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NTTFS4C25NTWG

Onsemi

NTTFS4C25NTWG by Onsemi

NTTFS4C25NTWG by Onsemi is a N-CHANNEL FET with 27A max drain current and 20.2W power dissipation. Utilizes metal-oxide semiconductor technology, operates up to 150°C, ideal for high-power applications requiring surface mount configuration.

Median Price

$0.221

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

$0.221

1k+ parts

$0.183

10k+ parts

$0.163

45,000

-

$0.221

$0.183

$0.163

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,017 parts In-Stock

1+ parts

$0.187

100+ parts

-

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1,017

$0.187

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.244

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10

$0.244

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Chip Stock

USA . 20,000 parts In-Stock

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20,000

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Cyclops Electronics Ltd

UK . 10,725 parts In-Stock

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10,725

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Sensible Micro Corp

USA . 5,000 parts In-Stock

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5,000

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Vyrian

USA . 3,177 parts In-Stock

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3,177

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Prism Electronics

USA . 200 parts In-Stock

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200

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Distributors (Availability)

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Ampacity Inc.

Singapore . 44,612 parts In-Stock

1+ parts

$0.167

100+ parts

-

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44,612

$0.167

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Corphita

USA . 2,341 parts In-Stock

1+ parts

$0.177

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2,341

$0.177

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Corohmni

South Africa . 117 parts In-Stock

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$0.197

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117

$0.197

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Argo Parts USA

USA . 4,603 parts In-Stock

1+ parts

$0.244

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$0.237

4,603

$0.244

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$0.237

Continental Prestige Electronics

USA . 864 parts In-Stock

1+ parts

$0.244

100+ parts

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10k+ parts

$0.239

864

$0.244

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$0.239

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$2.065

100+ parts

$1.879

1k+ parts

$1.693

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-

3,000

$2.065

$1.879

$1.693

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AZTECH Wire

Italy . 377 parts In-Stock

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$11.320

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377

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iodParts Technologies Inc.

India . 18,415 parts In-Stock

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TANS Electronics

Latvia . 6,888 parts In-Stock

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Problanco Electronics

Mexico . 6,849 parts In-Stock

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SupplyDigital Components

Austria . 6,069 parts In-Stock

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Kulean Microsystems

USA . 4,859 parts In-Stock

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4,859

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Lixinc

USA . 1,581 parts In-Stock

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1,581

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Netroflash

USA . 1,000 parts In-Stock

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$0.239

1k+ parts

$0.232

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$0.227

1,000

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$0.239

$0.232

$0.227

UHIMA Technologies

Türkiye . 518 parts In-Stock

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518

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Overview

Discover the NTTFS4C25NTWG by Onsemi, a high-quality N-CHANNEL Small Signal Field Effect Transistor that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in semiconductor technology, this FET is ideal for a variety of applications. With a maximum drain current of 27 A and a maximum power dissipation of 20.2 W, this surface-mount transistor is designed to deliver efficient and effective results. Trust in the value and benefits of the NTTFS4C25NTWG for your next project.

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL FETs are commonly used in low-side switching applications, making them versatile and suitable for a variety of circuit designs.

Configuration

The single configuration simplifies the circuit design and can save space in the overall system layout.

Surface Mount

Surface mount FETs are easier to assemble on PCBs, reducing manufacturing time and costs.

Maximum Drain Current (Abs) (ID)

With a high maximum drain current, this FET can handle large power loads without overheating or failing.

Maximum Power Dissipation (Abs)

The high power dissipation rating ensures that the FET can operate effectively under heavy load conditions.

Field Effect Transistor Technology

Metal-oxide semiconductor technology offers high performance and reliability for various applications.

Maximum Operating Temperature

The high operating temperature range allows this FET to be used in demanding environments without sacrificing performance.

Terminal Finish

Matte tin terminals provide good solderability and ensure a reliable electrical connection in assembly.

Maximum Time At Peak Reflow Temperature (s)

The short time at peak reflow temperature minimizes thermal stress on the component during manufacturing processes.

Peak Reflow Temperature °C

With a high peak reflow temperature, this FET can withstand the soldering process without damage, ensuring long-term reliability.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTTFS4C25NTWG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

27 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTTFS4C25NTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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