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NTTFS3A08PZTAG

Onsemi

NTTFS3A08PZTAG by Onsemi

NTTFS3A08PZTAG by Onsemi is a P-CHANNEL FET with 22A max drain current and 4.9W power dissipation. Ideal for applications requiring high power handling in surface mount configurations, such as automotive electronics and power management systems.

Median Price

$0.699

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 41 parts In-Stock

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$4.210

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41

$4.210

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Rochester

USA . 9,000 parts In-Stock

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-

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$0.674

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$0.559

10k+ parts

$0.499

9,000

-

$0.674

$0.559

$0.499

Verical

USA . 9,000 parts In-Stock

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$0.699

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$0.623

9,000

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-

$0.699

$0.623

Distributors (In-Stock)

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Digiode

USA . 170 parts In-Stock

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$0.633

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170

$0.633

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Chip Stock

USA . 68,000 parts In-Stock

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68,000

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Vyrian

USA . 4,436 parts In-Stock

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4,436

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Contempo Components LLC

USA . 1,012 parts In-Stock

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1,012

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Flip Electronics

USA . 450 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 354 parts In-Stock

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354

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Distributors (Availability)

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Corphita

USA . 2,181 parts In-Stock

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$0.599

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$0.599

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Corohmni

South Africa . 174 parts In-Stock

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$0.666

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174

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AZTECH Wire

Italy . 1,110 parts In-Stock

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$20.860

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Perfect Parts

USA . 120,930 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,159 parts In-Stock

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Kepictronics

USA . 8,000 parts In-Stock

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Kulean Microsystems

USA . 7,232 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,947 parts In-Stock

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Problanco Electronics

Mexico . 6,937 parts In-Stock

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TANS Electronics

Latvia . 5,841 parts In-Stock

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SupplyDigital Components

Austria . 5,462 parts In-Stock

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UHIMA Technologies

Türkiye . 892 parts In-Stock

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Authorized Procurement Solutions

USA . 441 parts In-Stock

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441

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GreenTree Electronics

Israel . 441 parts In-Stock

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Metaverse IC Inc.

Canada . 325 parts In-Stock

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Overview

Discover the NTTFS3A08PZTAG by Onsemi, a top-of-the-line P-CHANNEL Small Signal Field Effect Transistor designed for high-performance applications. With a maximum drain current of 22 A and maximum power dissipation of 4.9 W, this FET offers unparalleled efficiency and reliability. Onsemi's cutting-edge METAL-OXIDE SEMICONDUCTOR technology ensures superior quality and durability. Whether you're in the automotive, industrial, or consumer electronics industry, this versatile component is guaranteed to elevate your product performance. Experience the value and benefits that Onsemi's NTTFS3A08PZTAG brings to your designs today!

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-CHANNEL type transistors are known for their low on-state resistance, making them ideal for controlling high current loads.

Configuration: SINGLE

The single configuration simplifies the design and reduces the complexity of circuit layout.

Surface Mount: YES

Surface mount technology allows for compact and efficient circuit designs, saving space on the PCB.

Maximum Drain Current (Abs) (ID): 22 A

With a high maximum drain current rating of 22 A, this transistor can handle large current loads with ease.

Maximum Power Dissipation (Abs): 4.9 W

The high power dissipation rating of 4.9 W ensures reliable operation under high load conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer low gate capacitance, high input impedance, and good high-frequency performance.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand elevated temperature environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature allows for proper soldering without damaging the component.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C ensures proper melting and reflow of solder during assembly.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTTFS3A08PZTAG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTTFS3A08PZTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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