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NTTFS018N12MC

Onsemi

NTTFS018N12MC by Onsemi

NTTFS018N12MC by Onsemi is a N-CHANNEL FET with 120V DS Breakdown Voltage and 0.018 ohm RDS. It operates in Enhancement Mode, suitable for applications requiring high drain-source resistance and temperature range from -55 to 150 °C. Ideal for compact designs due to its small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,861 parts In-Stock

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Vyrian

USA . 690 parts In-Stock

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690

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Problanco Electronics

Mexico . 8,000 parts In-Stock

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TANS Electronics

Latvia . 7,502 parts In-Stock

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Kulean Microsystems

USA . 4,027 parts In-Stock

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Corphita

USA . 1,833 parts In-Stock

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SupplyDigital Components

Austria . 1,476 parts In-Stock

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UHIMA Technologies

Türkiye . 709 parts In-Stock

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709

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Corohmni

South Africa . 293 parts In-Stock

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Overview

Discover the NTTFS018N12MC by Onsemi, a high-quality Small Signal Field Effect Transistor (FET) designed to enhance your electronic projects. With Onsemi's reputation for excellence in semiconductor manufacturing, this N-channel transistor offers reliability and performance. Ideal for applications requiring low on-resistance and high efficiency, this FET boasts a built-in diode for added convenience. Experience the value of seamless operation and optimal functionality with the NTTFS018N12MC by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and durability for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have better conductivity and lower ON resistance compared to P-Channel transistors.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode offers additional functionality and protection, making the transistor versatile in different circuit designs.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

Minimum DS Breakdown Voltage: 120 V

The high breakdown voltage ensures reliability and protection against electrical surges in the circuit.

Package Shape: SQUARE

The square shape is compact and facilitates easy placement on the PCB, optimizing space usage.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control and higher efficiency in amplification applications.

No. of Terminals: 8

Having 8 terminals provides flexibility in circuit connections and allows for various configurations.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low power consumption, making it suitable for high-performance applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures stability and reliability under elevated temperature conditions.

Transistor Element Material: SILICON

Silicon transistors offer stable performance and low leakage currents, suitable for a wide range of applications.

Maximum Drain-Source On Resistance: 0.018 ohm

Low ON resistance means minimal power loss and efficient operation in switching applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and connections, enabling various configurations.

Case Connection: DRAIN

The drain connection offers efficient heat dissipation and helps maintain optimal operating temperatures for the transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTTFS018N12MC attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

120 V

Maximum Drain-Source On Resistance:

.018 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Element Material:

SILICON

Trade Compliance

NTTFS018N12MC Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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