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CPH3360-TL-H

Onsemi

CPH3360-TL-H by Onsemi

CPH3360-TL-H by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 1.6A Drain Current, 0.303 ohm On Resistance, and 150 °C Operating Temperature. Package: PLASTIC/EPOXY, GULL WING terminals in SMALL OUTLINE style.

Median Price

$0.159

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 204,675 parts In-Stock

1+ parts

-

100+ parts

$0.159

1k+ parts

$0.132

10k+ parts

$0.117

204,675

-

$0.159

$0.132

$0.117

DigiKey

USA . 204,675 parts In-Stock

1+ parts

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$0.200

204,675

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$0.200

Verical

USA . 204,675 parts In-Stock

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$0.147

204,675

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$0.147

Distributors (In-Stock)

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Digiode

USA . 2,328 parts In-Stock

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$0.124

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2,328

$0.124

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Bristol Electronics

USA . 2,800 parts In-Stock

1+ parts

$0.750

100+ parts

$0.375

1k+ parts

$0.150

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2,800

$0.750

$0.375

$0.150

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Vyrian

USA . 12,801 parts In-Stock

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Chip Stock

USA . 3,408 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,800 parts In-Stock

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2,800

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Dan-Mar Components

USA . 2,800 parts In-Stock

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2,800

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Distributors (Availability)

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Corphita

USA . 1,051 parts In-Stock

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$0.117

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$0.117

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Corohmni

South Africa . 299 parts In-Stock

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$0.130

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299

$0.130

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Native Components

USA . 924 parts In-Stock

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$14.769

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924

$14.769

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AZTECH Wire

Italy . 414 parts In-Stock

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$15.510

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414

$15.510

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Northwest PG Solutions

USA . 2,032 parts In-Stock

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$16.246

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$14.622

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$16.246

$14.622

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Continental Prestige Electronics

USA . 204,675 parts In-Stock

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$0.119

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Kepictronics

USA . 85,400 parts In-Stock

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Perfect Parts

USA . 6,579 parts In-Stock

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Problanco Electronics

Mexico . 6,239 parts In-Stock

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TANS Electronics

Latvia . 4,157 parts In-Stock

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Kulean Microsystems

USA . 3,597 parts In-Stock

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3,597

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SupplyDigital Components

Austria . 1,385 parts In-Stock

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UHIMA Technologies

Türkiye . 288 parts In-Stock

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Overview

Enhance your electronic projects with the CPH3360-TL-H by Onsemi, a high-quality P-CHANNEL small signal FET with a built-in diode for switching applications. Manufactured by Onsemi, a trusted name in semiconductor technology, this FET offers reliable performance and efficient operation. Its compact design and surface-mount capability make it ideal for space-constrained applications. Experience the benefits of enhanced mode operation, high power dissipation, and a low drain-source on resistance of 0.303 ohm. Upgrade your designs with the CPH3360-TL-H and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, ensuring reliability and longevity.

Polarity or Channel Type: P-CHANNEL

Suitable for applications requiring P-channel transistors, offers flexibility in circuit design.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient configuration with a built-in diode for specific applications, simplifying circuit design.

Transistor Application: SWITCHING

Designed for switching applications, provides fast response and efficient performance.

Surface Mount: YES

Ease of installation and space-saving design for surface mount applications.

Minimum DS Breakdown Voltage: 30 V

Supports higher voltage requirements, suitable for a variety of applications.

Package Shape: RECTANGULAR

Compact and space-efficient package shape for easy integration into circuits.

Terminal Form: GULL WING

Allows for convenient soldering and mounting of the transistor.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the switching operation.

Maximum Drain Current (Abs) (ID): 1.6 A

High drain current rating for handling heavy loads and high-power applications.

No. of Terminals: 3

Simple and straightforward connection with three terminals.

Maximum Power Dissipation (Abs): 0.9 W

Efficient power dissipation capability for reliable performance under load.

Package Style (Meter): SMALL OUTLINE

Compact and efficient small outline package style for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Uses MOSFET technology for improved performance and efficiency.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance.

Transistor Element Material: SILICON

Uses silicon material for reliable and stable transistor operation.

Terminal Finish: Tin/Bismuth (Sn/Bi)

Durable terminal finish for secure connections and longevity.

Maximum Drain-Source On Resistance: 0.303 ohm

Low on-resistance for efficient power handling and minimal voltage drop.

Terminal Position: DUAL

Dual terminal position for flexible installation and connection options.

Technical Specifications

Small Signal Field Effect Transistors (FET) CPH3360-TL-H attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

1.6 A

Maximum Drain Current (ID):

1.6 A

Maximum Drain-Source On Resistance:

.303 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CPH3360-TL-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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