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NTTFS3A08PZTWG

Onsemi

NTTFS3A08PZTWG by Onsemi

NTTFS3A08PZTWG by Onsemi is a P-CHANNEL FET with 22A max drain current and 4.9W power dissipation. Ideal for applications requiring high power handling in surface mount configurations, such as automotive electronics and power management systems.

Median Price

$0.674

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 28,085 parts In-Stock

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$0.440

28,085

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$0.440

Flip Electronics (Authorized)

USA . 28,085 parts In-Stock

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28,085

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Rochester

USA . 375 parts In-Stock

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$0.674

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$0.559

10k+ parts

$0.499

375

-

$0.674

$0.559

$0.499

Verical

USA . 375 parts In-Stock

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$1.014

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375

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$1.014

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Distributors (In-Stock)

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Vyrian

USA . 1,870 parts In-Stock

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$0.550

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1,870

$0.550

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Digiode

USA . 2,334 parts In-Stock

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$0.633

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2,334

$0.633

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Chip Stock

USA . 66,000 parts In-Stock

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Flip Electronics

USA . 28,085 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 130 parts In-Stock

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$0.550

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130

$0.550

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Corphita

USA . 1,486 parts In-Stock

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$0.599

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1,486

$0.599

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Kulean Microsystems

USA . 6,938 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,024 parts In-Stock

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Microchip USA

USA . 5,793 parts In-Stock

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Problanco Electronics

Mexico . 5,354 parts In-Stock

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Kepictronics

USA . 4,263 parts In-Stock

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TANS Electronics

Latvia . 2,422 parts In-Stock

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Perfect Parts

USA . 1,763 parts In-Stock

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SupplyDigital Components

Austria . 1,477 parts In-Stock

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UHIMA Technologies

Türkiye . 881 parts In-Stock

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Futuretech Components

Singapore . 503 parts In-Stock

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Overview

Enhance your electronic designs with the NTTFS3A08PZTWG by Onsemi, a top-quality P-CHANNEL Small Signal Field Effect Transistor. Manufactured by industry leader Onsemi, this single configuration FET offers a maximum drain current of 22 A and maximum power dissipation of 4.9 W. Ideal for a wide range of applications, this surface-mount transistor is built to deliver exceptional performance in demanding conditions. Upgrade your projects with the reliability and efficiency of the NTTFS3A08PZTWG and experience the difference that Onsemi's cutting-edge technology can bring to your designs.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-CHANNEL transistors are known for their high input impedance and low input capacitance, making them ideal for use in low-power applications.

Configuration: SINGLE

Single configuration transistors are easy to use and suitable for simple circuit designs, making them a good choice for applications where space and complexity are a concern.

Surface Mount: YES

Surface mount transistors are convenient for automated assembly processes, reducing production costs and allowing for higher component density on circuit boards.

Maximum Drain Current (Abs) (ID): 22 A

With a high maximum drain current, this transistor can handle large loads and is suitable for applications requiring high-power amplification.

Maximum Power Dissipation (Abs): 4.9 W

The high maximum power dissipation allows for efficient operation under heavy loads, reducing the risk of overheating and improving overall reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance characteristics such as high input impedance and low noise, making it suitable for a wide range of signal processing applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures and is suitable for use in demanding environmental conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable electrical connections and longevity in use.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature allows for quick and effective soldering processes, reducing the risk of heat-induced damage to the transistor.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this transistor can withstand the rigors of soldering processes without compromising its performance or reliability.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTTFS3A08PZTWG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTTFS3A08PZTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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