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CPH3350-TL-W

Onsemi

CPH3350-TL-W by Onsemi

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Transistor Element Material: SILICON; Terminal Form: GULL WING;

Median Price

$0.160

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 80,048 parts In-Stock

1+ parts

-

100+ parts

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$0.160

80,048

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-

$0.160

Rochester

USA . 71,423 parts In-Stock

1+ parts

-

100+ parts

$0.130

1k+ parts

$0.107

10k+ parts

$0.096

71,423

-

$0.130

$0.107

$0.096

Verical

USA . 71,423 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.173

71,423

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-

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$0.173

Flip Electronics (Authorized)

USA . 1,580 parts In-Stock

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-

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1,580

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Distributors (In-Stock)

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Digiode

USA . 1,473 parts In-Stock

1+ parts

$0.095

100+ parts

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1,473

$0.095

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-

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Vyrian

USA . 695 parts In-Stock

1+ parts

$0.100

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695

$0.100

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Nova Conductors

Japan . 97 parts In-Stock

1+ parts

$0.216

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97

$0.216

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Chip Stock

USA . 59,000 parts In-Stock

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59,000

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Flip Electronics

USA . 1,580 parts In-Stock

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1,580

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Distributors (Availability)

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Corphita

USA . 698 parts In-Stock

1+ parts

$0.090

100+ parts

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698

$0.090

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Corohmni

South Africa . 128 parts In-Stock

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$0.100

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128

$0.100

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Component Stockers USA

USA . 198,961 parts In-Stock

1+ parts

$0.160

100+ parts

$0.140

1k+ parts

$0.130

10k+ parts

$0.130

198,961

$0.160

$0.140

$0.130

$0.130

Native Components

USA . 268 parts In-Stock

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$0.234

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$0.225

268

$0.234

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$0.225

Northwest PG Solutions

USA . 1,221 parts In-Stock

1+ parts

$0.257

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$0.227

1,221

$0.257

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$0.227

Continental Prestige Electronics

USA . 273,473 parts In-Stock

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$0.141

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273,473

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$0.141

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RC Electronics

USA . 89,410 parts In-Stock

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Perfect Parts

USA . 40,936 parts In-Stock

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Kepictronics

USA . 37,849 parts In-Stock

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37,849

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TANS Electronics

Latvia . 7,072 parts In-Stock

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7,072

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SupplyDigital Components

Austria . 6,557 parts In-Stock

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6,557

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Problanco Electronics

Mexico . 4,080 parts In-Stock

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4,080

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Kulean Microsystems

USA . 3,009 parts In-Stock

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3,009

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Authorized Procurement Solutions

USA . 1,395 parts In-Stock

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1,395

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UHIMA Technologies

Türkiye . 490 parts In-Stock

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490

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Technical Specifications

Small Signal Field Effect Transistors (FET) CPH3350-TL-W attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

.083 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CPH3350-TL-W Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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