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5LN01M

Onsemi

5LN01M by Onsemi

5LN01M by Onsemi is a N-CHANNEL FET with 50V DS breakdown voltage, 0.1A drain current, and 7.8 ohm on resistance. It's used for switching applications in enhancement mode, featuring a built-in diode and resistor. The transistor operates at up to 150 °C with a power dissipation of 0.15W in a small outline package.

Median Price

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2

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1k+

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Vyrian

USA . 1,721 parts In-Stock

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Digiode

USA . 352 parts In-Stock

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Native Components

USA . 938 parts In-Stock

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$10.373

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Northwest PG Solutions

USA . 239 parts In-Stock

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$11.410

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$10.269

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Metaverse IC Inc.

Canada . 306,000 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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TANS Electronics

Latvia . 6,740 parts In-Stock

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Problanco Electronics

Mexico . 3,042 parts In-Stock

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SupplyDigital Components

Austria . 2,158 parts In-Stock

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UHIMA Technologies

Türkiye . 618 parts In-Stock

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Corohmni

South Africa . 374 parts In-Stock

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Corphita

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Kulean Microsystems

USA . 98 parts In-Stock

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Overview

Looking for a reliable Small Signal Field Effect Transistor for your switching applications? Look no further than the 5LN01M by Onsemi. With its high-quality construction and N-CHANNEL configuration, this transistor offers exceptional performance and durability. Whether you're working on industrial automation or consumer electronics, this transistor with a built-in diode and resistor provides the perfect solution. Trust Onsemi's expertise in semiconductor technology to deliver unmatched value and efficiency. Upgrade your projects today with the 5LN01M!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Ensures durability and protection of the internal components, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching operations and easy integration into circuits.

Minimum DS Breakdown Voltage: 50 V

Provides a high level of voltage protection, ensuring the reliability of the transistor in different applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Facilitates easy and secure mounting onto circuit boards, saving space and simplifying assembly.

Maximum Drain Current (Abs): 0.1 A

Handles high currents effectively, making it suitable for applications that require robust performance.

Maximum Power Dissipation (Abs): 0.15 W

Ensures efficient power handling capabilities, preventing overheating and maintaining stability.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, making it suitable for use in various industrial and commercial settings.

Technical Specifications

Small Signal Field Effect Transistors (FET) 5LN01M attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

50 V

Maximum Drain Current (Abs) (ID):

.1 A

Maximum Drain Current (ID):

.1 A

Maximum Drain-Source On Resistance:

7.8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

5LN01M Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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