPBR1

Onsemi

AR0134CSSC00SUEA0-DPBR1 by Onsemi

Onsemi's AR0134CSSC00SUEA0-DPBR1 image sensor features 3.75um pixel size, 50MHz master clock, and 1280x960 resolution. Ideal for applications requiring high-quality imaging in a compact form factor such as surveillance cameras or industrial machine vision systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

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Flip Electronics

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Digiode

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Northwest PG Solutions

USA . 2,273 parts In-Stock

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AZTECH Wire

Italy . 545 parts In-Stock

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SupplyDigital Components

Austria . 7,327 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 1,762 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 770 parts In-Stock

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Native Components

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Corohmni

South Africa . 103 parts In-Stock

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Overview

Capture stunning images with the AR0134CSSC00SUEA0-DPBR1 image sensor from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. Ideal for a wide range of applications, this image sensor offers unparalleled value, delivering crisp and clear images with a dynamic range of 64dB. Whether you're capturing moments in high-speed photography or monitoring security systems, this sensor provides exceptional performance in any situation. Upgrade your imaging capabilities today with the AR0134CSSC00SUEA0-DPBR1 and experience the difference.

Feature Benefit Bullets

Pixel Size (um): 3.75

Smaller pixel size allows for higher resolution images to be captured with more detail.

Maximum Supply Voltage: 1.95 V

Higher maximum supply voltage ensures stable and reliable operation of the image sensor.

Master Clock: 50 MHz

High master clock frequency enables fast image capture and processing.

Body Width: 9 inch

Compact body width allows for easy integration into various devices or systems.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS sensors are known for low power consumption, high sensitivity, and fast operation, making them a popular choice for image sensors.

Package Shape or Style: SQUARE

Square package shape provides efficient use of space and easier mounting on circuit boards.

Minimum Supply Voltage: 1.7 V

Lower minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures the image sensor can perform reliably even in demanding environmental conditions.

Horizontal Pixel: 1280

High horizontal pixel count results in high-resolution images with more detailed information.

Output Range: 0.40-2.5V

Wide output range allows for flexibility in signal processing and compatibility with different systems.

Output Type: DIGITAL CURRENT

Digital current output provides accurate and reliable data transmission for further processing.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures the image sensor can function effectively in cold environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Terminal finish with a mix of tin, silver, and copper provides good conductivity and corrosion resistance.

Maximum Operating Current: 60 mA

Higher maximum operating current allows for more power to be supplied to the image sensor for improved performance.

Dynamic Range: 64 dB

Good dynamic range ensures that the image sensor can capture a wide range of light intensities without losing detail.

Vertical Pixel: 960

High vertical pixel count contributes to the overall resolution and quality of images captured by the sensor.

Body Length/Diameter: 9 mm

Compact body length/diameter makes the image sensor suitable for small and slim devices.

Optical Format (inch): 1/3

1/3 inch optical format provides a good balance between image quality and sensor size.

Data Rate: 700 Mbps

High data rate allows for fast and efficient transfer of image data to external devices or processors.

Termination Type: SOLDER

Solder termination type provides a secure and reliable connection to the circuit board.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies the connection to other devices or systems for easy integration.

Frame Rate: 60 fps

High frame rate ensures smooth and fluid motion capture in video recordings.

Array Type: SINGLE FRAME

Single frame array type simplifies the sensor design and reduces complexity for easy implementation.

Mounting Feature: SURFACE MOUNT

Surface mount feature allows for easy and secure installation on circuit boards for mass production.

Technical Specifications

Image Sensors AR0134CSSC00SUEA0-DPBR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.5-3.1V

Array Type:

SINGLE FRAME

Body Width:

9 inch

Body Height:

1.4 mm

Body Length/Diameter:

9 mm

Data Rate:

700 Mbps

Dynamic Range:

64 dB

Frame Rate:

60 fps

Horizontal Pixel:

1280

JESD-609 Code:

e1

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

60 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

960

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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