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NTTFS4C13NTAG

Onsemi

NTTFS4C13NTAG by Onsemi

NTTFS4C13NTAG by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage and 38A Drain Current. Ideal for SWITCHING applications, it features a built-in diode, 0.0094 ohm On Resistance, and operates in ENHANCEMENT MODE. This small outline transistor has a max power dissipation of 21.5W and can withstand temperatures up to 150 °C.

Median Price

$0.558

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 9,697 parts In-Stock

1+ parts

$0.900

100+ parts

$0.364

1k+ parts

$0.222

10k+ parts

-

9,697

$0.900

$0.364

$0.222

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DigiKey

USA . 2,455 parts In-Stock

1+ parts

$0.900

100+ parts

$0.364

1k+ parts

$0.279

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2,455

$0.900

$0.364

$0.279

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Rochester

USA . 697,400 parts In-Stock

1+ parts

-

100+ parts

$0.215

1k+ parts

$0.179

10k+ parts

$0.159

697,400

-

$0.215

$0.179

$0.159

Verical

USA . 697,400 parts In-Stock

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$0.199

697,400

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$0.199

Distributors (In-Stock)

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Digiode

USA . 1,279 parts In-Stock

1+ parts

$0.220

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-

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1,279

$0.220

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Bristol Electronics

USA . 289 parts In-Stock

1+ parts

$0.750

100+ parts

$0.278

1k+ parts

$0.240

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289

$0.750

$0.278

$0.240

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Flip Electronics

USA . 200,000 parts In-Stock

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Chip Stock

USA . 96,770 parts In-Stock

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96,770

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Vyrian

USA . 8,547 parts In-Stock

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8,547

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Prism Electronics

USA . 330 parts In-Stock

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330

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Microfarads

USA . 146 parts In-Stock

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146

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Distributors (Availability)

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Corphita

USA . 1,340 parts In-Stock

1+ parts

$0.209

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1,340

$0.209

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Corohmni

South Africa . 324 parts In-Stock

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$0.232

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324

$0.232

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Continental Prestige Electronics

USA . 928,850 parts In-Stock

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$0.490

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928,850

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$0.490

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Metaverse IC Inc.

Canada . 139,090 parts In-Stock

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RC Electronics

USA . 93,410 parts In-Stock

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Futuretech Components

Singapore . 30,000 parts In-Stock

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Perfect Parts

USA . 22,400 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,609 parts In-Stock

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16,609

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S.R.D Solutions

India . 7,200 parts In-Stock

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Kulean Microsystems

USA . 5,135 parts In-Stock

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SupplyDigital Components

Austria . 4,106 parts In-Stock

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Problanco Electronics

Mexico . 3,895 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kepictronics

USA . 1,500 parts In-Stock

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UHIMA Technologies

Türkiye . 443 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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TANS Electronics

Latvia . 23 parts In-Stock

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Overview

Unleash the power of innovation with the NTTFS4C13NTAG Small Signal Field Effect Transistor by Onsemi. Designed for switching applications, this N-Channel transistor offers unrivaled performance and reliability. With a maximum drain current of 7.2A and a minimum DS breakdown voltage of 30V, this transistor is perfect for a wide range of electronic devices. Trust in Onsemi's expertise and experience to bring you cutting-edge technology that delivers exceptional value and efficiency. Elevate your projects with the NTTFS4C13NTAG and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type N-CHANNEL

Allows for efficient switching and control of current flow, making it suitable for various applications.

Maximum Drain Current (Abs) (ID) 38 A

Capable of handling high current loads, making it suitable for applications that require robust performance.

Maximum Power Dissipation (Abs) 21.5 W

Can dissipate heat effectively, preventing overheating and ensuring stable operation.

Maximum Operating Temperature 150 °C

Designed to operate at high temperatures, making it suitable for industrial and automotive applications.

Field Effect Transistor Technology METAL-OXIDE SEMICONDUCTOR

Provides high switching speeds and low power consumption, enhancing the efficiency of the product.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTTFS4C13NTAG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

38 A

Maximum Drain Current (ID):

7.2 A

Maximum Drain-Source On Resistance:

.0094 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTTFS4C13NTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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