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Small Signal Field Effect Transistors (FET)

Small Signal Field Effect Transistors (FET) are electronic devices used in low-power applications to amplify and switch small signals. They are commonly used in applications such as audio amplifiers, signal processing, and low-power digital circuits.

Small Signal FETs are designed to handle low-power levels and operate at low to medium frequencies, typically in the range of a few Hz to several MHz. They have a high gain and low noise figure, making them suitable for small signal amplification.

The Small Signal FET consists of a gate, source, and drain electrode, and works by controlling the flow of majority charge carriers (electrons or holes) between the source and drain regions through the gate electrode. When a voltage is applied to the gate electrode, it creates an electric field that modifies the conductivity of the channel, allowing current to flow between the source and drain.

Proper use of Small Signal FETs is important to ensure optimal performance, reliability, and compatibility with other components in the circuit. Small Signal FETs are often used in conjunction with other components, such as capacitors and resistors, to form complete low-power electronic circuits.

Small Signal Field Effect Transistors (FET)

Available Parts 998

Part# Info Specs
Part RoHS Manufacturer Description Additional Features Avalanche Energy Rating (EAS) Case Connection Maximum Collector Current (IC) Configuration Minimum DC Current Gain (hFE) Minimum DS Breakdown Voltage Maximum Drain Current (Abs) (ID) Maximum Drain Current (ID) Maximum Drain-Source On Resistance Field Effect Transistor Technology Maximum Feedback Capacitance (Crss) JEDEC-95 Code JESD-30 Code JESD-609 Code Moisture Sensitivity Level (MSL) No. of Elements No. of Terminals Operating Mode Maximum Operating Temperature Minimum Operating Temperature Package Body Material Package Shape Package Style (Meter) Peak Reflow Temperature (C) Polarity or Channel Type Maximum Power Dissipation Ambient Maximum Power Dissipation (Abs) Maximum Pulsed Drain Current (IDM) Qualification Reference Standard Sub-Category Surface Mount Terminal Finish Terminal Form Terminal Position Maximum Time At Peak Reflow Temperature (s) Transistor Application Transistor Element Material Maximum Turn Off Time (toff) Maximum Turn On Time (ton) Maximum VCEsat
SFT1345-TL-H by Onsemi

SFT1345-TL-H

Onsemi

The Onsemi SFT1345-TL-H is a P-CHANNEL FET with 11A max drain current and 35W max power dissipation. Ideal for surface mount applications, it features metal-oxide semiconductor technology and tin bismuth terminal finish.

SINGLE

11 A

11 A

METAL-OXIDE SEMICONDUCTOR

e6

1

1

260

P-CHANNEL

35 W

Other Transistors

YES

TIN BISMUTH

30

DMN2013UFDEQ-7 by Diodes Incorporated

DMN2013UFDEQ-7

Diodes Incorporated

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.03 W; JESD-30 Code: S-PBCC-N3; Additional Features: HIGH RELIABILITY;

HIGH RELIABILITY

DRAIN

SINGLE WITH BUILT-IN DIODE

20 V

10.5 A

10.5 A

.013 ohm

METAL-OXIDE SEMICONDUCTOR

S-PBCC-N3

e4

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

SQUARE

CHIP CARRIER

260

N-CHANNEL

2.03 W

AEC-Q101

FET General Purpose Power

YES

NICKEL PALLADIUM GOLD

NO LEAD

BOTTOM

30

SWITCHING

SILICON

DMN4027SSDQ-13 by Diodes Incorporated

DMN4027SSDQ-13

Diodes Incorporated

N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 17.2 W; JESD-609 Code: e3; Maximum Drain-Source On Resistance: .027 ohm;

HIGH RELIABILITY

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

40 V

7.1 A

5.4 A

.027 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G8

e3

1

2

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

17.2 W

AEC-Q101

FET General Purpose Power

YES

MATTE TIN

GULL WING

DUAL

30

SWITCHING

SILICON

BSO130P03SNTMA1 by Infineon Technologies

BSO130P03SNTMA1

Infineon Technologies

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Shape: RECTANGULAR; Maximum Drain Current (ID): 9.2 A; Peak Reflow Temperature (C): NOT SPECIFIED;

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

SINGLE WITH BUILT-IN DIODE

30 V

9.2 A

.013 ohm

METAL-OXIDE SEMICONDUCTOR

870 pF

R-PDSO-G8

1

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

P-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SWITCHING

SILICON

BSL215CL6327HTSA1 by Infineon Technologies

BSL215CL6327HTSA1

Infineon Technologies

N-CHANNEL AND P-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Feedback Capacitance (Crss): 9 pF;

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

20 V

1.5 A

.14 ohm

METAL-OXIDE SEMICONDUCTOR

9 pF

R-PDSO-G6

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL AND P-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSL308CL6327HTSA1 by Infineon Technologies

BSL308CL6327HTSA1

Infineon Technologies

N-CHANNEL AND P-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Element Material: SILICON; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Feedback Capacitance (Crss): 17 pF;

AVALANCHE RATED

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

30 V

2.3 A

.057 ohm

METAL-OXIDE SEMICONDUCTOR

17 pF

R-PDSO-G6

2

6

ENHANCEMENT MODE

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL AND P-CHANNEL

AEC-Q101

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSL316CL6327HTSA1 by Infineon Technologies

BSL316CL6327HTSA1

Infineon Technologies

Infineon's BSL316CL6327HTSA1 is a Small Signal FET with N/P-Channel, 2 elements & built-in diode. Operating in enhancement mode, it has max drain current of 1.4A and on-resistance of 0.16 ohm. Ideal for applications requiring high-speed switching in compact designs at up to 150°C.

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

30 V

1.4 A

.16 ohm

METAL-OXIDE SEMICONDUCTOR

7 pF

R-PDSO-G6

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL AND P-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSD816SNL6327HTSA1 by Infineon Technologies

BSD816SNL6327HTSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): NOT SPECIFIED; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;

AVALANCHE RATED

SINGLE WITH BUILT-IN DIODE

20 V

1.4 A

.16 ohm

METAL-OXIDE SEMICONDUCTOR

10 pF

R-PDSO-G6

1

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSL202SNL6327HTSA1 by Infineon Technologies

BSL202SNL6327HTSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Form: GULL WING; No. of Elements: 1; Package Style (Meter): SMALL OUTLINE;

SINGLE WITH BUILT-IN DIODE

20 V

7.5 A

.022 ohm

METAL-OXIDE SEMICONDUCTOR

60 pF

R-PDSO-G6

1

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSL205NL6327HTSA1 by Infineon Technologies

BSL205NL6327HTSA1

Infineon Technologies

N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Package Style (Meter): SMALL OUTLINE; Transistor Element Material: SILICON;

AVALANCHE RATED

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

20 V

2.5 A

.05 ohm

METAL-OXIDE SEMICONDUCTOR

24 pF

R-PDSO-G6

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSL214NL6327HTSA1 by Infineon Technologies

BSL214NL6327HTSA1

Infineon Technologies

N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED; Package Body Material: PLASTIC/EPOXY;

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

20 V

1.5 A

.14 ohm

METAL-OXIDE SEMICONDUCTOR

9 pF

R-PDSO-G6

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSL215PL6327HTSA1 by Infineon Technologies

BSL215PL6327HTSA1

Infineon Technologies

P-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Qualification: Not Qualified; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G6;

AVALANCHE RATED

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

20 V

1.5 A

.15 ohm

METAL-OXIDE SEMICONDUCTOR

128 pF

R-PDSO-G6

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

P-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSL302SNL6327HTSA1 by Infineon Technologies

BSL302SNL6327HTSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Element Material: SILICON; Maximum Drain-Source On Resistance: .025 ohm; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;

SINGLE WITH BUILT-IN DIODE

30 V

7.1 A

.025 ohm

METAL-OXIDE SEMICONDUCTOR

43 pF

R-PDSO-G6

1

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSL306NL6327HTSA1 by Infineon Technologies

BSL306NL6327HTSA1

Infineon Technologies

N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): 2.3 A; Qualification: Not Qualified; Additional Features: AVALANCHE RATED;

AVALANCHE RATED

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

30 V

2.3 A

.057 ohm

METAL-OXIDE SEMICONDUCTOR

17 pF

R-PDSO-G6

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSL308PEL6327HTSA1 by Infineon Technologies

BSL308PEL6327HTSA1

Infineon Technologies

Infineon's BSL308PEL6327HTSA1 is a P-CHANNEL FET with 2 elements, built-in diode, and 30V DS breakdown voltage. Ideal for small outline applications, it operates in enhancement mode with max ID of 2.1A and 0.08Ω RDS(on), featuring a max temp of 150°C.

LOGIC LEVEL COMPATIBLE

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

30 V

2.1 A

.08 ohm

METAL-OXIDE SEMICONDUCTOR

7.8 pF

R-PDSO-G6

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

P-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSL315PL6327HTSA1 by Infineon Technologies

BSL315PL6327HTSA1

Infineon Technologies

P-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR; Operating Mode: ENHANCEMENT MODE;

AVALANCHE RATED

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

30 V

1.5 A

.15 ohm

METAL-OXIDE SEMICONDUCTOR

84 pF

R-PDSO-G6

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

P-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSL802SNL6327HTSA1 by Infineon Technologies

BSL802SNL6327HTSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): 7.5 A; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Elements: 1;

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

SINGLE WITH BUILT-IN DIODE

20 V

7.5 A

.022 ohm

METAL-OXIDE SEMICONDUCTOR

77 pF

R-PDSO-G6

1

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSL806NL6327HTSA1 by Infineon Technologies

BSL806NL6327HTSA1

Infineon Technologies

N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): NOT SPECIFIED; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

20 V

2.3 A

.057 ohm

METAL-OXIDE SEMICONDUCTOR

28.6 pF

R-PDSO-G6

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSS123L6327HTSA1 by Infineon Technologies

BSS123L6327HTSA1

Infineon Technologies

BSS123L6327HTSA1 by Infineon is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A ID, and 6 ohm RDS(on). Ideal for small outline applications, it operates in enhancement mode with a peak reflow temp of 260°C.

LOGIC LEVEL COMPATIBLE

SINGLE WITH BUILT-IN DIODE

100 V

.17 A

6 ohm

METAL-OXIDE SEMICONDUCTOR

6.3 pF

R-PDSO-G3

e3

1

3

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

Not Qualified

YES

MATTE TIN

GULL WING

DUAL

40

SILICON

BSS119L6327HTSA1 by Infineon Technologies

BSS119L6327HTSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;

LOGIC LEVEL COMPATIBLE

SINGLE WITH BUILT-IN DIODE

100 V

.17 A

6 ohm

METAL-OXIDE SEMICONDUCTOR

4.1 pF

R-PDSO-G3

e3

1

3

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.36 W

Not Qualified

YES

MATTE TIN

GULL WING

DUAL

40

SILICON

BSR315PL6327HTSA1 by Infineon Technologies

BSR315PL6327HTSA1

Infineon Technologies

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .62 A; Minimum DS Breakdown Voltage: 60 V; JESD-30 Code: R-PDSO-G3;

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

SINGLE WITH BUILT-IN DIODE

60 V

.62 A

.8 ohm

METAL-OXIDE SEMICONDUCTOR

30 pF

R-PDSO-G3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

P-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSR316PL6327HTSA1 by Infineon Technologies

BSR316PL6327HTSA1

Infineon Technologies

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-609 Code: e3; Operating Mode: ENHANCEMENT MODE; Maximum Drain-Source On Resistance: 1.8 ohm;

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

SINGLE WITH BUILT-IN DIODE

.36 A

1.8 ohm

METAL-OXIDE SEMICONDUCTOR

20 pF

R-PDSO-G3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

P-CHANNEL

Not Qualified

YES

MATTE TIN

GULL WING

DUAL

SILICON

BSR92PL6327HTSA1 by Infineon Technologies

BSR92PL6327HTSA1

Infineon Technologies

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): NOT SPECIFIED; Transistor Element Material: SILICON; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

SINGLE WITH BUILT-IN DIODE

250 V

.14 A

11 ohm

METAL-OXIDE SEMICONDUCTOR

8 pF

R-PDSO-G3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

P-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSL314PEL6327HTSA1 by Infineon Technologies

BSL314PEL6327HTSA1

Infineon Technologies

P-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: .14 ohm; No. of Elements: 2; Maximum Drain Current (ID): 1.5 A;

LOGIC LEVEL COMPATIBLE

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

30 V

1.5 A

.14 ohm

METAL-OXIDE SEMICONDUCTOR

11 pF

R-PDSO-G6

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

P-CHANNEL

Not Qualified

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

BSD314SPEH6327XTSA1 by Infineon Technologies

BSD314SPEH6327XTSA1

Infineon Technologies

Infineon's BSD314SPEH6327XTSA1 is a P-CHANNEL FET with 30V DS Breakdown Voltage. It features SINGLE configuration with BUILT-IN DIODE, suitable for ENHANCEMENT MODE applications. With 0.5W power dissipation and -55 to 150 °C operating range, it meets AEC-Q101 standards for automotive use.

SINGLE WITH BUILT-IN DIODE

30 V

1.5 A

.14 ohm

METAL-OXIDE SEMICONDUCTOR

11 pF

R-PDSO-G6

e3

1

1

6

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

P-CHANNEL

.5 W

AEC-Q101

YES

TIN

GULL WING

DUAL

SILICON

2SJ360(TE12L,F) by Toshiba

2SJ360(TE12L,F)

Toshiba

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.5 W; Minimum DS Breakdown Voltage: 60 V; Maximum Drain Current (ID): 1 A;

DRAIN

SINGLE WITH BUILT-IN DIODE

60 V

1 A

1 A

1.2 ohm

METAL-OXIDE SEMICONDUCTOR

TO-243AA

R-PSSO-F3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

P-CHANNEL

1.5 W

Other Transistors

YES

FLAT

SINGLE

NOT SPECIFIED

SWITCHING

SILICON

MCH3375-TL-H by Onsemi

MCH3375-TL-H

Onsemi

MCH3375-TL-H by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, 1.6A Drain Current, and 0.295 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max temp of 150°C. Package: PLASTIC/EPOXY, Surface Mountable RECTANGULAR shape with FLAT terminals.

SINGLE WITH BUILT-IN DIODE

30 V

1.6 A

1.6 A

.295 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-F3

e6

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

P-CHANNEL

.8 W

Other Transistors

YES

TIN BISMUTH

FLAT

DUAL

30

SWITCHING

SILICON

SI2392DS-T1-GE3 by Vishay Intertechnology

SI2392DS-T1-GE3

Vishay Intertechnology

SI2392DS-T1-GE3 by Vishay Intertechnology is a N-channel FET with 100V DS breakdown voltage, 3.1A max drain current, and 0.126 ohm max on resistance. Ideal for switching applications due to its single configuration with built-in diode and enhancement mode operation. Package style is small outline, surface mountable with Gull Wing terminals.

SINGLE WITH BUILT-IN DIODE

100 V

3.1 A

.126 ohm

METAL-OXIDE SEMICONDUCTOR

TO-236AB

R-PDSO-G3

e3

1

1

3

ENHANCEMENT MODE

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

YES

Matte Tin (Sn)

GULL WING

DUAL

30

SWITCHING

SILICON

5LN01SP-AC by Onsemi

5LN01SP-AC

Onsemi

5LN01SP-AC by Onsemi is a N-CHANNEL FET with max drain current of 0.1A and power dissipation of 0.25W. Ideal for applications requiring single configuration, it operates at up to 150°C making it suitable for various electronic devices.

SINGLE

.1 A

.1 A

METAL-OXIDE SEMICONDUCTOR

e2

1

150 Cel

N-CHANNEL

.25 W

FET General Purpose Power

NO

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

NVLJD4007NZTBG by Onsemi

NVLJD4007NZTBG

Onsemi

NVLJD4007NZTBG by Onsemi is a N-CHANNEL FET with max drain current of 0.245A and power dissipation of 0.755W. Ideal for applications requiring small signal amplification in surface mount technology, operating at up to 150 °C.

.245 A

.245 A

METAL-OXIDE SEMICONDUCTOR

e3

1

150 Cel

260

N-CHANNEL

.755 W

FET General Purpose Power

YES

MATTE TIN

30

NTTFS4C06NTWG by Onsemi

NTTFS4C06NTWG

Onsemi

NTTFS4C06NTWG by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 67A Drain Current, and 0.0061 ohm On Resistance. Ideal for SWITCHING applications in small outline packages with 5 terminals and 31W Power Dissipation at 150°C max temp.

DRAIN

SINGLE WITH BUILT-IN DIODE

30 V

67 A

11 A

.0061 ohm

METAL-OXIDE SEMICONDUCTOR

S-PDSO-F5

e3

1

1

5

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

SQUARE

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL

31 W

FET General Purpose Power

YES

Matte Tin (Sn) - annealed

FLAT

DUAL

NOT SPECIFIED

SWITCHING

SILICON

NTTFS4C13NTAG by Onsemi

NTTFS4C13NTAG

Onsemi

NTTFS4C13NTAG by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage and 38A Drain Current. Ideal for SWITCHING applications, it features a built-in diode, 0.0094 ohm On Resistance, and operates in ENHANCEMENT MODE. This small outline transistor has a max power dissipation of 21.5W and can withstand temperatures up to 150 °C.

DRAIN

SINGLE WITH BUILT-IN DIODE

30 V

38 A

7.2 A

.0094 ohm

METAL-OXIDE SEMICONDUCTOR

S-PDSO-F5

e3

1

1

5

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

SQUARE

SMALL OUTLINE

260

N-CHANNEL

21.5 W

FET General Purpose Power

YES

Matte Tin (Sn) - annealed

FLAT

DUAL

30

SWITCHING

SILICON

NTTFS4C13NTWG by Onsemi

NTTFS4C13NTWG

Onsemi

NTTFS4C13NTWG by Onsemi is a N-channel FET with 30V DS breakdown voltage and 38A max drain current. Ideal for switching applications, it features a built-in diode, 0.0094 ohm RDS(on), and operates in enhancement mode. With a small outline package style and max power dissipation of 21.5W, it is suitable for high-temperature environments up to 150 °C.

DRAIN

SINGLE WITH BUILT-IN DIODE

30 V

38 A

7.2 A

.0094 ohm

METAL-OXIDE SEMICONDUCTOR

S-PDSO-F5

e3

1

1

5

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

SQUARE

SMALL OUTLINE

260

N-CHANNEL

21.5 W

FET General Purpose Power

YES

Matte Tin (Sn) - annealed

FLAT

DUAL

30

SWITCHING

SILICON

5LP01SS-TL-E by Onsemi

5LP01SS-TL-E

Onsemi

5LP01SS-TL-E by Onsemi is a P-CHANNEL FET with 0.07A max drain current and 0.15W power dissipation. Ideal for applications requiring surface mount technology, such as temperature-sensitive circuits in consumer electronics.

SINGLE

.07 A

.07 A

METAL-OXIDE SEMICONDUCTOR

e6

1

1

150 Cel

P-CHANNEL

.15 W

Other Transistors

YES

Tin/Bismuth (Sn/Bi)

MCH3376-TL-E by Onsemi

MCH3376-TL-E

Onsemi

MCH3376-TL-E by Onsemi is a P-CHANNEL FET with 1.5A max drain current and 0.8W power dissipation. Ideal for applications requiring surface mount technology, such as in METAL-OXIDE SEMICONDUCTOR circuits operating up to 150 °C.

SINGLE

1.5 A

1.5 A

METAL-OXIDE SEMICONDUCTOR

e6

1

1

150 Cel

260

P-CHANNEL

.8 W

Other Transistors

YES

TIN BISMUTH

30

SCH1330-TL-H by Onsemi

SCH1330-TL-H

Onsemi

SCH1330-TL-H by Onsemi is a P-CHANNEL FET with 1.5A max drain current and 1W max power dissipation. Ideal for surface mount applications, it operates at up to 150 °C making it suitable for various electronic devices requiring high temperature resistance.

SINGLE

1.5 A

1.5 A

METAL-OXIDE SEMICONDUCTOR

e6

1

1

150 Cel

260

P-CHANNEL

1 W

Other Transistors

YES

TIN BISMUTH

30

SCH1332-TL-H by Onsemi

SCH1332-TL-H

Onsemi

SCH1332-TL-H by Onsemi is a P-CHANNEL FET with 2.5A max drain current and 1W power dissipation. Ideal for surface mount applications, it operates up to 150 °C, making it suitable for various electronic devices requiring high-performance transistors.

SINGLE

2.5 A

2.5 A

METAL-OXIDE SEMICONDUCTOR

e6

1

1

150 Cel

260

P-CHANNEL

1 W

Other Transistors

YES

TIN BISMUTH

30

SCH1343-TL-H by Onsemi

SCH1343-TL-H

Onsemi

SCH1343-TL-H by Onsemi is a P-CHANNEL FET with 3.5A max drain current and 1W power dissipation. Ideal for applications requiring high temperature tolerance up to 150 °C, it features surface mount configuration for compact designs in electronics.

SINGLE

3.5 A

3.5 A

METAL-OXIDE SEMICONDUCTOR

e6

1

1

150 Cel

P-CHANNEL

1 W

Other Transistors

YES

Tin/Bismuth (Sn/Bi)

CPH3360-TL-H by Onsemi

CPH3360-TL-H

Onsemi

CPH3360-TL-H by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 1.6A Drain Current, 0.303 ohm On Resistance, and 150 °C Operating Temperature. Package: PLASTIC/EPOXY, GULL WING terminals in SMALL OUTLINE style.

SINGLE WITH BUILT-IN DIODE

30 V

1.6 A

1.6 A

.303 ohm

METAL-OXIDE SEMICONDUCTOR

TO-236

R-PDSO-G3

e6

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

P-CHANNEL

.9 W

Other Transistors

YES

Tin/Bismuth (Sn/Bi)

GULL WING

DUAL

SWITCHING

SILICON

STL3NK40 by STMicroelectronics

STL3NK40

STMicroelectronics

STL3NK40 by STMicroelectronics is a N-CHANNEL FET with 400V DS breakdown voltage. It operates in enhancement mode, has 4 terminals, and features a built-in diode. Ideal for switching applications due to low 5.5 ohm RDS(on) and small outline package style.

AVALANCHE RATED

DRAIN

SINGLE WITH BUILT-IN DIODE

400 V

5.5 ohm

METAL-OXIDE SEMICONDUCTOR

6 pF

1

4

ENHANCEMENT MODE

PLASTIC/EPOXY

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL

DUAL

NOT SPECIFIED

SWITCHING

SILICON

SCH1345-TL-H by Onsemi

SCH1345-TL-H

Onsemi

SCH1345-TL-H by Onsemi is a P-CHANNEL FET with 4.5A max drain current and 1W max power dissipation. Ideal for applications requiring high temperature resistance up to 150 °C, such as in surface mount configurations for electronic devices.

SINGLE

4.5 A

4.5 A

METAL-OXIDE SEMICONDUCTOR

e6

1

1

150 Cel

260

P-CHANNEL

1 W

Other Transistors

YES

TIN BISMUTH

30

BSP171PL6327HTSA1 by Infineon Technologies

BSP171PL6327HTSA1

Infineon Technologies

Infineon's BSP171PL6327HTSA1 is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring SINGLE configuration with BUILT-IN DIODE, it has 1.9A ID and 0.3 ohm RDS(on). AEC-Q101 compliant, this MOSFET offers ENHANCEMENT MODE operation in a SMALL OUTLINE package.

LOGIC LEVEL COMPATIBLE, AVALANCHE RATED

DRAIN

SINGLE WITH BUILT-IN DIODE

60 V

1.9 A

.3 ohm

METAL-OXIDE SEMICONDUCTOR

55 pF

R-PDSO-G4

e3

1

4

ENHANCEMENT MODE

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

P-CHANNEL

AEC-Q101

YES

MATTE TIN

GULL WING

DUAL

SWITCHING

SILICON

BSS84PL6327HTSA1 by Infineon Technologies

BSS84PL6327HTSA1

Infineon Technologies

BSS84PL6327HTSA1 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode, operating in enhancement mode. With a max drain current of 0.17A and on-resistance of 12 ohm, it offers reliable performance in small outline packages at temperatures up to 150°C.

LOGIC LEVEL COMPATIBLE, AVALANCHE RATED

SINGLE WITH BUILT-IN DIODE

60 V

.17 A

.17 A

12 ohm

METAL-OXIDE SEMICONDUCTOR

3 pF

R-PDSO-G3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

P-CHANNEL

.36 W

AEC-Q101

Other Transistors

YES

MATTE TIN

GULL WING

DUAL

SWITCHING

SILICON

PMV30XN,215 by NXP Semiconductors

PMV30XN,215

NXP Semiconductors

PMV30XN,215 by NXP Semiconductors is an N-channel FET designed for efficient switching applications. It features a max drain current of 3.2 A, a breakdown voltage of 20 V, and operates at up to 150 °C. Ideal for compact electronic designs with surface mount capabilities.

SINGLE WITH BUILT-IN DIODE

20 V

3.2 A

3.2 A

.035 ohm

METAL-OXIDE SEMICONDUCTOR

TO-236AB

R-PDSO-G3

e3

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.52 W

IEC-60134

FET General Purpose Power

YES

TIN

GULL WING

DUAL

30

SWITCHING

SILICON

PMDPB38UNE,115 by NXP Semiconductors

PMDPB38UNE,115

NXP Semiconductors

NXP Semiconductors' PMDPB38UNE,115 is a N-CHANNEL FET with 2 elements and built-in diode for switching applications. It has a max drain current of 5A, min DS breakdown voltage of 20V, and max power dissipation of 0.51W. This small outline transistor operates in enhancement mode at up to 150°C.

DRAIN

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

20 V

5 A

4 A

.061 ohm

METAL-OXIDE SEMICONDUCTOR

S-PDSO-N6

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

SQUARE

SMALL OUTLINE

N-CHANNEL

.51 W

IEC-60134

FET General Purpose Power

YES

NO LEAD

DUAL

SWITCHING

SILICON

PMGD175XN,115 by NXP Semiconductors

PMGD175XN,115

NXP Semiconductors

PMGD175XN,115 by NXP Semiconductors is a N-CHANNEL FET for SWITCHING applications. It features 30V DS Breakdown Voltage, 0.9A Drain Current, and 0.225 ohm On Resistance. With a PLASTIC/EPOXY body and GULL WING terminals, it operates in ENHANCEMENT MODE at up to 150°C.

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

30 V

.9 A

.9 A

.225 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G6

e3

1

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.905 W

IEC-60134

FET General Purpose Power

YES

TIN

GULL WING

DUAL

30

SWITCHING

SILICON

PMDPB95XNE,115 by NXP Semiconductors

PMDPB95XNE,115

NXP Semiconductors

PMDPB95XNE,115 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 30V. It is used for switching applications and has a max drain current of 3.1A and max power dissipation of 6.25W.

DRAIN

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

30 V

3.1 A

2.4 A

.12 ohm

METAL-OXIDE SEMICONDUCTOR

S-PDSO-N6

e3

1

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

SQUARE

SMALL OUTLINE

260

N-CHANNEL

6.25 W

IEC-60134

FET General Purpose Power

YES

TIN

NO LEAD

DUAL

30

SWITCHING

SILICON

PMV65UN,215 by NXP Semiconductors

PMV65UN,215

NXP Semiconductors

PMV65UN,215 by NXP Semiconductors is an N-channel FET designed for switching applications. It features a max drain current of 2.2 A, a breakdown voltage of 20 V, and operates at up to 150 °C. Its compact surface mount design ensures efficient performance in electronic circuits.

SINGLE WITH BUILT-IN DIODE

20 V

2.2 A

2 A

.076 ohm

METAL-OXIDE SEMICONDUCTOR

TO-236AB

R-PDSO-G3

e3

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

2.17 W

IEC-60134

FET General Purpose Power

YES

TIN

GULL WING

DUAL

30

SWITCHING

SILICON