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NDC7002N

Onsemi

NDC7002N by Onsemi

NDC7002N by Onsemi is a small signal FET with N-CHANNEL polarity, suitable for switching applications. It features 2 elements with built-in diode, max drain current of 0.51A, and max power dissipation of 0.96W. With a min operating temperature of -55°C and max operating temperature of 150°C, it offers reliable performance in various environments.

Median Price

$0.176

Lifecycle Status

Suppliers In-Stock

47

In-Stock Inventory

1k+

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Newark

USA . 3 parts In-Stock

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$0.042

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$0.042

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Adafruit Industries

USA . 200 parts In-Stock

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$0.183

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$0.174

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DigiKey

USA . 4,590 parts In-Stock

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$0.420

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$0.224

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$0.189

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4,590

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$0.172

Mouser Electronics

USA . 32,684 parts In-Stock

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Chip1Stop

Japan . 159,000 parts In-Stock

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Farnell

UK . 85,555 parts In-Stock

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Element14

Singapore . 58,683 parts In-Stock

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Avnet

USA . 48,000 parts In-Stock

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Canada . 45,000 parts In-Stock

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Master Electronics

USA . 17,820 parts In-Stock

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Verical

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RS (Exports)

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Rochester

USA . 1,851 parts In-Stock

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Distributors (In-Stock)

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Voyager Components

USA . 84 parts In-Stock

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Digiode

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Nova Conductors

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Component Electronics Inc.

Canada . 3,448 parts In-Stock

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TME

Poland . 324 parts In-Stock

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Maritex

Poland . 1,723 parts In-Stock

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IBS Electronics

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NAC Semi

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LIBRA Elektronik GmbH

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Singapore . 83,829 parts In-Stock

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India . 78,199 parts In-Stock

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Corohmni

South Africa . 228 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Advanced Electronics

New Zealand . 200 parts In-Stock

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Component Stockers USA

USA . 83,102 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,507 parts In-Stock

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Perfect Parts

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USA . 53,333 parts In-Stock

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GreenTree Electronics

Israel . 45,444 parts In-Stock

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iodParts Technologies Inc.

India . 34,435 parts In-Stock

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Brazil . 12,870 parts In-Stock

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Lucentia Tech

USA . 12,870 parts In-Stock

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Authorized Procurement Solutions

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Türkiye . 248 parts In-Stock

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Overview

Enhance your electronic devices with the NDC7002N by Onsemi, a high-quality Small Signal Field Effect Transistor (FET) that offers unparalleled performance and reliability. Manufactured by industry leader Onsemi, this N-CHANNEL transistor is ideal for switching applications, featuring a separate configuration with built-in diode elements. With a maximum drain current of 0.51 A and a minimum DS breakdown voltage of 50 V, this transistor is designed to deliver optimal efficiency and power dissipation, making it a valuable addition to any project. Upgrade your electronics with the NDC7002N and experience the benefits of superior technology and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and mechanical protection, making the transistor durable and reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-resistance and higher mobility, making them more efficient for switching applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for versatile circuit design options and the built-in diode provides protection against reverse voltage.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-resistance.

Surface Mount: YES

Surface mount technology enables easy and compact PCB assembly, saving space and improving overall efficiency.

Minimum DS Breakdown Voltage: 50 V

With a breakdown voltage of 50V, this FET can handle higher voltages without breakdown or damage.

Maximum Drain Current (Abs) (ID): 0.51 A

With a maximum drain current of 0.51A, this FET can handle moderate current loads efficiently.

Maximum Power Dissipation (Abs): 0.96 W

The high power dissipation capability of 0.96W ensures reliable operation without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds, low power consumption, and excellent performance in various applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand high temperatures, making it suitable for demanding environments.

Technical Specifications

Small Signal Field Effect Transistors (FET) NDC7002N attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

50 V

Maximum Drain Current (Abs) (ID):

.51 A

Maximum Drain Current (ID):

.51 A

Maximum Drain-Source On Resistance:

2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

1.4 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NDC7002N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

NSN

5961-01-610-8691, 5961016108691

NIIN

016108691

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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