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5LN01SP-AC

Onsemi

5LN01SP-AC by Onsemi

5LN01SP-AC by Onsemi is a N-CHANNEL FET with max drain current of 0.1A and power dissipation of 0.25W. Ideal for applications requiring single configuration, it operates at up to 150°C making it suitable for various electronic devices.

Median Price

$0.094

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 21 parts In-Stock

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$0.094

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21

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Chip Stock

USA . 38,000 parts In-Stock

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38,000

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Vyrian

USA . 9,457 parts In-Stock

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9,457

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Digiode

USA . 2,074 parts In-Stock

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2,074

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VNN

France . 618 parts In-Stock

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618

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Distributors (Availability)

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Corohmni

South Africa . 85 parts In-Stock

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$0.092

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85

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Netroflash

USA . 500 parts In-Stock

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$0.094

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500

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AZTECH Wire

Italy . 544 parts In-Stock

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$6.669

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544

$6.669

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Ampacity Inc.

Singapore . 392 parts In-Stock

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$30.050

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392

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Component Stockers USA

USA . 715 parts In-Stock

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$99.990

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715

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 27,434 parts In-Stock

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TANS Electronics

Latvia . 7,734 parts In-Stock

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CPlus Electronics

USA . 7,500 parts In-Stock

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SupplyDigital Components

Austria . 6,486 parts In-Stock

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Glotronic Ltd.

UK . 2,780 parts In-Stock

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2,780

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Corphita

USA . 1,701 parts In-Stock

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Perfect Parts

USA . 1,496 parts In-Stock

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Problanco Electronics

Mexico . 1,434 parts In-Stock

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1,434

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Kulean Microsystems

USA . 396 parts In-Stock

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396

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UHIMA Technologies

Türkiye . 244 parts In-Stock

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244

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Overview

Elevate your electronic projects with the 5LN01SP-AC by Onsemi, a top-tier manufacturer known for delivering high-quality components. As part of the Small Signal Field Effect Transistors category, this N-CHANNEL FET offers reliability and efficiency in a SINGLE configuration. Ideal for a wide range of applications, this METAL-OXIDE SEMICONDUCTOR technology ensures optimal performance even in demanding conditions. Trust in Onsemi to provide you with the value and benefits you need to take your designs to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher electron mobility, making them suitable for high-speed switching applications.

Configuration: SINGLE

Single configuration FETs are easier to control and require less complex circuitry, making them more reliable and cost-effective.

Maximum Drain Current (Abs) (ID): 0.1 A

With a maximum drain current of 0.1 A, this FET can handle moderate power requirements, suitable for many small signal applications.

Maximum Power Dissipation (Abs): 0.25 W

The low maximum power dissipation of 0.25 W indicates that this FET operates efficiently and generates minimal heat, enhancing overall reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FET technology offers good performance characteristics, such as fast switching speeds and low power consumption.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand higher temperatures, making it suitable for demanding environmental conditions.

Terminal Finish: Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

The choice of terminal finish ensures good conductivity and resistance to oxidation, enhancing the longevity and reliability of the FET.

Maximum Drain Current (ID): 0.1 A

With a maximum drain current of 0.1 A, this FET can reliably handle current flow in small signal applications without the risk of overload.

Technical Specifications

Small Signal Field Effect Transistors (FET) 5LN01SP-AC attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.1 A

Maximum Drain Current (ID):

.1 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e2

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Trade Compliance

5LN01SP-AC Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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