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NTTFS4C25NTAG

Onsemi

NTTFS4C25NTAG by Onsemi

NTTFS4C25NTAG by Onsemi is a N-CHANNEL FET with 27A max drain current and 20.2W power dissipation. It operates at up to 150°C, making it suitable for high-power applications in various industries such as automotive and industrial electronics.

Median Price

$0.221

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,317,471 parts In-Stock

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-

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$0.227

1,317,471

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$0.227

Rochester

USA . 901,476 parts In-Stock

1+ parts

-

100+ parts

$0.221

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$0.183

10k+ parts

$0.163

901,476

-

$0.221

$0.183

$0.163

Verical

USA . 502,361 parts In-Stock

1+ parts

-

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-

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$0.204

502,361

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-

$0.204

Distributors (In-Stock)

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Digiode

USA . 1,096 parts In-Stock

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$0.187

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1,096

$0.187

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Nova Conductors

Japan . 48 parts In-Stock

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$0.217

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48

$0.217

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Vyrian

USA . 1,042,971 parts In-Stock

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1,042,971

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Chip Stock

USA . 62,000 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 907,818 parts In-Stock

1+ parts

$0.167

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907,818

$0.167

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Corphita

USA . 1,270 parts In-Stock

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$0.177

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1,270

$0.177

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Corohmni

South Africa . 64 parts In-Stock

1+ parts

$0.197

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64

$0.197

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Continental Prestige Electronics

USA . 4,593 parts In-Stock

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$0.217

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$0.213

4,593

$0.217

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$0.213

Argo Parts USA

USA . 1,395 parts In-Stock

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$0.217

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$0.210

1,395

$0.217

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$0.210

Netroflash

USA . 100 parts In-Stock

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$0.217

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$0.213

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100

$0.217

$0.213

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Lixinc

USA . 7,716 parts In-Stock

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7,716

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TANS Electronics

Latvia . 5,757 parts In-Stock

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Kulean Microsystems

USA . 5,667 parts In-Stock

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Kepictronics

USA . 4,500 parts In-Stock

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4,500

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Problanco Electronics

Mexico . 3,152 parts In-Stock

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SupplyDigital Components

Austria . 1,270 parts In-Stock

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1,270

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UHIMA Technologies

Türkiye . 420 parts In-Stock

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420

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Overview

Unlock the power of cutting-edge technology with the NTTFS4C25NTAG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Small Signal Field Effect Transistors that are perfect for a wide range of applications. With a maximum drain current of 27A and a maximum power dissipation of 20.2W, this N-CHANNEL FET offers unparalleled performance and reliability. Say goodbye to limitations and hello to endless possibilities with the NTTFS4C25NTAG.

Feature Benefit Bullets

Polarity or Channel Type:

N-CHANNEL - Provides efficient operation for a wide range of applications.

Configuration:

SINGLE - Simplifies circuit design and layout for ease of use.

Surface Mount:

YES - Allows for easy integration onto PCBs for compact and space-saving designs.

Maximum Drain Current (Abs) (ID):

27 A - Capable of handling high current loads effectively.

Maximum Power Dissipation (Abs):

20.2 W - Ensures stable performance under high-power conditions.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Offers reliable and consistent switching characteristics.

Maximum Operating Temperature:

150 °C - Suitable for a wide range of operating environments.

Terminal Finish:

MATTE TIN - Provides a durable finish for robust solder connections.

Maximum Time At Peak Reflow Temperature (s):

30 - Facilitates easy and efficient soldering during assembly.

Peak Reflow Temperature °C:

260 - Withstands high-temperature reflow processes for reliable manufacturing.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTTFS4C25NTAG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

27 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTTFS4C25NTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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