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NTTFS024N06CTAG

Onsemi

NTTFS024N06CTAG by Onsemi

NTTFS024N06CTAG by Onsemi is a N-channel FET with 60V DS breakdown voltage and 24A max drain current. Ideal for power management applications, it operates in enhancement mode with a low on-resistance of 0.0226 ohm. Suitable for surface mount designs, it has a max power dissipation of 28W and can withstand temperatures from -55 to 175 °C.

Median Price

$0.664

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 12,000 parts In-Stock

1+ parts

$0.567

100+ parts

$0.268

1k+ parts

$0.174

10k+ parts

$0.141

12,000

$0.567

$0.268

$0.174

$0.141

DigiKey

USA . 1,500 parts In-Stock

1+ parts

$0.760

100+ parts

$0.304

1k+ parts

$0.231

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-

1,500

$0.760

$0.304

$0.231

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Mouser Electronics

USA . 917 parts In-Stock

1+ parts

$0.760

100+ parts

$0.304

1k+ parts

$0.183

10k+ parts

$0.146

917

$0.760

$0.304

$0.183

$0.146

Flip Electronics (Authorized)

USA . 45,000 parts In-Stock

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45,000

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Verical

USA . 33,000 parts In-Stock

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$0.126

33,000

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$0.126

Distributors (In-Stock)

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Flip Electronics

USA . 31,500 parts In-Stock

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Vyrian

USA . 6,299 parts In-Stock

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6,299

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Digiode

USA . 2,411 parts In-Stock

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2,411

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Distributors (Availability)

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Microchip USA

USA . 2,464 parts In-Stock

1+ parts

$3.783

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2,464

$3.783

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AZTECH Wire

Italy . 58 parts In-Stock

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$18.360

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58

$18.360

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SupplyDigital Components

Austria . 8,018 parts In-Stock

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TANS Electronics

Latvia . 8,013 parts In-Stock

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Kulean Microsystems

USA . 4,509 parts In-Stock

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Corphita

USA . 1,618 parts In-Stock

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1,618

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UHIMA Technologies

Türkiye . 344 parts In-Stock

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Corohmni

South Africa . 159 parts In-Stock

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Problanco Electronics

Mexico . 4 parts In-Stock

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Overview

Discover the cutting-edge NTTFS024N06CTAG by Onsemi, a high-quality Small Signal Field Effect Transistor (FET) with N-CHANNEL polarity and a single configuration with built-in diode. This innovative product offers exceptional performance and reliability for a wide range of applications. With a minimum DS Breakdown Voltage of 60V and a maximum Drain Current of 24A, this FET delivers superior power dissipation and efficiency. Trust Onsemi's expertise in semiconductor technology and enhance your projects with the value and benefits of the NTTFS024N06CTAG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow through the transistor, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Offers additional functionality with the built-in diode, providing versatility in circuit design.

Minimum DS Breakdown Voltage: 60 V

Ensures a high breakdown voltage, allowing the transistor to handle higher voltages safely.

Maximum Power Dissipation (Abs): 28 W

Can dissipate significant amounts of power without overheating, making it suitable for high-power applications.

Maximum Operating Temperature: 175 °C

Can operate efficiently at high temperatures, increasing reliability in various environments.

Maximum Drain Current (ID): 24 A

Capable of handling high current loads, making it suitable for power amplification applications.

Maximum Drain-Source On Resistance: 0.0226 ohm

Low on-resistance leads to minimal power loss and efficient operation of the transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTTFS024N06CTAG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

24 A

Maximum Drain-Source On Resistance:

.0226 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTTFS024N06CTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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